Abstract: This is directed to a case for securing and protecting an electronic device. The case can include a cover connected to a pouch by a hinge such that the cover can be overlaid over a device interface (e.g., a device display). The case can be constructed by layering and combining several types of materials, including for example materials having resistant outer surfaces, materials limiting the deformation of the case, materials providing a soft surface to be placed in contact with the device, and rigid materials for defining a structure of the case. In some embodiments, the case can include a tab that allows a user to fold open the cover of the case to form a triangular prism. The prism can be placed on any of its surfaces such that the device can be oriented towards a user at particular angles (e.g., a typing-specific orientation and a media playback orientation).

Abstract: An electronic device may have electronic device housing structures in which electronic components such as integrated circuits and connectors may be mounted. The electronic device housing structures may include an upper housing having a planar upper surface member and four perpendicular housing sidewall structures. The housing sidewall structures of the upper housing may have edges that form a rectangular opening with curved corners. A lower housing may have structures forming a rectangular lip that is configured to be received within the rectangular opening in the upper housing. Engagement structures such as inwardly protruding hook structures on the upper housing and snap structures on the rectangular lip may be used in attaching the upper and lower housings. The snap structures may each have a rectangular main opening and lateral extension portions that extend the width of the main opening along the edge of the lip.

Abstract: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.

Abstract: Composite structures may be formed using sheets of unidirectional fiber prepreg. Each of the prepreg sheets may include unidirectional fibers such as glass fibers and a binder such as plastic. The prepreg sheets may be wrapped around the outer surface of a drum. Ring-shaped sections of the wrapped sheets may be cut from the drum to form rings of prepreg layers. The prepreg rings may be placed into a mold cavity of a desired shape. While contained in stack of molds, prepreg rings may be cured by applying heat and pressure. Finished composite structures such as ring-shaped composite structures may be released from the molds following curing. The composite structures may be planar structures that have planar upper and lower surfaces and inner and outer edges. The fibers in the finished composite structures may run parallel to the upper and lower surfaces and parallel to the inner and outer edges.

Abstract: This is directed to a case for securing and protecting an electronic device. The case can include a cover connected to a pouch by a hinge such that the cover can be overlaid over a device interface (e.g., a device display). The case can be constructed by layering and combining several types of materials, including for example materials having resistant outer surfaces, materials limiting the deformation of the case, materials providing a soft surface to be placed in contact with the device, and rigid materials for defining a structure of the case. In some embodiments, the case can include a tab that allows a user to fold open the cover of the case to form a triangular prism. The prism can be placed on any of its surfaces such that the device can be oriented towards a user at particular angles (e.g., a typing-specific orientation and a media playback orientation).

Abstract: A housing for accommodating one or more riser cards is disclosed. The one or more riser cards include a first riser card. The first riser card may be configured to carry at least a first component. The housing may include a first inlet side configured to allow first air to flow into the housing for cooling the first component. The housing may also include an outlet side configured to allow at least a first portion of the first air to flow away from the housing. The housing may be configured to be disposed inside an enclosure of an electronic device. At least one of the first inlet side and the outlet side may include a first guiding structure configured to guide movement of the first riser card relative to the housing.

Abstract: A housing for accommodating one or more riser cards is disclosed. The one or more riser cards include a first riser card. The first riser card may be configured to carry at least a first component. The housing may include a first inlet side configured to allow first air to flow into the housing for cooling the first component. The housing may also include an outlet side configured to allow at least a first portion of the first air to flow away from the housing. The housing may be configured to be disposed inside an enclosure of an electronic device. At least one of the first inlet side and the outlet side may include a first guiding structure configured to guide movement of the first riser card relative to the housing.

Abstract: The present invention relates to methods of use 1,1- and 1,2-bisphosphonate compounds to modulate apolipoprotein E levels and use of such compounds in therapy, including cardiovascular and neurological disease states.

Abstract: The present invention relates to novel ?-substituted arylalkylphosphonate derivatives and their uses for lowering plasma levels of apo (a), Lp(a), apo B, apo B associated lipoproteins (low density lipoproteins and very low density lipoproteins) and for lowering plasma levels of total cholesterol.

Abstract: The present invention relates to novel ?-substituted heteroarylalkylphosphonate derivatives and their uses for lowering plasma levels of apo (a), Lp(a), apo B, apo B associated lipoproteins (low density lipoproteins and very low density lipoproteins) and for lowering plasma levels of total cholesterol.

Abstract: The present invention relates to methods of use of aminodiphosphonate to modulate apolipoprotein E levels and the use of such compounds in therapy, including cardiovascular and neurological disease states.