Abstract: A semiconductor device (100A) with plastic encapsulation compound (102) and metal sheets (103a and 104) on both surfaces, acting as heat spreaders. One or more thermal conductors (103a) of preferably uniform height connect one sheet (103b) and the chip surface (101a); the number of conductors is scalable with the chip size. Each conductor consists of an elongated wire loop (preferably copper) with the wire ends attached to a pad (105), preferably both ends to the same pad. The major loop diameter is approximately normal to the first surface and the loop vertex in contact with the sheet (103b). The substrate (104, preferably a second metal sheet) covers at least portions of the second package surface and is thermally conductively connected to the chip.

Abstract: A thin film device, such as an intravascular stent, is disclosed. The device is formed of a seamless expanse of thin-film (i) formed of a sputtered nitinol shape memory alloy, defining, in an austenitic state, an open, interior volume, having a thickness between 0 5-50 microns, having an austenite finish temperature Af below 37° C.; and demonstrating a stress/strain recovery greater than 3% at 37° C. The expanse can be deformed into a substantially compacted configuration in a martensitic state, and assumes, in its austenitic state, a shape defining such open, interior volume. Also disclosed is a sputtering method for forming the device.

Abstract: A thromboembolic removal system for treating ischemic stroke, including a guide and occlusion catheter, a delivery and aspiration catheter, an aspiration pump, a thromboembolic receiver, and a thromboembolic separator.

Abstract: Techniques are described for facilitating interactions between computing systems, such as by performing transactions between parties that are automatically authorized via a third-party transaction authorization system. In some situations, the transactions are programmatic transactions involving the use of fee-based Web services by executing application programs, with the transaction authorization system authorizing and/or providing payments in accordance with private authorization instructions previously specified by the parties. The authorization instructions may include predefined instruction rule sets that regulate conditions under which a potential transaction can be authorized, with the instruction rule sets each referenced by an associated reference token.

Abstract: Techniques are described for facilitating interactions between computing systems, such as by performing transactions between parties that are automatically authorized via a third-party transaction authorization system. In some situations, the transactions are programmatic transactions involving the use of fee-based Web services by executing application programs, with the transaction authorization system authorizing and/or providing payments in accordance with private authorization instructions previously specified by the parties. The authorization instructions may include predefined instruction rule sets that regulate conditions under which a potential transaction can be authorized, with the instruction rule sets each referenced by an associated reference token.

Abstract: An electronic package comprising a semiconductor device, a heat spreader layer, and a thermal interface material layer located between the semiconductor device and the heat spreader layer. The thermal interface material layer includes a resin layer having heat conductive particles suspended therein. A portion of the particles are exposed on at least one non-planar surface of the resin layer such that the portion of exposed particles occupies a majority of a total area of a horizontal plane of the non-planar surface.

Abstract: Systems and methods for authenticating a request between a client computer and a transaction server are provided. An application request, comprising an identity of a user originating the request, is received at an application server from the client. The application server constructs a signing key based on (i) the identity of the user making the request, (ii) a time based salt value, (iii) a secret shared between the application and transaction servers and, optionally, (iv) an identifier of the distributor or developer of the application. The signing key is embedded in an unbranded version of the application thereby branding the application. The branded application can sign a request with the signing key and submit the signed request to the transaction server with the identity of the user and the identifier of the distributor or developer of the application.

Abstract: A thromboembolic removal system for treating ischemic stroke includes an elongate member and a receiver on a distal portion of the elongate member. The receiver includes structural members arranged to form a sleeve having a central lumen. A plurality of the structural members form engaging elements having apex regions that extend into the central lumen. During use of the thromboembolic removal system, the receiver is advanced over a body of thromboembolic material within a blood vessel, causing the body to be received into the central lumen, and causing the engaging elements to engage the body within the lumen.

Abstract: One embodiment of the invention is a semiconductor system (1400) of arrays (1401, 1402, etc.) of packaged devices. Each array includes a sheet-like substrate (1411, 1412, etc.) made of insulating material integral with conductive horizontal lines and vertical vias, and terminals on the surfaces. Semiconductor components, which may include more than one active or passive chips, or chips of different sizes, are attached to the substrate; the electrical connections may include flip-chip, wire bond, or combination techniques. Encapsulation compound (1412, 1422, etc.), which adheres to the substrate, embeds the connected components. Metal posts (1431, 1432, etc.) traverse the encapsulation compound vertically, connecting the substrate vias with pads on the encapsulation surface. The pads are covered with solder bodies used to connect to the next-level device array so that a 3-dimensional system of packaged devices is formed.

