Abstract: A socket may be formed with socket pins that include two spring biased arms biased to extend away from one another. The arms may be provided with tapered upper surfaces that engage contact holes on a pin guide 18 of an integrated circuit package, camming the socket pin arms together. The pin guide may have a tapered via structure that expands as it extends into the package. Thus, as the spring arms spread apart inside the pin guide, they may rotate through an angle which causes contacting surfaces on the spring arms and the pin guide to be parallel, creating good surface contact.

Abstract: A contact-less high-speed signaling interface and method provide for the communication of high-speed signals across an interface, such as a die-substrate interface or die-die interface. The interface includes a transmission-line structure disposed on a dielectric medium to carry a high-speed forward incident signal, and another transmission-line structure disposed on another dielectric medium and substantially aligned with the other transmission-line structure to generate a coupled high-speed signal in a direction opposite to the incident signal.

Abstract: According to some embodiments, an integrated high-quality printed circuit board is provided. For example, a first integrated circuit device may be mounted on both a first printed circuit board and a second printed circuit board (e.g., a polyimide film having better dielectric characteristics as compared to the first board). A second integrated circuit device may be located remote from the first integrated circuit device and may also be mounted on both the first and second boards.

Abstract: A method for making, and a dielectric material is provided. A capacitor is provided that includes a lossy dielectric layer that is also not leaky. The lossy behavior dampens unwanted oscillations in power supplies or other electrical systems. A capacitor is further provided is tunable for an amount of lossy behavior over a broad range. A core dopant concentration can be varied, and a doped core grain fraction can be varied to control the extent of a desired lossy property in a capacitor. Dielectric materials having grains with doped shells reduce leakiness. Additionally in selected embodiments, undoped core grains mixed with doped core grains reduce leakiness.

Abstract: A contact-less high-speed signaling interface and method provide for the communication of high-speed signals across an interface, such as a die-substrate interface or die-die interface. The interface includes a transmission-line structure disposed on a dielectric medium to carry a high-speed forward incident signal, and another transmission-line structure disposed on another dielectric medium and substantially aligned with the other transmission-line structure to generate a coupled high-speed signal in a direction opposite to the incident signal.