Patents by Inventor Vincent Burkhart

Vincent Burkhart has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Anode slime reduction method while maintaining low current
    Patent number: 6843897
    Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: January 18, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Harald Herchen, Vincent Burkhart
  • Anode slime reduction method while maintaining low current
    Publication number: 20030221956
    Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.
    Type: Application
    Filed: May 28, 2002
    Publication date: December 4, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Harald Herchen, Vincent Burkhart
  • Anode impedance control through electrolyte flow control
    Publication number: 20030221957
    Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.
    Type: Application
    Filed: May 28, 2002
    Publication date: December 4, 2003
    Applicant: APPLIED MATERIALS, INC
    Inventors: Harald Herchen, Craig Brodeur, Qunwei Wu, Peter Kimball, Vincent Burkhart