Abstract: A method for manufacturing a loudspeaker having a wire damper with locally adjustable elasticity, including preparation, impregnating, drying, wire disposing, forming, cutting and assembling steps. Wherein, a wire damper including a main body and a wire is thermoformed on a base material. The main body includes a wave structure and a wire disposing area. The wave structure includes wave crest and trough, and inner and outer sidewalls. The wire disposing area forms a hollow portion in which the wire extends. The warp yarns at outside and inside of the wire disposing area form an elastic adjustment area. The hollow portion has smaller depths at the inner and outer sidewalls than at the wave crests and troughs. Thereby, the wire will not be damaged by hot pressing, and the hardness, elasticity and toughness of the combination of the wire disposing area and the wire are equal to that of other areas.

Abstract: A semiconductor device includes a semiconductor die. A dielectric material surrounds the semiconductor die to form an integrated semiconductor package. There is a contact coupling to the integrated semiconductor package and configured as a ground terminal for the semiconductor package. The semiconductor device further has an EMI (Electric Magnetic Interference) shield substantially enclosing the integrated semiconductor package, wherein the EMI shield is coupled with the contact through a path disposed in the integrated semiconductor package.

Abstract: A non-destructive testing (NDT) system including: a flexible ultrasound array including an array surface; a controller for controlling the flexible ultrasound array; and an actuatable soft robot system comprising an actuator mechanism for actuating the flexible ultrasound array to modify a shape of the array surface of the flexible ultrasound array.

Abstract: A multi-input, multi-output phononic system including a first interface surface and a second interface surface that respond to at least one of a pressure gradient or a velocity gradient in a wave of a turbulent fluid flow or a laminar fluid flow, the pressure gradient or the velocity gradient associated with complex motion of the flow exhibiting a plurality of frequencies exerted on one or more of the interface surfaces; and a subsurface feature extending from the interface surfaces, the subsurface feature comprising a phononic crystal or locally resonant metamaterial adapted to receive one or more of the pressure gradient or the velocity gradient from the fluid flow via the interface surfaces and to alter one or more of a phase and an amplitude of a plurality of frequency components of the fluid flow.

Abstract: The present invention provides a trademark risk management system and method, which is implemented by providing a user-operated electronic device, wherein the electronic device comprises a processor and a network interface controller, a server comprises an application, and the processor connects to the server through the network interface controller to execute the application for the purpose of category recommendation and risk management, especially for the regeneration of text or graphics.

Abstract: A method of manufacturing a semiconductor device includes providing a semiconductor die and surrounding a sidewall of the semiconductor die with a dielectric material. The method further includes forming a post passivation interconnect (PPI) over the semiconductor die and electrically coupling the PPI with the semiconductor die. The method further includes molding the semiconductor die and the PPI into an integrated semiconductor package. The method further includes covering at least a portion of an outer surface of the integrated semiconductor package with a conductive layer, wherein the conductive layer is conformal to the morphology of the portion of the outer surface. Moreover, the method further includes forming a conductive path inside the integrated semiconductor package electrically coupled to the conductive layer and a ground terminal of the integrated semiconductor package.

Abstract: Therapeutic liquid compositions useful in the treatment of various conditions comprising a natural bulk sweetener that has a low fructose content.

Abstract: A method of manufacturing a semiconductor device includes providing a semiconductor die and surrounding a sidewall of the semiconductor die with a dielectric material. The method further includes forming a post passivation interconnect (PPI) over the semiconductor die and electrically coupling the PPI with the semiconductor die. The method further includes molding the semiconductor die and the PPI into an integrated semiconductor package. The method further includes covering at least a portion of an outer surface of the integrated semiconductor package with a conductive layer, wherein the conductive layer is conformal to the morphology of the portion of the outer surface. Moreover, the method further includes forming a conductive path inside the integrated semiconductor package electrically coupled to the conductive layer and a ground terminal of the integrated semiconductor package.

Abstract: According to one or more aspects of the present disclosure a wearable oral device is provided. The wearable oral device may include a mouthpiece; a bone conduction component; and a processing device. The processing device may detect one or more user interactions by a first user with the wearable oral device; and perform one or more operations in view of the one or more user interactions. The one or more user interactions may include a user interaction by the first user with the mouthpiece. The one or more operations may include presenting a content item via the bone conduction component of the wearable oral device. The content item may include audio content. In some embodiments, the content item comprises a voice message from a second user.

