Patents by Inventor Vinay K. PRABHAKAR

Vinay K. PRABHAKAR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240186121
    Abstract: Exemplary choke plates for use in a substrate processing system may include a plate defining a first aperture through the plate and a second aperture through the plate. The second aperture may be laterally offset from the first aperture. The plate may include a flange that defines a purging inlet. The plate may include a rim defining a plurality of purging outlets that are fluidly coupled with the purging inlet. Each of the plurality of purging outlets may be fluidly coupled with the first aperture.
    Type: Application
    Filed: December 6, 2022
    Publication date: June 6, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Vellaichamy Nagappan, Viren Kalsekar, Jeongmin Lee, Vinay K. Prabhakar, Pratap Chandran, Dharma Ratnam Srichurnam, Azhar Khan, Sumit Subhash Singh, Siva Chandrasekar, Satish Radhakrishnan
  • Patent number: 12000048
    Abstract: Aspects of the present disclosure relate generally to pedestals, components thereof, and methods of using the same for substrate processing chambers. In one implementation, a pedestal for disposition in a substrate processing chamber includes a body. The body includes a support surface. The body also includes a stepped surface that protrudes upwards from the support surface. The stepped surface is disposed about the support surface to surround the support surface. The stepped surface defines an edge ring such that the edge ring is integrated with the pedestal to form the body that is monolithic. The pedestal also includes an electrode disposed in the body, and one or more heaters disposed in the body.
    Type: Grant
    Filed: February 20, 2023
    Date of Patent: June 4, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Sarah Michelle Bobek, Venkata Sharat Chandra Parimi, Prashant Kumar Kulshreshtha, Vinay K. Prabhakar, Kwangduk Douglas Lee, Sungwon Ha, Jian Li
  • Patent number: 11984305
    Abstract: A substrate pedestal includes a thermally conductive substrate support including a mesh, a thermally conductive shaft including a plurality of conductive rods therein, each conductive rod having a first end and a second end, and a sensor. The first end of each conductive rod is electrically coupled to the mesh, and the sensor is disposed between the first and second ends of each conductive rod and configured to detect current flow through each conductive rod.
    Type: Grant
    Filed: January 2, 2023
    Date of Patent: May 14, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Viren Kalsekar, Vinay K. Prabhakar, Venkata Sharat Chandra Parimi
  • Publication number: 20240047185
    Abstract: Exemplary substrate processing systems may include a lid plate. The systems may include a gas feed line having an RPS outlet and a bypass outlet. The systems may include a remote plasma unit supported atop the lid plate. The remote plasma unit may include an inlet and an outlet. The inlet may be coupled with the RPS outlet. The systems may include a center manifold having an RPS inlet coupled with the outlet and a bypass inlet coupled with the bypass outlet. The center manifold may include a plurality of outlet ports. The systems may include a plurality of side manifolds that are fluidly coupled with the outlet ports. Each of the side manifolds may define a gas lumen. The systems may include a plurality of output manifolds seated on the lid plate. Each output manifold may be fluidly coupled with the gas lumen of one of the side manifolds.
