Abstract: A water cooling heat sink unit includes a base contacting an electronic part with its outside, and the inside of the base has a first groove, a second groove, a main inlet and a main outlet. The first groove communicates with the main outlet and has a first guide portion. The second groove has a second guide portion. A cover is mounted to the inside of the base and has a first corresponding slot, a second corresponding slot, and a corresponding inlet to respectively communicate with the first groove, the second groove and the main inlet. The first corresponding slot has a first corresponding portion which communicates with the first guide portion. The second corresponding slot has a second corresponding portion which communicates with the second guide portion. Cool water is introduced from the first guide portion, the second guide portion, the main inlet and the main outlet.

Abstract: The present invention discloses a method for handover of User Equipment (UE) a service connection being made via the UE, comprises: if fast cells are set up as base stations starts up, handover from a normal cell to a first fast cell with a radio bearer set up therein when the UE moving speed exceeds a threshold, set up a same radio bearer at a current fast cell as the radio bearer set up at the first fast cell when the UE is leaving the first fast cell for the current fast cell adjacent to the first fast cell, release the radio bearer at the first fast cell after the UE leaves the first fast cell, and re-registering into an adjacent normal cell when the service connection is terminated, or handover to the adjacent normal cell from the current fast cell when the measured moving speed of the UE is below the threshold.

Abstract: A cross-flow heat exchanger, method of making a cross-flow heat exchanger, and a dehumidifier are provided. The cross-flow heat exchanger has an axial flow path extending through the heat exchanger from an inlet to an outlet and a transverse flow path oriented transversely to the axial flow path and extending through the heat exchanger from an inlet to an outlet. The transverse flow path is adjacent to and separate from the axial flow path. The surface area of the inlet of the axial flow path is less than the surface area of the outlet of the axial flow path. In a preferred embodiment, the heat exchanger has an exterior shape that is trapezoidal.

Abstract: An apparatus comprises an air inlet configured to receive an inlet airflow. The inlet airflow comprises a process airflow and a bypass airflow. An evaporator unit receives a flow of refrigerant and is cools the process airflow by facilitating heat transfer from the process airflow to the flow of refrigerant. A condenser unit receives the flow of refrigerant and (1) reheats the process airflow by facilitating heat transfer from the flow of refrigerant to the process airflow, and (2) heats the bypass airflow by facilitating heat transfer from the flow of refrigerant to the bypass airflow. The process airflow is discharged via a process airflow outlet and the bypass airflow is discharged via a bypass airflow outlet.

Abstract: A dehumidification apparatus comprises an air inlet configured to receive an inlet airflow that is separated into a process airflow and a bypass airflow. An evaporator unit is operable to cool the process airflow by facilitating heat transfer from the process airflow to a flow of refrigerant as the process airflow passes through the evaporator unit. A condenser unit operable to (1) reheat the process airflow by facilitating heat transfer from the flow of refrigerant to the process airflow as the process airflow passes through a first portion of the condenser unit, and (2) heat the bypass airflow by facilitating heat transfer from the flow of refrigerant to the bypass airflow as the bypass airflow passes through a second portion of the condenser unit. The process airflow is discharged into the structure via a process airflow outlet and the bypass airflow is discharged into the structure via a bypass airflow outlet.

Abstract: Provided is a method of performing a lithography process. The method includes: exposing, through an immersion lithography process, a photo-sensitive material on a substrate, the immersion lithography process using a fluid for the exposing; thereafter treating the photo-sensitive material with a solution to neutralize quenchers that have diffused into the photo-sensitive material through the liquid, wherein the solution contains a substance that diffuses into the photo-sensitive material at a first rate that is dependent on a second at which the quenchers diffuse into the photo-sensitive material; thereafter removing a portion of the photo-sensitive material; thereafter performing a post-exposure bake to the photo-sensitive material; and developing the photo-sensitive material.

