Abstract: A sensing device is disclosed. The sensing device comprising a printed circuit board (PCB), a conductive port coupled to the PCB via a conductive adhesive and defining an orifice filled with a protective gel. Further, the sensing device comprises a sensing element disposed on the PCB within the conductive port and encased by the protective gel, and a conductive member disposed at least over the protective gel. The conductive member is configured to discharge static charges accumulated over the protective gel to the PCB via at least the conductive adhesive.

Abstract: Example embodiments described herein may include a housing for at least one sensing element defining an inclined and/or eccentric sensing column cavity. The sensing column cavity may be filled with a gel material for imparting force and/or pressure to a sensing element. In some embodiments, the sensing column cavity may have a first width at the end of the sensing column cavity proximate to a PCB. The sensing column cavity may have a second width at the end of the sensing column cavity proximate to a protective cap. The first width may be smaller than the second width, wherein the first width defines a diameter of a substantially circular profile of the sensing column cavity and the second width defines a major axis of a substantially elliptical profile of the sensing column cavity. The sensing column cavity may comprise one or more additional widths defining one or more additional profiles.

Abstract: A hermetically sealed sensing device is provided. The hermetically sealed sensing device may comprise a header defining one or more substantially cylindrical cavities, at least one terminal, and/or a sensing element. In some examples, the hermetically sealed sensing device comprises a silicon rubber stopper configured to provide, along with the at least one terminal, a hermetic seal in the one or more substantially cylindrical cavities. In some examples, the hermetically sealed sensing device comprises threaded grooves along the one or more substantially cylindrical cavities such that a sealing material (e.g., glass-fiber reinforced polyester composite material, epoxy-based potting material, silicon-based potting material, etc.) and the at least one terminal may form a hermetic seal therein.

Abstract: Example methods, apparatuses, and computer program products for measuring fluid volumes are provided. An example fluid volume measuring assembly includes a first perforated tube, a total fluid volume measuring device, and a non-blood fluid volume measuring device. In some examples, the total fluid volume measuring device includes a membrane sack positioned in the first perforated tube and a first pressure sensor positioned in the membrane sack. In some examples, the non-blood fluid volume measuring device includes a second perforated tube covered by a filter paper and positioned in the first perforated tube and a second pressure sensor positioned in the second perforated tube.

Abstract: Various embodiments are directed to a method for protecting an electronic comprising: depositing a first epoxy resin on the electronic component; curing the first epoxy resin to form a first cured epoxy layer, disposing a polyimide film on the first cured epoxy layer to form a polyimide layer, depositing a second epoxy resin on the polyimide layer, and curing the second epoxy resin to form a second cured epoxy layer. The first cured epoxy layer, the polyimide layer, and the second epoxy layer form a multi-layered protective coating that is configured at least in part to protect the electronic component from at least adverse effects from varying light intensities.

Abstract: Example methods, apparatuses, and computer program products for measuring fluid volumes are provided. An example fluid volume measuring assembly includes a first perforated tube, a total fluid volume measuring device, and a non-blood fluid volume measuring device. In some examples, the total fluid volume measuring device includes a membrane sack positioned in the first perforated tube and a first pressure sensor positioned in the membrane sack. In some examples, the non-blood fluid volume measuring device includes a second perforated tube covered by a filter paper and positioned in the first perforated tube and a second pressure sensor positioned in the second perforated tube.

Abstract: Example apparatuses and systems for a combined temperature and pressure sensing device with improved electronic protection are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.

Abstract: Example methods, apparatuses and systems for a combined temperature and pressure sensing device are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.

Abstract: Example apparatuses and systems for a combined temperature and pressure sensing device with improved electronic protection are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.

Abstract: Methods and apparatuses related to freeze resistant sensing assemblies are provided. An example pressure sensing assembly may include: a first member defining an aperture, the aperture comprising an inner opening disposed on an inner surface of the first member and an outer opening disposed on an outer surface of the first member; a protection diaphragm disposed on the inner surface of the first member; and a sensing diaphragm disposed in a second member fastened to the first member.

Abstract: Example methods, apparatuses and systems for a combined temperature and pressure sensing device are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.

Abstract: Apparatus and associated methods relate to a compact gas sensor (CGS) including a housing with a central stepped cavity with one or more first lead contact(s) forming a portion of a base plane in a bottom of the cavity and one or more second lead contact(s) forming a portion of a stepped plane higher than the base plane, the cavity sized to receive a chemically based stack of material made up of a bottom diffusion electrode layer, a middle electrolyte gel layer, and a top diffusion electrode layer. The bottom diffusion electrode layer is in electrical contact with the first lead contact(s). The top diffusion electrode layer electrically couples to the second lead contact(s) via an overlaying micro electromechanical system (MEMS) element layer with conductive coating. In an illustrative example, the CGS may provide gas sensing in small spaces.

Abstract: Methods and apparatuses related to freeze resistant sensing assemblies are provided. An example pressure sensing assembly may include: a first member defining an aperture, the aperture comprising an inner opening disposed on an inner surface of the first member and an outer opening disposed on an outer surface of the first member; a protection diaphragm disposed on the inner surface of the first member; and a sensing diaphragm disposed in a second member fastened to the first member.

Abstract: Apparatus and associated methods relate to a compact gas sensor (CGS) including a housing with a central stepped cavity with one or more first lead contact(s) forming a portion of a base plane in a bottom of the cavity and one or more second lead contact(s) forming a portion of a stepped plane higher than the base plane, the cavity sized to receive a chemically based stack of material made up of a bottom diffusion electrode layer, a middle electrolyte gel layer, and a top diffusion electrode layer. The bottom diffusion electrode layer is in electrical contact with the first lead contact(s). The top diffusion electrode layer electrically couples to the second lead contact(s) via an overlaying micro electromechanical system (MEMS) element layer with conductive coating. In an illustrative example, the CGS may provide gas sensing in small spaces.