    Type: Application
    Filed: August 3, 2022
    Publication date: February 8, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Abhijit A. Kangude, Badri N. Ramamurthi, Arun Chakravarthy Chakravarthy, Vinay K. Prabhakar, Dharma Ratnam Srichurnam
  • Patent number: 11875969
    Abstract: A processing system comprises a chamber body, a substrate support and a lid assembly. The substrate support is located in the chamber body and comprises a first electrode. The lid assembly is positioned over the chamber body and defines a processing volume. The lid assembly comprises a faceplate, a second electrode positioned between the faceplate and the chamber body, and an insulating member positioned between the second electrode and the processing volume. A power supply system is coupled to the first electrode and the faceplate and is configured to generate a plasma in the processing volume.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: January 16, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Fei Wu, Abdul Aziz Khaja, Sungwon Ha, Vinay K. Prabhakar, Ganesh Balasubramanian
  • Patent number: 11830706
    Abstract: Embodiments of the present disclosure generally relate to a pedestal for increasing temperature uniformity in a substrate supported thereon. The pedestal comprises a body having a heater embedded therein. The body comprises a patterned surface that includes a first region having a first plurality of posts extending from a base surface of the body at a first height, and a second region surrounding the central region having a second plurality of posts extending from the base surface at a second height that is greater than the first height, wherein an upper surface of each of the first plurality of posts and the second plurality of posts are substantially coplanar and define a substrate receiving surface.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: November 28, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Venkata Sharat Chandra Parimi, Zubin Huang, Jian Li, Satish Radhakrishnan, Rui Cheng, Diwakar N. Kedlaya, Juan Carlos Rocha-Alvarez, Umesh M. Kelkar, Karthik Janakiraman, Sarah Michelle Bobek, Prashant Kumar Kulshreshtha, Vinay K. Prabhakar, Byung Seok Kwon
  • Publication number: 20230298922
    Abstract: Aspects of the present disclosure relate to one or more implementations of a substrate support for a processing chamber. In one implementation, a substrate support includes a body having a center, and a support surface on the body configured to at least partially support a substrate. The substrate support includes a first angled wall that extends upward and radially outward from the support surface, and a first upper surface disposed above the support surface. The substrate support also includes a second angled wall that extends upward and radially outward from the first upper surface, the first upper surface extending between the first angled wall and the second angled wall. The substrate support also includes a second upper surface extending from the second angled wall. The second upper surface is disposed above the first upper surface.
    Type: Application
    Filed: May 23, 2023
    Publication date: September 21, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Abdul Aziz KHAJA, Venkata Sharat Chandra PARIMI, Sarah Michelle BOBEK, Prashant Kumar KULSHRESHTHA, Vinay K. PRABHAKAR
  • Publication number: 20230265560
    Abstract: Disclosed herein is a pumping liner, having a gas inlet configured to receive a process gas; openings in communication with the gas inlet, the openings configured to surround a substrate support and to direct the process gas onto the substrate support. At least a portion of the openings each has a different size. Each of the openings is configured to provide a gas mass flow rate that is within ±5% of a target gas mass flow rate. The pumping liner further includes a gas outlet configured to receive unreacted process gas and reacted process gas byproducts.
    Type: Application
    Filed: January 30, 2023
    Publication date: August 24, 2023
    Inventors: Badri Narayan Ramamurthi, Viren Sunil Kalsekar, Vinay K. Prabhakar
  • Publication number: 20230203659
    Abstract: Aspects of the present disclosure relate generally to pedestals, components thereof, and methods of using the same for substrate processing chambers. In one implementation, a pedestal for disposition in a substrate processing chamber includes a body. The body includes a support surface. The body also includes a stepped surface that protrudes upwards from the support surface. The stepped surface is disposed about the support surface to surround the support surface. The stepped surface defines an edge ring such that the edge ring is integrated with the pedestal to form the body that is monolithic. The pedestal also includes an electrode disposed in the body, and one or more heaters disposed in the body.
    Type: Application
    Filed: February 20, 2023
    Publication date: June 29, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Sarah Michelle BOBEK, Venkata Sharat Chandra PARIMI, Prashant Kumar KULSHRESHTHA, Vinay K. PRABHAKAR, Kwangduk Douglas LEE, Sungwon HA, Jian LI
  • Patent number: 11682574
    Abstract: Aspects of the present disclosure relate to one or more implementations of a substrate support for a processing chamber. In one implementation, a substrate support includes a body having a center, and a support surface on the body configured to at least partially support a substrate. The substrate support includes a first angled wall that extends upward and radially outward from the support surface, and a first upper surface disposed above the support surface. The substrate support also includes a second angled wall that extends upward and radially outward from the first upper surface, the first upper surface extending between the first angled wall and the second angled wall. The substrate support also includes a second upper surface extending from the second angled wall. The second upper surface is disposed above the first upper surface.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: June 20, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Abdul Aziz Khaja, Venkata Sharat Chandra Parimi, Sarah Michelle Bobek, Prashant Kumar Kulshreshtha, Vinay K. Prabhakar
  • Publication number: 20230170190
    Abstract: Embodiments of the present disclosure generally relate to substrate supports for process chambers and RF grounding configurations for use therewith. Methods of grounding RF current are also described. A chamber body at least partially defines a process volume therein. A first electrode is disposed in the process volume. A pedestal is disposed opposite the first electrode. A second electrode is disposed in the pedestal. An RF filter is coupled to the second electrode through a conductive rod. The RF filter includes a first capacitor coupled to the conductive rod and to ground. The RF filter also includes a first inductor coupled to a feedthrough box. The feedthrough box includes a second capacitor and a second inductor coupled in series. A direct current (DC) power supply for the second electrode is coupled between the second capacitor and the second inductor.
