Abstract: Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof are disclosed. According to an aspect, a system includes a liquid vessel that defines an interior space for holding a cooling liquid and an electronic component. The system also includes a heat conduit including a first portion, a second portion, and a third portion. The heat conduit is configured to transfer heat between the portions. Further, the first portion is configured to transfer heat from the electronic component to the second portion. The second portion is configured to transfer heat to the cooling liquid and to the third portion. The system includes a thermoelectric cooler positioned within the interior space. The thermoelectric cooler includes an absorption side and a rejection side. The thermoelectric cooler is configured to transfer heat from the absorption side to the rejection side.

Abstract: Method, system, and computer program product embodiments of heating a flow of liquid by transfer of heat with computing devices. Embodiments also include determining a dynamic cooling capacity index for each of the computing devices, and allocating processing workload among the first computing device and the second computing device based on the dynamic cooling capacity indexes of the computing devices. Embodiments further include allocating workload and/or regulating flow rate of the flow of liquid to maintain a predetermined value or range of values of temperature of the liquid.

Abstract: Cooling devices for cooling electronic components with liquid cooling and associated methods thereof are disclosed. According to an aspect, a device includes a housing that defines an interior space. The device also includes an electronic component positioned in the interior space. The device also includes a liquid cooling component configured to engage the housing and the electronic component for cooling the electronic component and the interior space.

Abstract: Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof are disclosed. According to an aspect, a system includes a liquid vessel that defines an interior space for holding a cooling liquid and an electronic component. The system also includes a heat conduit including a first portion, a second portion, and a third portion. The heat conduit is configured to transfer heat between the portions. Further, the first portion is configured to transfer heat from the electronic component to the second portion. The second portion is configured to transfer heat to the cooling liquid and to the third portion. The system includes a thermoelectric cooler positioned within the interior space. The thermoelectric cooler includes an absorption side and a rejection side. The thermoelectric cooler is configured to transfer heat from the absorption side to the rejection side.

Abstract: Systems and methods for controlling air distribution to electronic components are disclosed. According to an aspect, a system includes fans configured to distribute air to a plurality of electronic components. The system also includes a fan controller configured to control the fans based on a form factor and/or a quantity of the electronic components.

Abstract: Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same are disclosed herein. According to an aspect, a system includes a fluid conduit comprising a first portion and a second portion that are fluidly connected to each other for carrying cooling fluid proximate to a first electronic component and a second electronic component of a computing device. The system also includes a first fluid conduit carrier configured to hold the first portion of the conduit. Further, the system includes a second fluid conduit carrier configured to hold the second portion of the conduit. The first fluid conduit carrier and the second fluid conduit carrier are configured to connect to one another.

Abstract: Systems and methods for controlling air distribution to electronic components are disclosed. According to an aspect, a system includes fans configured to distribute air to a plurality of electronic components. The system also includes a fan controller configured to control the fans based on a form factor and/or a quantity of the electronic components.

Abstract: An apparatus for auxiliary cooling redundancy for components using an actuating fan pack includes a fan pack. The fan pack includes a fan positioned to provide a stream of air directed toward a component mounted in the server rack and the server rack includes components for a data system. The apparatus includes and a vertical drive configured to move the fan pack vertically to a position so air from the fan is directed toward the component. The apparatus includes a positioning controller configured to direct the vertical drive to move the fan pack to a front of a component in the server rack and configured to turn on the fans.

Abstract: Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same are disclosed herein. According to an aspect, a system includes a fluid conduit comprising a first portion and a second portion that are fluidly connected to each other for carrying cooling fluid proximate to a first electronic component and a second electronic component of a computing device. The system also includes a first fluid conduit carrier configured to hold the first portion of the conduit. Further, the system includes a second fluid conduit carrier configured to hold the second portion of the conduit. The first fluid conduit carrier and the second fluid conduit carrier are configured to connect to one another.

Abstract: A fluid-cooled computer system includes a plurality of heat-generating components and a cooling system configured for supplying a cooling fluid at a controlled cooling fluid flow rate to cool the heat-generating components. A temperature-based cooling control circuit includes a temperature sensor configured for sensing a temperature of the heat-generating components and control logic for increasing a cooling fluid flow rate in response to the temperature exceeding a temperature threshold. A power-based cooling control circuit is configured for identifying and quantifying an increasing power consumption trend over a target time interval and, during a period that the temperature of the electronic device does not exceed the temperature threshold, increasing a cooling fluid flow rate to the electronic device in response to the magnitude of the increasing power consumption trend exceeding a power threshold.

Abstract: A liquid-cooling mechanism, or sub-system, has a thermally conductive plate in which a cooling liquid channel is disposed, and a thermally conductive pad disposed on the thermally conductive plate. An electronic device is mounted to the thermally conductive pad, such as via a mounting component, in a manner that decreases translational movement of a contact surface of the electronic device against a contact surface of the thermally conductive pad. When mounted to the thermally conductive pad, the electronic device compresses the thermally conductive pad.

Abstract: Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Abstract: Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.

Abstract: Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Abstract: Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Abstract: Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Abstract: A system includes a chassis, a plurality of nodes, a coolant distribution unit (CDU), and one or more air movers. The chassis includes multiple node bays, a CDU bay, a coolant supply manifold with an inlet in the CDU bay and an outlet in each node bay, and a coolant return manifold an inlet in each node bay and an outlet in the CDU bay. Each node is received into a node bay with an internal heat exchanger connected between a coolant supply and return manifolds. The CDU is received in the CDU bay and includes an air-to-coolant heat exchanger in fluid communication between the supply and return manifolds, and a pump for circulating a coolant through a coolant loop. The one or more air movers force air across the air-to-coolant heat exchanger of the CDU.

Abstract: A system includes a chassis, a plurality of nodes, a coolant distribution unit (CDU), and one or more air movers. The chassis includes multiple node bays, a CDU bay, a coolant supply manifold with an inlet in the CDU bay and an outlet in each node bay, and a coolant return manifold an inlet in each node bay and an outlet in the CDU bay. Each node is received into a node bay with an internal heat exchanger connected between a coolant supply and return manifolds. The CDU is received in the CDU bay and includes an air-to-coolant heat exchanger in fluid communication between the supply and return manifolds, and a pump for circulating a coolant through a coolant loop. The one or more air movers force air across the air-to-coolant heat exchanger of the CDU.

Abstract: Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Abstract: Embodiments of the invention provide a method, system and computer program product for verification of message content in a real time messaging system. The method includes contextually analyzing a thread of messages in a user interface of the real time messaging system, the thread defining a conversation between a composer and one or more recipients of the messages, the analysis determining a context of the conversation. The method further includes loading a new message to be transmitted as part of the thread, parsing text of the new message and analyzing the parsed text to determine a context. The method yet further includes comparing the determined context of the new message to the determined context of the conversation. Finally, the method includes displaying in the user interface a warning to the composer when the context of the new message differs from the context of the conversation.