Abstract: A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate.

Abstract: A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate.

Abstract: A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate.

Abstract: A semiconductor device contact structure practically eliminating the copper diffusion into the solder as well as the current crowding at the contact with the subsequent electromigration in the solder. A column-like electroplated copper stud (108) is on each contact pad. The stud is sized to provide low, uniform electrical resistance in order to spread the current from the contact to an approximately uniform, low density. Preferably, the stud height (108a) is at least ten times the thickness of the copper interconnect layer (104). Stud (108) is capped by an electroplated nickel layer (109) thick enough (preferably about 2 ?m) to suppress copper diffusion from stud (108) into solder body (120), thus practically inhibiting intermetallic compound formation and Kirkendall voiding.

Abstract: Techniques are described for facilitating interactions between computing systems, such as by using an authorization system to automatically authorize financial payments between parties in accordance with previously specified private authorization instructions of at least one of the parties. In some situations, some or all of the payments are associated with commerce-related or other transactions, such as transactions initiated by a consumer via the Web to acquire items from a retailer. The authorization instructions may include predefined instruction sets that regulate conditions under which a potential payment can be authorized, with the instruction sets each associated in some situations with a reference. After one or more parties each supply one or more such references or otherwise indicate one or more such instruction sets for use with a potential payment, the authorization system can determine whether to authorize the payment based on whether the instruction sets are compatible or otherwise satisfied.

Abstract: Techniques are described for facilitating interactions between computing systems, such as by performing transactions between parties that are automatically authorized via a third-party transaction authorization system. In some situations, the transactions are programmatic transactions involving the use of fee-based Web services by executing application programs, with the transaction authorization system authorizing and/or providing payments in accordance with private authorization instructions previously specified by the parties. The authorization instructions may include predefined instruction rule sets that regulate conditions under which a potential transaction can be authorized, with the instruction rule sets each referenced by an associated reference token.

Abstract: The present invention is directed towards systems and methods for providing up-to-date constraint based advertising content. The method according to one embodiment of the present invention comprises receiving a request for advertisement content and selecting a first plurality of advertisements meeting the user profile data. The method then filters the first plurality of advertisements based on advertiser and publisher constraints and selecting a second plurality of advertisements and provides the second plurality of advertisements to a user.

Abstract: An approach to determine the service demand of various resources of any individual server (present in a cluster of servers), given the overall transaction throughput and utilization values of these resources, in case of a network load balanced scenario is disclosed. The method proposes a quantitative approach to calculate the transaction throughput of each network load balanced server from the overall transaction throughput, obtained from any commercial performance testing tool. The individual transaction throughputs are calculated using monitored values of network related performance counters of each server and the load balancer obtained from performance testing. Service demands of the resource can be computed using the Utilization law of Queuing Theory once the throughput of that server and utilization of that resource is obtained.

Abstract: One embodiment of the invention is a semiconductor system (1400) of arrays (1401, 1402, etc.) of packaged devices. Each array includes a sheet-like substrate (1411, 1412, etc.) made of insulating material integral with conductive horizontal lines and vertical vias, and terminals on the surfaces. Semiconductor components, which may include more than one active or passive chips, or chips of different sizes, are attached to the substrate; the electrical connections may include flip-chip, wire bond, or combination techniques. Encapsulation compound (1412, 1422, etc.), which adheres to the substrate, embeds the connected components. Metal posts (1431, 1432, etc.) traverse the encapsulation compound vertically, connecting the substrate vias with pads on the encapsulation surface. The pads are covered with solder bodies used to connect to the next-level device array so that a 3-dimensional system of packaged devices is formed.

Abstract: Techniques are described for facilitating interactions between computing systems, such as by performing transactions between parties that are automatically authorized via a third-party transaction authorization system. In some situations, the transactions are programmatic transactions involving the use of fee-based Web services by executing application programs, with the transaction authorization system authorizing and/or providing payments in accordance with private authorization instructions previously specified by the parties. The authorization instructions may include predefined instruction rule sets that regulate conditions under which a potential transaction can be authorized, with the instruction rule sets each referenced by an associated reference token.

Abstract: Techniques are described for facilitating interactions between computing systems, such as by performing transactions between parties that are automatically authorized via a third-party transaction authorization system. In some situations, the transactions are programmatic transactions involving the use of fee-based Web services by executing application programs, with the transaction authorization system authorizing and/or providing payments in accordance with private authorization instructions previously specified by the parties. The authorization instructions may include predefined instruction rule sets that regulate conditions under which a potential transaction can be authorized, with the instruction rule sets each referenced by an associated reference token.