Patents by Inventor Vineet Mehta
Vineet Mehta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20060073690Abstract: Physical vapor deposition and re-sputtering of a barrier layer in an integrated circuit is performed by providing a metal target near a ceiling of the chamber and a wafer support pedestal facing the target near a floor of the chamber. A process gas is introduced into said vacuum chamber. A target-sputtering plasma is maintained at the target to produce a stream of principally neutral atoms flowing from the target toward the wafer for vapor deposition. A wafer-sputtering plasma is maintained near the wafer support pedestal to produce a stream of sputtering ions toward the wafer support pedestal for re-sputtering. The sputtering ions are accelerated across a plasma sheath at the wafer in a direction normal to a surface of the wafer to render the sputter etching highly selective for horizontal surfaces.Type: ApplicationFiled: February 3, 2005Publication date: April 6, 2006Inventors: Karl Brown, John Pipitone, Vineet Mehta
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Publication number: 20060073283Abstract: A plasma reactor includes a vacuum chamber including a sidewall, a ceiling and a wafer support pedestal near a floor of the chamber, and a vacuum pump coupled to the chamber. A process gas inlet is coupled to the chamber and a process gas source coupled to the process gas inlet. The reactor further includes a metal sputter target at the ceiling, a high voltage D.C. source coupled to the sputter target, an RF plasma source power generator coupled to the wafer support pedestal and having a frequency suitable for exciting kinetic electrons, and an RF plasma bias power generator coupled to the wafer support pedestal and having a frequency suitable for coupling energy to plasma ions.Type: ApplicationFiled: February 3, 2005Publication date: April 6, 2006Inventors: Karl Brown, John Pipitone, Vineet Mehta
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Publication number: 20060002053Abstract: A detachable electrostatic chuck can be attached to a pedestal in a process chamber. The electrostatic chuck has an electrostatic puck comprising a dielectric covering at least one electrode and a frontside surface to receive a substrate. A backside surface of the chuck has a central protrusion that can be a D-shaped mesa to facilitate alignment with a mating cavity in the pedestal. The protrusion can also have asymmetrically offset apertures, which further assist alignment, and also serve to receive electrode terminal posts and a gas tube. A heat transfer plate having an embedded heat transfer fluid channel is spring loaded on the pedestal to press against the chuck for good heat transfer.Type: ApplicationFiled: September 7, 2005Publication date: January 5, 2006Inventors: Karl Brown, Semyon Sherstinsky, Wei Wang, Cheng-Hsiung Tsai, Vineet Mehta, Allen Lau, Steve Sansoni
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Publication number: 20050270175Abstract: A traffic informational system provides information to traffic moving along a road and may include a plurality of traffic information devices mountable to the road, each having an integral power producing source, at least a first set of illumination sources, and a wireless communications subsystem. The traffic informational system may further include at least a first external control device comprising at least one antenna and a transmitter communication wirelessly with the traffic information devices and/or with one another. The traffic information device may communicate with one another, and may include sensor for sensing ambient conditions. The system employs various approaches to reducing power consumption and improving communications, and is suitable for a wide range of applications, including use in remote environments.Type: ApplicationFiled: February 10, 2005Publication date: December 8, 2005Applicant: Spot Devices, Inc.Inventors: TImm Peddie, David Bim-Merle, Thomas Burnham, Daniel Santos, Lawrence Miller, Vineet Mehta, Johannes Van Niekerk
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Publication number: 20050219786Abstract: An electrostatic chuck is capable of attachment to a pedestal in a process chamber. The chuck has an electrostatic puck comprises a ceramic body with an embedded electrode. The ceramic body has a substrate support surface with an annular periphery. The chuck also has a base plate below the electrostatic puck that is a composite of a ceramic material and a metal. The base plate has an annular flange extending beyond the periphery of the ceramic body. The base plate and electrostatic puck can be supported by a support pedestal having a housing and an annular ledge that extends outwardly from the housing to attach to the annular flange of the base plate. A heat transfer plate having an embedded heat transfer fluid channel can also be provided.Type: ApplicationFiled: March 31, 2004Publication date: October 6, 2005Inventors: Karl Brown, Nora Arellano, Semyon Sherstinsky, Allen Lau, Cheng-Hsiung Tsai, Vineet Mehta, Steve Sansoni, Wei Wang
