Patents by Inventor Victor Zaderej

Victor Zaderej has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080310167
    Abstract: An interconnect device is used to mate a heat generating device to a power source. Plated components are provided on the interconnect device to provide a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device, and to provide an electrical path between the heat generating device and the power source. A method of manufacturing same is also disclosed.
    Type: Application
    Filed: May 23, 2008
    Publication date: December 18, 2008
    Inventors: VICTOR ZADEREJ, KEVIN O'CONNOR, CHARLIE MANLAPAZ, TIMOTHY HAGAN, SAMUEL C. RAMEY
  • Publication number: 20080307646
    Abstract: An interconnect device is used to mate a heat generating device to a power source. Plated components are provided on the interconnect device to provide a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device, and to provide an electrical path between the heat generating device and the power source. A method of manufacturing same is also disclosed.
    Type: Application
    Filed: May 23, 2008
    Publication date: December 18, 2008
    Inventors: Victor Zaderej, Kevin O'Connor, Charlie Manlapaz, Timothy Hagan, Samuel C. Ramey
  • Publication number: 20080171181
    Abstract: A molded interconnect device with a high-current trace and methods of making a molded interconnect device with a high-current trace are described. The molded interconnect device comprises a substrate surface and an interconnect pattern. The interconnect pattern is at least one of a rib raised from the substrate surface and a channel protruding into the substrate surface. In a first embodiment, the molded interconnect device is molded from photosensitive plastic molded in a one-shot molding process. A trace is grown on the portion of the interconnect pattern where an interconnect path has been written, either by a laser or by photolithography. In a second embodiment, the molded interconnect device is molded of plastic and the trace is grown by at least one of a mask and print-and-plate process and a mask and print-and-etch process. The trace forms at least one of an angle and a curve in cross section.
    Type: Application
    Filed: January 11, 2007
    Publication date: July 17, 2008
    Applicant: MOLEX INCORPORATED
    Inventor: Victor Zaderej
  • Patent number: 7394650
    Abstract: A hinge for an electronic device is provided. The electronic device has a first half and a second half. The hinge includes a rigid, multi-layer printed wiring board capable of being electrically coupled to the first half of the electronic device, and a flexible circuit electrically connected to the printed wiring board and capable of being electrically coupled to the second half of the electronic device. The printed wiring board is fixed relative to the first half. When the second half of the electronic device is moved relative to the first half, the flexible circuit winds and unwinds.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: July 1, 2008
    Assignee: Molex Incorporated
    Inventors: Victor Zaderej, Michael J. Neumann
  • Publication number: 20080102692
    Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.
    Type: Application
    Filed: May 17, 2007
    Publication date: May 1, 2008
    Inventors: Victor Zaderej, David L. Brunker, Phillip J. Dambach
  • Patent number: 7297005
    Abstract: A connector pedestal has a body which includes interior and exterior surfaces, upper and lower edges, and interface portion, and first and second sets of traces. The interface portion is provided proximate to the upper edge and is configured to be connected to a connector. The first set of traces extends along the interior surface from the upper edge to the lower edge and around the lower edge onto the exterior surface. The second set of traces extends along the exterior surface from the upper edge to the lower edge and around the lower edge onto the interior surface. The traces of the first and second sets proximate to the lower edge are configured to be connected to a circuit board.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: November 20, 2007
    Assignee: Molex Incorporated
    Inventor: Victor Zaderej
  • Patent number: 7273401
    Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.
    Type: Grant
    Filed: March 15, 2004
    Date of Patent: September 25, 2007
    Assignee: Molex Incorporated
    Inventors: Victor Zaderej, David L. Brunker, Phillip J. Dambach
  • Publication number: 20070188261
    Abstract: A transmission line for high-frequency differential signals and having a transforming impedance is formed into a substrate. The transmission line is comprised of a slot, the opposing surfaces of which carry a conductive surface capable of carrying electrical signals. The conductive surface on the opposing surfaces is gradually receded along a length of the slot. An equivalent amount of metallization is applied on the substrate's surface and electrically continuous with conductive surfaces on the slot's opposing sidewalls. The metallization on the substrate's surface provide solder lands. Dielectric in the slot prevents solder wicking.
