Abstract: A light emitting diode (LED) module is provided that includes a base and a cover. Circuitry is provided on the base. An LED array is provided on the base and is coupled to the circuitry, which in an embodiment may convert AC line voltage to DC voltage. The LED module can be configured to take up minimal space while providing desirable light output.

Abstract: An illumination system may include a receiver which is mounted on a support surface, such as a heat sink, and a light module that may include a cover and an LED assembly. The LED assembly is rotateably attached to the cover and seats within the receiver. The receiver may have touch-safe terminals attached thereto for providing power to the LED assembly. The LED assembly may include a cup which enables potting material to be easily included in the assembly during manufacturing. When the LED assembly is attached to the receiver, blades on the LED assembly mate with the terminals on the receiver.

Abstract: An LED array is thermally coupled to a heat spreader and a heat sink. The heat sink has a base and a plurality of fins extending from the base. Each fin includes a lower portion which extends outwardly from the base and downwardly from the heat spreader, and an upper portion that extends upwardly from the base and is offset from the lower portion so as to form a junction. An aperture may be provided through each junction to allow air to pass therethrough. The heat spreader may also have fins.

Abstract: A holder assembly includes a cover and a frame that together can support a first and second terminal that can each include a two-way wire trap feature. The terminals can be configured with contacts that are configured to engage pads on a corresponding LED array. One or both of the terminals can also omit the contact and can be mounted so as to be in electrical contact with traces provided on the frame and the traces can be electrically connected to the anode and cathode of the LED array. The frame can further support circuitry that is configured to convert AC to DC.

Abstract: A light module system includes a receptacle, which may be mounted on a support surface, such as a heat sink, and further includes a cover and an LED assembly rotatably coupled to the cover. The LED assembly seats within the receptacle which causes terminals of the LED assembly to align with contacts on the receptacle. One of the cover and the receptacle has a plurality of ramps and the other has a plurality of shoulders. The cover can be rotated relative to the receptacle to cause the shoulders to slide relative to the ramps so as to direct the LED assembly into the receptacle. When the LED assembly is attached to the receptacle, the terminals on the LED assembly mate with the contacts on the receptacle.

Abstract: An illumination module is provided that can be inserted into a receptacle with a ramp that includes a wall and may be mounted on a support surface, such as a heat sink, and the illumination module include a cover and an LED assembly rotateably coupled to the cover. The LED assembly seats within the receptacle which causes terminals of the LED assembly to align with contacts on the receptacle. Circuitry is provided in the module that accepts an input voltage and converts the input to a desired driving output. The cover can be rotated relative to the receptacle so as to engage ramps so as to direct the LED assembly into the receptacle. When the LED assembly is attached to the receptacle, the terminals on the LED assembly mate with the contacts on the receptacle.

Abstract: A connector is provided for mounting a module to a printed circuit board. The connector includes a housing having end walls defining a slot for receiving a module. Terminals are mounted within the housing on either side of the slot. Each terminal includes a tail. A solder mass is attached to each tail and is used to bond the connector to the printed circuit board. The solder mass is attached to each tail without the use of a reflow process. The solder mass can be attached to the tail of the terminal either through a mechanical attachment or through bonding. A reflow process is then used to attach the connector to the printed circuit board.

Abstract: A light emitting diode (LED) module is provided that includes a base and a cover. Circuitry is provided on the base. An LED array is provided on the base and is coupled to the circuitry, which in an embodiment may convert AC line voltage to DC voltage. The LED module can be configured to take up minimal space while providing desirable light output.

Abstract: An illumination module is provided that can be inserted into a receptacle that includes a wall and may be mounted on a support surface, such as a heat sink, and the illumination module include a cover and an LED assembly rotateably coupled to the cover. The LED assembly seats within the receptacle which causes terminals of the LED assembly to align with contacts on the receptacle. One of the cover and the receptacle can have a plurality of ramps and the other a plurality of shoulders. The cover can be rotated relative to the receptacle to cause the shoulders to slide relative to the ramps so as to direct the LED assembly into the receptacle. When the LED assembly is attached to the receptacle, the terminals on the LED assembly mate with the contacts on the receptacle.

Abstract: An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.

Abstract: An interconnect device is used to mate a heat generating device to a power source. Plated components are provided on the interconnect device to provide a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device, and to provide an electrical path between the heat generating device and the power source. A method of manufacturing same is also disclosed.

Abstract: A connector assembly of complex shape has a connector body with possesses a plurality of distinct surfaces both parallel and intersecting. Laser directed structuring is used to form patterns of conductive traces on the surfaces of the connector body and raised ribs are formed along the traces and interposed between them to form channels that encompass at least portions of the traces. The raised ribs increase the time in which plating solution can dwell over the laser excited areas and also form abrasion barriers to prevent abrasion for the conductive traces during the plating thereof.

Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.

Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.

Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.

Abstract: A connector assembly of complex shape has a connector body with possesses a plurality of distinct surfaces both parallel and intersecting. Laser directed structuring is used to form patterns of conductive traces on the surfaces of the connector body and raised ribs are formed along the traces and interposed between them to form channels that encompass at least portions of the traces. The raised ribs increase the time in which plating solution can dwell over the laser excited areas and also form abrasion barriers to prevent abrasion for the conductive traces during the plating thereof.

Abstract: An assembly (118) is provided for mating a sensor (22) to a connector (24). The assembly includes an interconnect device (20, 120) and a housing (174a-174b). The interconnect device has conductive pathways (40, 154) provided thereon. The sensor is mounted on the interconnect device and is in electrical communication with the conductive pathways. The housing generally surrounds a portion of said interconnect device. The housing is formed of two portions which mate together. At least one flow tube (178) is attached to the housing. A gasket seals the sensor to the housing.

Abstract: An interconnect device is used to mate a heat generating device to a power source. Plated components are provided on the interconnect device to provide a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device, and to provide an electrical path between the heat generating device and the power source. A method of manufacturing same is also disclosed.

Abstract: An interconnect device is used to mate a heat generating device to a power source. Plated components are provided on the interconnect device to provide a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device, and to provide an electrical path between the heat generating device and the power source. A method of manufacturing same is also disclosed.

Abstract: A molded interconnect device with a high-current trace and methods of making a molded interconnect device with a high-current trace are described. The molded interconnect device comprises a substrate surface and an interconnect pattern. The interconnect pattern is at least one of a rib raised from the substrate surface and a channel protruding into the substrate surface. In a first embodiment, the molded interconnect device is molded from photosensitive plastic molded in a one-shot molding process. A trace is grown on the portion of the interconnect pattern where an interconnect path has been written, either by a laser or by photolithography. In a second embodiment, the molded interconnect device is molded of plastic and the trace is grown by at least one of a mask and print-and-plate process and a mask and print-and-etch process. The trace forms at least one of an angle and a curve in cross section.