    Type: Application
    Filed: January 26, 2023
    Publication date: June 1, 2023
    Inventors: Satya THOKACHICHU, Edward P. HAMMOND, IV, Viren KALSEKAR, Zheng John YE, Abdul Aziz KHAJA, Vinay K. PRABHAKAR
  • Publication number: 20230151487
    Abstract: The present disclosure relates to systems and methods for reducing the formation of hardware residue and minimizing secondary plasma formation during substrate processing in a process chamber. The process chamber may include a gas distribution member configured to flow a first gas into a process volume and generate a plasma therefrom. A second gas is supplied into a lower region of the process volume. Further, an exhaust port is disposed in the lower region to remove excess gases or by-products from the process volume during or after processing.
    Type: Application
    Filed: January 20, 2023
    Publication date: May 18, 2023
    Inventors: Liangfa HU, Prashant Kumar KULSHRESHTHA, Anjana M. PATEL, Abdul Aziz KHAJA, Viren KALSEKAR, Vinay K. PRABHAKAR, Satya Teja Babu THOKACHICHU, Byung Seok KWON, Ratsamee LIMDULPAIBOON, Kwangduk Douglas LEE, Ganesh BALASUBRAMANIAN
  • Publication number: 20230147452
    Abstract: A substrate pedestal includes a thermally conductive substrate support including a mesh, a thermally conductive shaft including a plurality of conductive rods therein, each conductive rod having a first end and a second end, and a sensor. The first end of each conductive rod is electrically coupled to the mesh, and the sensor is disposed between the first and second ends of each conductive rod and configured to detect current flow through each conductive rod.
    Type: Application
    Filed: January 2, 2023
    Publication date: May 11, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Viren KALSEKAR, Vinay K. PRABHAKAR, Venkata Sharat Chandra PARIMI
  • Publication number: 20230124246
    Abstract: Exemplary substrate processing systems may include a lid plate. The systems may include a gas splitter seated on the lid plate. The gas splitter may include a top surface and side surfaces. The gas splitter may define a first and second gas inlets, with each gas inlet extending through one side surface. The gas splitter may define first and second gas outlets extending through the top surface. The gas splitter may define first and second gas lumens that extend between and fluidly couple each gas inlet with corresponding gas outlets. The gas splitter may define mixing channels that include a mixing outlet extending through a side surface and a mixing inlet extending through the top surface. The systems may include output manifolds seated on the lid plate. The systems may include output weldments that fluidly couple each mixing outlet with a respective one of the output manifolds.
    Type: Application
    Filed: October 19, 2021
    Publication date: April 20, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Arun Chakravarthy Chakravarthy, Vinay K. Prabhakar, Dharma Ratnam Srichurnam, Hossein Rezvantalab
  • Publication number: 20230069317
    Abstract: Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a lid plate seated on the chamber body. The lid plate may define a first plurality of apertures and a second plurality of apertures. The systems may include a plurality of lid stacks equal to a number of the first plurality of apertures. Each lid stack may include a choke plate seated on the lid plate along a first surface of the choke plate. The choke plate may define a first aperture axially aligned with an associated aperture of the first plurality of apertures. The choke plate may define a second aperture axially aligned with an associated aperture of the second plurality of apertures. The choke plate may define protrusions extending from each of a top and bottom surface of the choke plate that are arranged substantially symmetrically about the first aperture.
