Abstract: A semiconductor device includes a semiconductor die having an insulative layer and a conductive feature in the insulative layer, and a shield in contact with a lateral surface of the conductive feature. In some embodiments, the lateral surface of the conductive feature is aligned with an edge of the insulating material.

Abstract: A semiconductor structure includes a transceiver, a molding surrounding the transceiver, and a RDL disposed over the transceiver. The RDL includes an antenna and a dielectric layer. The antenna is disposed over and electrically connected to the transceiver. The dielectric layer surrounds the antenna. The antenna includes an elongated portion and a via portion. The elongated portion extends over the molding, and the via portion is electrically connected to the transceiver.

Abstract: Disclosed is a base material for preparing a finger protection structure, including a main body and abutment blocks. Four corners of each abutment block form four corner cut portions, two corner cut portions of two adjacent abutment blocks together form two first gaps, and areas of the main body exposed to the first gaps are defined as elastic deformation areas. A finger protection structure is cut out of the main body along two elastic deformation areas and one second gap. The finger protection structure includes a base plate and the abutment blocks. Areas of the base plate exposed to the first gaps are defined as elastic deformation areas. When a stressed surface is impacted by a frontal impact force, the abutment blocks abut against each other and the base plate straightens. When the stressed surface is impacted by a lateral rotation force, the elastic deformation areas are elastically deformed.

Abstract: A semiconductor structure includes a transceiver, a molding surrounding the transceiver, and a RDL disposed over the transceiver. The RDL includes an antenna and a dielectric layer. The antenna is disposed over and electrically connected to the transceiver. The dielectric layer surrounds the antenna. The antenna includes an elongated portion and a via portion. The elongated portion extends over the molding, and the via portion is electrically connected to the transceiver.

Abstract: A method of manufacturing a semiconductor device includes providing a semiconductor die and surrounding a sidewall of the semiconductor die with a dielectric material. The method further includes forming a post passivation interconnect (PPI) over the semiconductor die and electrically coupling the PPI with the semiconductor die. The method further includes molding the semiconductor die and the PPI into an integrated semiconductor package. The method further includes covering at least a portion of an outer surface of the integrated semiconductor package with a conductive layer, wherein the conductive layer is conformal to the morphology of the portion of the outer surface. Moreover, the method further includes forming a conductive path inside the integrated semiconductor package electrically coupled to the conductive layer and a ground terminal of the integrated semiconductor package.

Abstract: In one embodiment a non-foamed thread is formed by extruding a mixture with a plastic material and a blowing agent. The non-foamed thread is arranged into a sole component and then heated to activate the blowing agent and cause the threads to foam. In some cases, the non-foamed thread is knitted together.

Abstract: A semiconductor structure includes a transceiver, a molding surrounding the transceiver, a plurality of vias extending through the molding, and a RDL disposed over the transceiver and the plurality of vias. In some embodiments, the RDL includes an antenna disposed over and electrically connected to the transceiver, and a dielectric layer surrounding the antenna. In some embodiments, the antenna includes an elongated portion extending over the molding and a via portion electrically connected to the transceiver.

Abstract: A semiconductor device includes a semiconductor die. A dielectric material surrounds the semiconductor die to form an integrated semiconductor package. There is a contact coupling to the integrated semiconductor package and configured as a ground terminal for the semiconductor package. The semiconductor device further has an EMI (Electric Magnetic Interference) shield substantially enclosing the integrated semiconductor package, wherein the EMI shield is coupled with the contact through a path disposed in the integrated semiconductor package.

Abstract: A protective glove for athletes includes a glove body and a protective layer structure. The glove body includes a palm portion and a plurality of finger portions. Each of the finger portions has an elasticity constrained portion provided at a front end thereof The glove body has an inner side defined as a palm side and an outer side opposite to the inner side defined as a back side. The protective layer structure has one side surface disposed on the inner side of the glove body and the other side surface provided with an anti-slip buffer layer. The protective layer structure is adhesively disposed on the palm portion and the plurality of finger portions, and the protective layer structure is sewed and fixed along an edge portion of the protective layer structure with a sewing thread, such that the palm side is defined as a buffer protective surface.

Abstract: Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a first molding material disposed around the integrated circuit die, and a through-via disposed within the first molding material. A first side of a redistribution layer (RDL) is coupled to the integrated circuit die, the through-via, and the first molding material. A second molding material is over a second side of the RDL, the second side of the RDL being opposite the first side of the RDL. The packaged semiconductor device includes an antenna over the second molding material.

