Abstract: Aspects of the subject technology relate to systems, methods, and computer-readable media for image classification through a two-stage classifier. Raw image data of an image gathered by a sensor associated with an AV during operation of the AV is accessed. A first stage of a two-stage classifier is applied. The first stage is trained by first raw AV data captured at varying values of one or more capture parameters associated with one or more sensors of the AV in capturing the first raw AV data. A second stage of the two-stage classifier is applied to the raw image data to generate a final classification output. The second stage of the two-stage classifier if formed by a plurality of image calibration classifiers that are trained by second raw AV data at varying values of one or more image calibration parameters.

Abstract: Provided by the inventive concept are methods for fabricating semiconductor devices, such as methods of atomic layer deposition (ALD). Aspects of the inventive concept include methods for depositing and forming Ru metal layers having low resistivity, forming Ru metal layers without the need for a post-deposition annealing step, forming Ru metal layers selectively on portions of a substrate without the need for passivation, and providing Ru metal layers for use in back end of the line (BEOL) applications in semiconductor devices that do not require a liner/barrier layer.

Abstract: Methods of bonding and structures with such bonding are disclosed. One such method includes providing a first substrate with a first electrical contact; providing a second substrate with a second electrical contact above the first electrical contact, wherein an upper surface of the first electrical contact is spaced apart from a lower surface of the second electrical contact by a gap; and depositing a layer of selective metal on the lower surface of the second electrical contact and on the upper surface of the first electrical contact by a thermal Atomic Layer Deposition (ALD) process until the gap is filled to create a bond between the first electrical contact and the second electrical contact.

Abstract: Methods of bonding and structures with such bonding are disclosed. One such method includes providing a first substrate with a first electrical contact; providing a second substrate with a second electrical contact above the first electrical contact, wherein an upper surface of the first electrical contact is spaced apart from a lower surface of the second electrical contact by a gap; and depositing a layer of selective metal on the lower surface of the second electrical contact and on the upper surface of the first electrical contact by a thermal Atomic Layer Deposition (ALD) process until the gap is filled to create a bond between the first electrical contact and the second electrical contact.

Abstract: Aspects of the subject technology relate to systems, methods, and computer-readable media for image classification through a two-stage classifier. Raw image data of an image gathered by a sensor associated with an AV during operation of the AV is accessed. A first stage of a two-stage classifier is applied. The first stage is trained by first raw AV data captured at varying values of one or more capture parameters associated with one or more sensors of the AV in capturing the first raw AV data. A second stage of the two-stage classifier is applied to the raw image data to generate a final classification output. The second stage of the two-stage classifier if formed by a plurality of image calibration classifiers that are trained by second raw AV data at varying values of one or more image calibration parameters.

Abstract: Methods and systems are provided for providing secure Ethernet transmissions. In some aspects, an autonomous vehicle system is provided and can include a first system-on-chip being configured to provide data to a second system-on-chip via an Ethernet harness, a first switch being configured to: receive the data from the first system-on-chip, and provide the data to a first transceiver for transmission to the second system-on-chip, the first switch being configured to provide first transmission data to the first transceiver and to prohibit receipt of retrieval data from the second system-on-chip, and the first transceiver configured to communicate with the second system-on-chip via the Ethernet harness.

Abstract: Described are low resistivity metal layers/films, such as low resistivity ruthenium (Ru) layers/films, and methods of forming low resistivity metal films. Ru layers/films with close-to-bulk resistivity can be prepared on substrates using Ru(CpEt)2 + O2 ALD, as well as a two-step ALD process using Ru(DMBD)(CO)3 + TBA (tertiary butyl amine) to nucleate the substrate and Ru(EtCp)2 + O2 to increase layer/film thickness. The Ru layer/films and methods of preparing Ru layers/films described herein may be suitable for use in barrierless via-fills, as well as at M0/M1 interconnect layers.

Abstract: Methods and systems are provided for providing secure Ethernet transmissions. In some aspects, an autonomous vehicle system is provided and can include a first system-on-chip being configured to provide data to a second system-on-chip via an Ethernet harness, a first switch being configured to: receive the data from the first system-on-chip, and provide the data to a first transceiver for transmission to the second system-on-chip, the first switch being configured to provide first transmission data to the first transceiver and to prohibit receipt of retrieval data from the second system-on-chip, and the first transceiver configured to communicate with the second system-on-chip via the Ethernet harness.

Abstract: The present disclosure relates to an integrated boost modular multilevel converter, which has particular, but not sole, relevance to a converter for an inductive or capacitive (wireless) power transfer system. More particularly, the present invention according to an embodiment discloses a modular multilevel power converter (MMPC) comprising: at least one submodule stack having an output for connection to a load and an input for connection to an input power source, at least one inductive element provided between the input and the output, the at least one submodule stack including at least two submodules, each submodule comprising at least one capacitor and a plurality of controllable switches, and the submodules being operable to selectively transfer energy from the at least one inductive element to boost a voltage at the output relative to a voltage at the input.