    Type: Application
    Filed: December 21, 2006
    Publication date: August 16, 2007
    Inventors: David Brunker, Victor Zaderej
  • Publication number: 20070188257
    Abstract: An electro-magnetically shielded slot-transmission line is formed by metallizing the opposing sides of a slot cut through a dielectric substrate. A ground plane is deposited on the bottom of the substrate. Conductive vias through the substrate and that contact the ground plane are located on both sides of the metallized slot surfaces. Conductive pads on the upper surface and which contact the vias provide additional shielding.
    Type: Application
    Filed: December 21, 2006
    Publication date: August 16, 2007
    Inventors: David Brunker, Victor Zaderej
  • Patent number: 7214067
    Abstract: A hinge for an electronic device, such as a notebook computer, a personal digital assistant, a cellular telephone, a portable compact disc player and the like, includes a body member and at least one contact provided on the body member. Structure is provided for electrically connecting each contact to a first portion of the electronic device. Structure is also provided for connecting each contact to a second portion of the electronic device. The hinge can be repeatedly used without wear or rubbing action because the ends of the contacts always remain connected to the electrical components of the upper and lower portions of the electronic device. If damaged, only the hinge needs to be replaced and the connections to the electronic device reinstated.
    Type: Grant
    Filed: May 16, 2003
    Date of Patent: May 8, 2007
    Assignee: Molex Incorporated
    Inventor: Victor Zaderej
  • Patent number: 7189120
    Abstract: A connector includes a housing including terminals and isolating legs extending between the terminals. Vias extends through the housing to provide paths from upper and lower surfaces of the terminals. The terminals have upper portions, lower portions and via portions. The upper portions are formed on the upper surfaces of the housing, the lower portions are formed on the lower surfaces of the housing, and the via portions connect the upper portions to the lower portions. The housing is preferably formed in a two-shot molding process.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: March 13, 2007
    Assignee: Molex Incorporated
    Inventor: Victor Zaderej
  • Patent number: 7157987
    Abstract: A transmission line for high-frequency differential signals and having a transforming impedance is formed into a substrate. The transmission line is comprised of a first slot, the opposing surfaces of which carry a conductive surface capable of carrying electrical signals. By virtue of their dimensions, spacing and dielectric filler, the conductive surfaces constitute a transmission line. A second slot, also with opposing surfaces, each of which also carry a conductive surface but which are spaced differently than the opposing surfaces of the first slot, provide a second transmission line but with a different impedance. The impedances between the two transmission lines are transformed by an impedance transition section of transmission line that is slot section the dimensions of which are tapered to meet the different slot dimensions of the two different transmission line segments.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: January 2, 2007
    Assignee: Molex Incorporated
    Inventors: David L. Brunker, Victor Zaderej
  • Patent number: 7154355
    Abstract: A transmission line for high-frequency differential signals and having a transforming impedance is formed into a substrate. The transmission line is comprised of a slot, the opposing surfaces of which carry a conductive surface capable of carrying electrical signals. The conductive surface on the opposing surfaces is gradually receded along a length of the slot. An The transmission line of claim 1, further including a non-air dielectric filling the space between the opposing faces in said second length of said slot, said non-air dielectric having a thickness that extends from the depth D, to the bottom of the slot at the first end of said second length, the thickness of the non-air dielectric continuously increasing along said second length up to the substrate surface at the second end of the second length. equivalent amount of metallization is applied on the substrate's surface and electrically continuous with conductive surfaces on the slot's opposing sidewalls.
