Patents by Inventor Vincent Kho

Vincent Kho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solders
    Publication number: 20070125834
    Abstract: A substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2 % to around 3.0% copper; and from around 0.02% to around 0.12% silicon.
    Type: Application
    Filed: February 12, 2007
    Publication date: June 7, 2007
    Applicants: Quantum Chemical Technologies (Singapore) Pte. Ltd., Singapore Asahi Chemical & Solder Industries Pte. Ltd.
    Inventors: Kai CHEW, Vincent KHO
  • Solders
    Publication number: 20060088439
    Abstract: A substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2% to around 3.0% copper; and from around 0.02% to around 0.12% silicon.
    Type: Application
    Filed: January 28, 2005
    Publication date: April 27, 2006
    Applicant: Quantum Chemical Technologies (Singapore) Pte. Ltd
    Inventors: Kai Chew, Vincent Kho
  • Method and apparatus for filling containers
    Patent number: 5785098
    Abstract: A syringe or cartridge has a displaceable stopper located herein, and an apparatus for filling the syringe or cartridge has a reservoir for holding a flowable filling material and a plunger associated with the reservoir to exert pressure on the flowable material in the reservoir. The plunger includes at least one dispensing port defining a channel through the plunger for connection with the syringe or cartridge to be filled. The apparatus also has a pressurizer for applying pressure to the plunger.
    Type: Grant
    Filed: November 5, 1996
    Date of Patent: July 28, 1998
    Assignee: Singapore Asahi Chemical & Solder Industries Pte. Ltd.
    Inventors: Vincent Kho Yue Sern, See Soon Lee, Chew Kai Hwa