Abstract: A dehumidification apparatus comprises an air inlet configured to receive an inlet airflow that is separated into a process airflow and a bypass airflow. An evaporator unit is operable to cool the process airflow by facilitating heat transfer from the process airflow to a flow of refrigerant as the process airflow passes through the evaporator unit. A condenser unit operable to (1) reheat the process airflow by facilitating heat transfer from the flow of refrigerant to the process airflow as the process airflow passes through a first portion of the condenser unit, and (2) heat the bypass airflow by facilitating heat transfer from the flow of refrigerant to the bypass airflow as the bypass airflow passes through a second portion of the condenser unit. The process airflow is discharged into the structure via a process airflow outlet and the bypass airflow is discharged into the structure via a bypass airflow outlet.

Abstract: The present invention discloses a method for handover of User Equipment (UE) a service connection being made via the UE, comprises: if fast cells are set up as base stations starts up, handover from a normal cell to a first fast cell with a radio bearer set up therein when the UE moving speed exceeds a threshold, set up a same radio bearer at a current fast cell as the radio bearer set up at the first fast cell when the UE is leaving the first fast cell for the current fast cell adjacent to the first fast cell, release the radio bearer at the first fast cell after the UE leaves the first fast cell, and re-registering into an adjacent normal cell when the service connection is terminated, or handover to the adjacent normal cell from the current fast cell when the measured moving speed of the UE is below the threshold.

Abstract: A method of performing immersion lithography on a semiconductor substrate includes providing a layer of resist onto a surface of the semiconductor substrate and exposing the resist layer using an immersion lithography exposure system. The immersion lithography exposure system utilizes a fluid during exposure and may be capable of removing some, but not all, of the fluid after exposure. After exposure, a treatment process is used to neutralize the effect of undesired elements that diffused into the resist layer during the immersion exposure. After treatment, a post-exposure bake and a development step are used.

Abstract: A hard mask layer and a developable bottom anti-reflective coating (dBARC) layer are formed over a dielectric layer of a substrate. A first photosensitive layer is formed above the dBARC layer, exposed, and developed to form a first pattern. The dBARC layer is developed. The first pattern is etched into the hard mask layer to form a first pattern of openings in the hard mask layer. Following removal of the first photosensitive layer, a second photosensitive layer is formed within the first pattern of openings. The second photosensitive layer is exposed and developed to form a second pattern. The dBARC layer is developed. The second pattern is etched into the hard mask layer to form a second pattern of openings in the hard mask layer. Following the removal of the second photosensitive layer and the dBARC layer, the first and the second patterns are etched into the dielectric layer.

Abstract: Provided is a non-transitory computer readable medium including instructions to generate a level sensor map and create a compensation map from the level sensor map. The level sensor map includes a first determination of a first height above a reference plane of a feature disposed on a semiconductor substrate, and a second determination of a second height above the reference plane of a second feature disposed on a semiconductor substrate. The first and second feature are in a single exposure field. The compensation map includes a determination of at least one parameter to be used during exposure of a single field during an exposure process for the semiconductor substrate.

Abstract: A cross-flow heat exchanger, method of making a cross-flow heat exchanger, and a dehumidifier are provided. The cross-flow heat exchanger has an axial flow path extending through the heat exchanger from an inlet to an outlet and a transverse flow path oriented transversely to the axial flow path and extending through the heat exchanger from an inlet to an outlet. The transverse flow path is adjacent to and separate from the axial flow path. The surface area of the inlet of the axial flow path is less than the surface area of the outlet of the axial flow path. In a preferred embodiment, the heat exchanger has an exterior shape that is trapezoidal.

Abstract: Apparatus and methods are disclosed herein for fabricating semiconductor device features with a half-pitch node of 22 nm and beyond using single exposure and single etch (1P1E) photolithography techniques. The method includes exposing in a single exposure a photoresist layer to the exposure source through a photolithography mask where the photolithography mask has on it an island pattern of a material having high percentage transmission. The photoresist layer is developed using a negative tone developer to form a hole pattern in the photoresist layer. The 1P1E does not require the second photo exposure of the double patterning method. Furthermore, the method circumvents the island pattern collapsing issues and the need for strong illumination associated with exiting single 1P1E processes.