    Type: Grant
    Filed: December 24, 2004
    Date of Patent: December 26, 2006
    Assignee: Molex Incorporated
    Inventors: David L. Brunker, Victor Zaderej
  • Patent number: 7151420
    Abstract: An electro-magnetically shielded slot-transmission line is formed by metallizing the opposing sides of a slot cut through a dielectric substrate. A ground plane is deposited on the bottom of the substrate. Conductive vias through the substrate and that contact the ground plane are located on both sides of the metallized slot surfaces. Conductive pads on the upper surface and which contact the vias provide additional shielding.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: December 19, 2006
    Assignee: Molex Incorporated
    Inventors: David L. Brunker, Victor Zaderej
  • Publication number: 20060258228
    Abstract: A connector includes a housing including terminals and isolating legs extending between the terminals. Vias extends through the housing to provide paths from upper and lower surfaces of the terminals. The terminals have upper portions, lower portions and via portions. The upper portions are formed on the upper surfaces of the housing, the lower portions are formed on the lower surfaces of the housing, and the via portions connect the upper portions to the lower portions. The housing is preferably formed in a two-shot molding process.
    Type: Application
    Filed: May 16, 2005
    Publication date: November 16, 2006
    Inventor: Victor Zaderej
  • Patent number: 7018239
    Abstract: A shielded electrical connector is provided for mounting on a printed circuit board. The connector includes a dielectric housing having a plurality of terminal-receiving cavities and a plurality of board-engaging pads projecting from the bottom of the housing. A plurality of terminals are received in the cavities. Portions of the housing between the terminals are plated with conductive metal material to electrically shield the terminals from each other and to provide a controlled impedance. The plating is continuous onto the pads for connection to appropriate ground circuit means on the printed circuit board. In an alternative embodiment, a shielded electrical connector assembly includes a pair of connectors both of which have plated housings with interengaging plated portions.
    Type: Grant
    Filed: January 22, 2001
    Date of Patent: March 28, 2006
    Assignee: Molex Incorporated
    Inventors: Victor Zaderej, Kent E. Regnier, David E. Dunham, Kevin Alberts, David Brearley, Jr.
  • Publication number: 20060048340
    Abstract: A hinge for an electronic device, such as a notebook computer, a personal digital assistant, a cellular telephone, a portable compact disc player and the like, includes a body member and at least one contact provided on the body member. Structure is provided for electrically connecting each contact to a first portion of the electronic device. Structure is also provided for connecting each contact to a second portion of the electronic device. The hinge can be repeatedly used without wear or rubbing action because the ends of the contacts always remain connected to the electrical components of the upper and lower portions of the electronic device. If damaged, only the hinge needs to be replaced and the connections to the electronic device reinstated.
    Type: Application
    Filed: May 16, 2003
    Publication date: March 9, 2006
    Inventor: Victor Zaderej
  • Patent number: 7001193
    Abstract: A hinge for an electronic device includes a body and a contact member. The body includes a printed circuit board and a plurality of terminals extending therefrom. The contact member includes a plurality of contacts defining a contact passageway. The body is partially positioned within the contact passageway such that an electrical connection is provided between the terminals of the body and the contacts of the contact member. The contact member rotates relative to the body and electrical contact is maintained between the terminals and the contacts throughout this rotation.
    Type: Grant
    Filed: November 26, 2003
    Date of Patent: February 21, 2006
    Assignee: Molex Incorporated
    Inventors: Victor Zaderej, Kevin Delaney
  • Publication number: 20060002058
    Abstract: A hinge for an electronic device is provided. The electronic device has a first half and a second half. The hinge includes a rigid, multi-layer printed wiring board capable of being electrically coupled to the first half of the electronic device, and a flexible circuit electrically connected to the printed wiring board and capable of being electrically coupled to the second half of the electronic device. The printed wiring board is fixed relative to the first half. When the second half of the electronic device is moved relative to the first half, the flexible circuit winds and unwinds.
    Type: Application
    Filed: June 30, 2004
    Publication date: January 5, 2006
    Inventors: Victor Zaderej, Michael Neumann
  • Publication number: 20050176268
    Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.
    Type: Application
    Filed: March 15, 2004
    Publication date: August 11, 2005
    Inventors: Victor Zaderej, David Brunker, Phillip Dambach