Abstract: A semiconductor device includes a semiconductor die having an insulative layer and a conductive feature in the insulative layer, and a shield in contact with a lateral surface of the conductive feature. In some embodiments, the lateral surface of the conductive feature is aligned with an edge of the insulating material.

Abstract: A semiconductor structure includes a transceiver, a molding surrounding the transceiver, a plurality of vias extending through the molding, and a RDL disposed over the transceiver and the plurality of vias. In some embodiments, the RDL includes an antenna disposed over and electrically connected to the transceiver, and a dielectric layer surrounding the antenna. In some embodiments, the antenna includes an elongated portion extending over the molding and a via portion electrically connected to the transceiver.

Abstract: A semiconductor device includes a semiconductor die, an insulative layer, a plurality of conductive features, a dummy redistribution layer (RDL), and an Electromagnetic Interference (EMI) shield. The insulative layer covers the semiconductor die. The conductive features substantially surround the insulative layer. The dummy RDL is over the insulative layer and electrically disconnected from the semiconductor die. The EMI shield is in contact with the plurality of conductive features and the dummy RDL.

Abstract: Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a first molding material disposed around the integrated circuit die, and a through-via disposed within the first molding material. A first side of a redistribution layer (RDL) is coupled to the integrated circuit die, the through-via, and the first molding material. A second molding material is over a second side of the RDL, the second side of the RDL being opposite the first side of the RDL. The packaged semiconductor device includes an antenna over the second molding material.

Abstract: The present disclosure provides an inductor structure. The inductor structure, comprising a first surface, a second surface intersecting with the first surface, a first conductive pattern and a second conductive pattern. The first conductive pattern is formed on the first surface. The second conductive pattern is formed on the second surface. The first conductive pattern is connected with the second conductive pattern.

Abstract: An athletic glove strengthened by applying a coating layer includes: a glove body formed with a palm portion and a plurality of finger sleeve portions, wherein the glove body is interwoven by a plurality of yarns; at least one coating layer applied on each of the finger sleeve portions, wherein the yarns and the coating layer are integrated and at least one first elastic support portion is formed on the finger sleeve portions; and at least one first protective layer, wherein one side thereof is disposed at the front side of the glove body and the other side thereof has an anti-slip buffer layer. Therefore, the glove body of the present invention provides excellent structural strength on the finger sleeve portions or the palm portion, preventing finger knuckles of a user from being injured when the user engages in ball activities, by offsetting impact force and rotational force.

Abstract: A method of manufacturing a semiconductor structure includes providing a transceiver, forming a molding to surround the transceiver, forming a plurality of recesses extending through the molding, disposing a conductive material into the plurality of recesses to form a plurality of vias, disposing and patterning an insulating layer over the molding, the plurality of vias and the transceiver, and forming a redistribution layer (RDL) over the insulating layer, wherein the RDL comprises an antenna disposed over the insulating layer and a dielectric layer covering the antenna, and a portion of the antenna is extended through the insulating layer and is electrically connected with the transceiver.

Abstract: A finger protection structure includes a plurality of abutment blocks arranged on an adhesive surface of a base plate in a straight line, abutting against one another and defining a plurality of elastic deformation areas on the adhesive surface such that the finger protection structure is bendable forward, twisted and/or bendable in left-and right directions partially due to a flexibility constituted by presence of corner cut portions of the abutment blocks, the deformation areas on the adhesive surface of the base plate and flexibility of the base plate, thereby eliminating the problems resulted from a frontal and rotational lateral impact applied on the stressed surface of the base plate. The finger protection structure has simple structure, is ergonomically constructed and is capable of buffering and absorbing the frontal impact and rotating lateral impact, thereby minimizing injuries to the hands of the wearer of a protection hand glove.

Abstract: A protective glove for athletes includes: a glove body including a palm portion and a plurality of finger portions, wherein the glove body has an inner side defined as a palm side and an outer side opposite to the inner side defined as a back side; and at least one protective layer structure having one side surface disposed on the inner side of the glove body and the other side surface provided with an anti-slip buffer layer, wherein the protective layer structure is adhesively disposed on the palm portion and the plurality of finger portions of the glove body in such a manner to define the palm side as a buffer protective surface. The protective layer structure of the protective glove can entirely enclose the palm portions and the finger portions and thus can protect the fingers, but will not affect the moving flexibility and the touching sensitivity of the fingers.