Patents by Inventor Vincent Lai

Vincent Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IC package connector
    Patent number: 5249971
    Abstract: Disclosed is a connector for connecting an IC package to a printed circuit board (PCB). The connector includes a base; a wall perpendicular to and surrounding the bottom base to form a recess for accommodating the IC package, the wall having a plurality of slots formed on the inner side thereof and lining up side-by-side therealong; a plurality of terminals, each of which is fitted within one of the slots, for electrically connecting the pins of the IC package to the printed circuit board.
    Type: Grant
    Filed: February 2, 1993
    Date of Patent: October 5, 1993
    Assignee: Foxconn International, Inc.
    Inventors: Vincent Lai, J. J. Hsu
  • Front panel for a computer system unit
    Patent number: D390216
    Type: Grant
    Filed: March 13, 1997
    Date of Patent: February 3, 1998
    Inventor: Vincent Lai
  • Front panel for a computer system unit
    Patent number: D408805
    Type: Grant
    Filed: April 8, 1998
    Date of Patent: April 27, 1999
    Inventor: Vincent Lai
  • Front panel for a computer system unit
    Patent number: D409176
    Type: Grant
    Filed: April 8, 1998
    Date of Patent: May 4, 1999
    Inventor: Vincent Lai
  • Front panel for a computer system unit
    Patent number: D416009
    Type: Grant
    Filed: November 5, 1998
    Date of Patent: November 2, 1999
    Inventor: Vincent Lai