    Type: Application
    Filed: August 25, 2021
    Publication date: March 2, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Siva Chandrasekar, Satish Radhakrishnan, Viren Kalsekar, Vellaichamy Nagappan, Vinay K. Prabhakar
  • Patent number: 11584994
    Abstract: Aspects of the present disclosure relate generally to pedestals, components thereof, and methods of using the same for substrate processing chambers. In one implementation, a pedestal for disposition in a substrate processing chamber includes a body. The body includes a support surface. The body also includes a stepped surface that protrudes upwards from the support surface. The stepped surface is disposed about the support surface to surround the support surface. The stepped surface defines an edge ring such that the edge ring is integrated with the pedestal to form the body that is monolithic. The pedestal also includes an electrode disposed in the body, and one or more heaters disposed in the body.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: February 21, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Sarah Michelle Bobek, Venkata Sharat Chandra Parimi, Prashant Kumar Kulshreshtha, Vinay K. Prabhakar, Kwangduk Douglas Lee, Sungwon Ha, Jian Li
  • Patent number: 11587773
    Abstract: A substrate pedestal includes a thermally conductive substrate support including a mesh, a thermally conductive shaft including a plurality of conductive rods therein, each conductive rod having a first end and a second end, and a sensor. The first end of each conductive rod is electrically coupled to the mesh, and the sensor is disposed between the first and second ends of each conductive rod and configured to detect current flow through each conductive rod.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: February 21, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Viren Kalsekar, Vinay K. Prabhakar, Venkata Sharat Chandra Parimi
  • Patent number: 11569072
    Abstract: Embodiments of the present disclosure generally relate to substrate supports for process chambers and RF grounding configurations for use therewith. Methods of grounding RF current are also described. A chamber body at least partially defines a process volume therein. A first electrode is disposed in the process volume. A pedestal is disposed opposite the first electrode. A second electrode is disposed in the pedestal. An RF filter is coupled to the second electrode through a conductive rod. The RF filter includes a first capacitor coupled to the conductive rod and to ground. The RF filter also includes a first inductor coupled to a feedthrough box. The feedthrough box includes a second capacitor and a second inductor coupled in series. A direct current (DC) power supply for the second electrode is coupled between the second capacitor and the second inductor.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: January 31, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Satya Thokachichu, Edward P. Hammond, IV, Viren Kalsekar, Zheng John Ye, Abdul Aziz Khaja, Vinay K. Prabhakar
  • Patent number: 11560623
    Abstract: The present disclosure relates to systems and methods for reducing the formation of hardware residue and minimizing secondary plasma formation during substrate processing in a process chamber. The process chamber may include a gas distribution member configured to flow a first gas into a process volume and generate a plasma therefrom. A second gas is supplied into a lower region of the process volume. Further, an exhaust port is disposed in the lower region to remove excess gases or by-products from the process volume during or after processing.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: January 24, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Liangfa Hu, Prashant Kumar Kulshreshtha, Anjana M. Patel, Abdul Aziz Khaja, Viren Kalsekar, Vinay K. Prabhakar, Satya Teja Babu Thokachichu, Byung Seok Kwon, Ratsamee Limdulpaiboon, Kwangduk Douglas Lee, Ganesh Balasubramanian
  • Patent number: 11532463
    Abstract: A processing chamber may include a gas distribution member, a metal ring member below the gas distribution member, and an isolating assembly coupled with the metal ring member and isolating the metal ring member from the gas distribution member. The isolating assembly may include an outer isolating member coupled with the metal ring member. The outer isolating member may at least in part define a chamber wall. The isolating assembly may further include an inner isolating member coupled with the outer isolating member. The inner isolating member may be disposed radially inward from the metal ring member about an central axis of the processing chamber. The inner isolating member may define a plurality of openings configured to provide fluid access into a radial gap between the metal ring member and the inner isolating member.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: December 20, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Vishwas Kumar Pandey, Vinay K. Prabhakar, Bushra Afzal, Badri N. Ramamurthi, Juan Carlos Rocha-Alvarez