Abstract: Methods and systems are provided for providing secure Ethernet transmissions. In some aspects, an autonomous vehicle system is provided and can include a first system-on-chip being configured to provide data to a second system-on-chip via an Ethernet harness, a first switch being configured to: receive the data from the first system-on-chip, and provide the data to a first transceiver for transmission to the second system-on-chip, the first switch being configured to provide first transmission data to the first transceiver and to prohibit receipt of retrieval data from the second system-on-chip, and the first transceiver configured to communicate with the second system-on-chip via the Ethernet harness.

Abstract: Methods and systems are provided for providing secure Ethernet transmissions. In some aspects, an autonomous vehicle system is provided and can include a first system-on-chip being configured to provide data to a second system-on-chip via an Ethernet harness, a first switch being configured to: receive the data from the first system-on-chip, and provide the data to a first transceiver for transmission to the second system-on-chip, the first switch being configured to provide first transmission data to the first transceiver and to prohibit receipt of retrieval data from the second system-on-chip, and the first transceiver configured to communicate with the second system-on-chip via the Ethernet harness.

Abstract: Provided by the inventive concept are methods for fabricating semiconductor devices, such as methods of atomic layer deposition (ALD). Aspects of the inventive concept include methods for depositing and forming Ru metal layers having low resistivity, forming Ru metal layers without the need for a post-deposition annealing step, forming Ru metal layers selectively on portions of a substrate without the need for passivation, and providing Ru metal layers for use in back end of the line (BEOL) applications in semiconductor devices that do not require a liner/barrier layer.

Abstract: Methods of bonding and structures with such bonding are disclosed. One such method includes providing a first substrate with a first electrical contact; providing a second substrate with a second electrical contact above the first electrical contact, wherein an upper surface of the first electrical contact is spaced apart from a lower surface of the second electrical contact by a gap; and depositing a layer of selective metal on the lower surface of the second electrical contact and on the upper surface of the first electrical contact by a thermal Atomic Layer Deposition (ALD) process until the gap is filled to create a bond between the first electrical contact and the second electrical contact.

Abstract: The method can include: sampling measurements of a vehicle in-situ, generating a model based on the measurements, and determining a wash path based on the model. The method can optionally include washing the vehicle according to the wash path.

Abstract: The present disclosure relates to an integrated boost modular multilevel converter, which has particular, but not sole, relevance to a converter for an inductive or capacitive (wireless) power transfer system. More particularly, the present invention according to an embodiment discloses a modular multilevel power converter (MMPC) comprising: at least one submodule stack having an output for connection to a load and an input for connection to an input power source, at least one inductive element provided between the input and the output, the at least one submodule stack including at least two submodules, each submodule comprising at least one capacitor and a plurality of controllable switches, and the submodules being operable to selectively transfer energy from the at least one inductive element to boost a voltage at the output relative to a voltage at the input.

Abstract: A cloud service stores and aggregates content that is obtained from different content sources using different protocols. For example, the content may include electronic messages, calendar information, contacts, social network content, feed data, search results, and the like. The cloud service aggregates content for each user based on the user's configuration settings. The cloud service may perform processing on the aggregated content before it is delivered and displayed to the user on the client device. For example, one or more views may be generated and stored by the cloud service before the view is requested from the client. Changes made to the aggregated content on the client may be synchronized with the content source. Searches may be made across all or a portion of the different content sources that are aggregated for a user.

Abstract: An automated/robotic car wash system is disclosed that is able to autonomously wash and dry a vehicle using steam and/or high-pressure water. High-pressure water, steam, and/or pressurized air outputs are mounted to a tool head, which is in turn mounted to the end of a multi-axis robotic gantry system wash that maneuvers around the surface of the vehicle. Also provided are vehicle washing processes that automatically controls the movement and operation of the system, through an automatic main controller that generates and analyzes input data in the form of a movement program, a safety program, a user entry program, a toolpath program, and/or a utilities management program.

Abstract: A communication device such as a cellphone or tablet may be configured to allow individual components to be selectively disabled, using for example, airgap switches. When the component is re-enabled a security check is performed to confirm that the component was not altered prior to continuing full operation of the device. The security check may include running a checksum over the component's firmware, comparing a hash of the firmware to an expected value, and checking a digital signature of the firmware.

Abstract: A cellular communication device uses manually operated airgap switches that selectively enable or disable various functions of the communication device. The airgap switches physically disconnect conductors associated with power or signal transmission so that the operator is assured that the disabled function is not vulnerable to software-based intrusions. The various functions may include GPS, NFC, Bluetooth, WiFi, and cellular wireless devices. The functions may also include transducers such as a camera or microphone. In other cases, the disabled functions may include sensors such as an accelerometer, gyroscope, or compass that may be used to create a dead-reckoning trail.

Abstract: An automated/robotic car wash system is disclosed that is able to autonomously wash and dry a vehicle using steam and/or high-pressure water. High-pressure water, steam, and/or pressurized air outputs are mounted to a tool head, which is in turn mounted to the end of a multi-axis robotic gantry system wash that maneuvers around the surface of the vehicle. Also provided are vehicle washing processes that automatically controls the movement and operation of the system, through an automatic main controller that generates and analyzes input data in the form of a movement program, a safety program, a user entry program, a toolpath program, and/or a utilities management program.