Abstract: A method for manufacturing a loudspeaker vibrating membrane with hard and elastic soft properties, comprising: (a) adhering a curable polymer to all areas on the outer surface of a base material; (b) drying the curable polymer to form a hard structure; (c) forming a loudspeaker vibrating membrane; and (d) separating the loudspeaker vibrating membrane from the base material. The method further comprises the following steps between steps (b) and (c) or steps (c) and (d), or after step (d): (e) adhering an elastic soft polymer to all or partial areas on the outer surface of the hard structure; and (f) drying the elastic soft polymer to form an elastic soft structure covering all or partial areas on the outer surface of the hard structure. In the present invention, the hardness and elastic coefficient of the loudspeaker vibrating membrane can be adjusted by the hard structure and the elastic soft structure.

Abstract: A method for manufacturing a loudspeaker vibrating membrane with hard and elastic soft properties, comprising: (a) adhering a curable polymer to all areas on the outer surface of a base material; (b) drying the curable polymer to form a hard structure; (c) forming a loudspeaker vibrating membrane; and (d) separating the loudspeaker vibrating membrane from the base material. The method further comprises the following steps between steps (b) and (c) or steps (c) and (d), or after step (d): (e) adhering an elastic soft polymer to all or partial areas on the outer surface of the hard structure; and (f) drying the elastic soft polymer to form an elastic soft structure covering all or partial areas on the outer surface of the hard structure. In the present invention, the hardness and elastic coefficient of the loudspeaker vibrating membrane can be adjusted by the hard structure and the elastic soft structure.

Abstract: Relates to a compound of Formula I a salt, hydrate, solvate, tautomer, enantiomer, racemate, diastereomer, or combination thereof. Also, relates to a compound of Formula II a salt, hydrate, solvate, tautomer, enantiomer, racemate, diastereomer, or combination thereof. The compounds can be a matrix metalloproteinase (MMP) inhibitor. The compounds can also treat a matrix metalloproteinase mediated condition such as cancer.

Abstract: A method for manufacturing a loudspeaker having a wire damper with locally adjustable elasticity, including preparation, impregnating, drying, wire disposing, forming, cutting and assembling steps. Wherein, a wire damper including a main body and a wire is thermoformed on a base material. The main body includes a wave structure and a wire disposing area. The wave structure includes wave crest and trough, and inner and outer sidewalls. The wire disposing area forms a hollow portion in which the wire extends. The warp yarns at outside and inside of the wire disposing area form an elastic adjustment area. The hollow portion has smaller depths at the inner and outer sidewalls than at the wave crests and troughs. Thereby, the wire will not be damaged by thermal pressurization, and the hardness, elasticity and toughness of the combination of the wire disposing area and the wire are equal to that of other areas.

Abstract: According to one or more aspects of the present disclosure a wearable oral device is provided. The wearable oral device may include a mouthpiece; a bone conduction component; and a processing device. The processing device may detect one or more user interactions by a first user with the wearable oral device; and perform one or more operations in view of the one or more user interactions. The one or more user interactions may include a user interaction by the first user with the mouthpiece. The one or more operations may include presenting a content item via the bone conduction component of the wearable oral device. The content item may include audio content. In some embodiments, the content item comprises a voice message from a second user.

Abstract: A method for manufacturing a loudspeaker includes arranging, weaving, impregnating, drying, forming, cutting and assembling steps. In the arranging step, warp yarns and wires are arranged at intervals, and the wires are grouped as a wire group. In the weaving step, weft yarns are arranged at intervals and interwoven with the warp yarns and the wires to form a base material by weaving, and an area where the weft yarns are interwoven with the wires is defined as a wire disposing area. In the forming step, a wire damper is formed on the base material by thermoforming; two elastic adjustment areas are formed at the weft yarns between both sides of the wire group and the warp yarns closest to both sides of the wire group; and widths of the elastic adjustment areas are equal to each other and larger than distances between the remaining warp yarns.

Abstract: A loudspeaker includes a loudspeaker body, a voice coil and a damper. The damper includes a main body, a wire and a first fixing sewing thread. The first fixing sewing thread includes a first sewing part including first to fourth wire winding portions and first to third yarn winding portions. The first and third wire winding portions extend from one side of the wire through upside of the wire to the other side of the wire while the second and fourth wire winding portions extend in the opposite direction The first to third yarn winding portions connect adjacent two wire winding portions and pass under one of the weft yarns, respectively.