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Patent number: 6875927Abstract: A high temperature cable includes wire bundle having a plurality of copper strands, where each copper strand has a barrier coating and an anti-oxidation coating disposed thereon. A mica-based layer is wrapped around a length of the wire bundle and a fiberglass layer is disposed over the mica-based layer.Type: GrantFiled: March 8, 2002Date of Patent: April 5, 2005Assignee: Applied Materials, Inc.Inventors: Karl Brown, Cheng-Hsiung (Matt) Tsai, Donny Young, Vineet Mehta, David Loo
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Publication number: 20050056370Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: ApplicationFiled: April 6, 2004Publication date: March 17, 2005Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau
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Patent number: 6837968Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: GrantFiled: September 23, 2003Date of Patent: January 4, 2005Assignee: Applied Materials, Inc.Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau
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Publication number: 20040083977Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: ApplicationFiled: September 23, 2003Publication date: May 6, 2004Applicant: Applied Materials, Inc.Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau
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Patent number: 6726805Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: GrantFiled: April 24, 2002Date of Patent: April 27, 2004Assignee: Applied Materials, Inc.Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau
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Publication number: 20040018740Abstract: An RF coil for a plasma etch chamber is provided in which the RF coil is substantially flat over a portion of at least one turn of the coil. In one embodiment, each turn of the coil is substantially flat over a majority of each turn. In one embodiment of the present inventions, each turn of the coil is substantially flat over approximately 300 degrees of the turn. In the final approximate 60 degrees of the turn, the coil is sloped down to the next turn. Each turn thus comprises a substantially flat portion in combination with a sloped portion interconnecting the turn to the next adjacent turn. In one embodiment, the RF coil having turns with substantially flat portions is generally cylindrical. Other shapes are contemplated such as a dome shape. In some applications such as an RF plasma etch reactor, it is believed that providing an RF coil having turns comprising flat portions with sloped portions interconnecting the flat portions can improve uniformity of the etch process.Type: ApplicationFiled: March 12, 2003Publication date: January 29, 2004Applicant: Applied Materials, Inc.Inventors: Karl Brown, Vineet Mehta, See-Eng Phan
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Patent number: 6652713Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: GrantFiled: August 9, 2001Date of Patent: November 25, 2003Assignee: Applied Materials, Inc.Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau
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Publication number: 20030169553Abstract: A high temperature cable includes wire bundle having a plurality of copper strands, where each copper strand has a barrier coating and an anti-oxidation coating disposed thereon. A mica-based layer is wrapped around a length of the wire bundle and a fiberglass layer is disposed over the mica-based layer.Type: ApplicationFiled: March 8, 2002Publication date: September 11, 2003Applicant: Applied Materials, Inc.Inventors: Karl Brown, Cheng-Hsiung Matt Tsai, Donny Young, Vineet Mehta, David Loo
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Patent number: 6618380Abstract: Apparatus and a method are disclosed for providing a priority queuing arrangement in the transmit direction in Inter-Working Units (IWUs) that permits Frame Relay data packets or ATM cells from channels that have contracted for a particular level of bandwidth service to be provided that service, even during heavy traffic periods when there is contention for resources in the IWU.Type: GrantFiled: September 9, 1999Date of Patent: September 9, 2003Assignee: Lucent Technologies Inc.Inventors: Vineet Mehta, Martin Ernst Mueller, Muralidharan Sampath Kodialam, Yung-Terng Wang
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Publication number: 20030029564Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: ApplicationFiled: April 24, 2002Publication date: February 13, 2003Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau
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Publication number: 20030029568Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: ApplicationFiled: August 9, 2001Publication date: February 13, 2003Applicant: Applied Materials, Inc.Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau