Patents by Inventor Vipin Ayanoor-Vitikkate
Vipin Ayanoor-Vitikkate has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230273687Abstract: An input device comprising: a printed circuit board (PCB) comprising non-linear circuitry; resistive circuitry including a force-sensitive resistor (FSR) coupled to the PCB in parallel with the non-linear circuitry; and a hinge coupled to the PCB and the FSR configured to strain the FSR in response to a force applied to a tip of the input device.Type: ApplicationFiled: August 25, 2021Publication date: August 31, 2023Inventors: Daniel J. BECHSTEIN, Duc T. DUONG, John S. SMITH, Michael VOSGUERITCHIAN, Sinan FILIZ, Vipin AYANOOR-VITIKKATE, Vyom SHARMA
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Publication number: 20230152911Abstract: Systems, methods, and computer-readable media for enabling a power efficient stylus for an electronic device are provided. Various components may be provided for providing electrostatic discharge protection of such a stylus.Type: ApplicationFiled: March 30, 2021Publication date: May 18, 2023Inventors: Daniel J. BECHSTEIN, Blake R. MARSHALL, John S. SMITH, Vipin AYANOOR-VITIKKATE, MohammadAli KHORRAMI
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Patent number: 11460933Abstract: In some examples, a stylus can include a conductive shield. In some examples, the conductive shield can include a plurality of traces along an edge of a printed circuit board (PCB) including the stylus circuitry. In some examples, the conductive shield can include a shield can coupled to the PCB and disposed around the components of the stylus circuitry. In some examples, the conductive shield can include a hollow portion into which the stylus circuitry can be disposed and a solid portion that can act as a reference electrode. In some examples, the conductive shield can include a hollow sleeve disposed around the stylus circuitry. In some examples, the conductive sleeve can be attached to the PCB. In some examples, the conductive sleeve can be disposed between layers of a housing of the stylus. In some examples, the conductive sleeve can be integrated with the stylus housing.Type: GrantFiled: September 24, 2020Date of Patent: October 4, 2022Assignee: Apple Inc.Inventors: Daniel Jacob Benjamin Bechstein, John Stephen Smith, Siddharth Shekar, Teera Songatikamas, Elvis Mwenda Kibiti, Jared A. Brauner, Lindsay Diane Rego Corbet, Wang Chung Alston Cheung, Vipin Ayanoor-Vitikkate, Nitin Sitaraman, Joyan Gratian Sanctis, Blake R. Marshall
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Publication number: 20220091685Abstract: In some examples, a stylus can include a conductive shield. In some examples, the conductive shield can include a plurality of traces along an edge of a printed circuit board (PCB) including the stylus circuitry. In some examples, the conductive shield can include a shield can coupled to the PCB and disposed around the components of the stylus circuitry. In some examples, the conductive shield can include a hollow portion into which the stylus circuitry can be disposed and a solid portion that can act as a reference electrode. In some examples, the conductive shield can include a hollow sleeve disposed around the stylus circuitry. In some examples, the conductive sleeve can be attached to the PCB. In some examples, the conductive sleeve can be disposed between layers of a housing of the stylus. In some examples, the conductive sleeve can be integrated with the stylus housing.Type: ApplicationFiled: September 24, 2020Publication date: March 24, 2022Inventors: Daniel Jacob Benjamin BECHSTEIN, John Stephen SMITH, Siddharth SHEKAR, Teera SONGATIKAMAS, Elvis Mwenda KIBITI, Jared A. BRAUNER, Lindsay Diane Rego CORBET, Wang Chung Alston CHEUNG, Vipin AYANOOR-VITIKKATE, Nitin SITARAMAN, Joyan Gratian SANCTIS, Blake R. MARSHALL
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Publication number: 20220095443Abstract: An electrostatic discharge (ESD) robust design for an input device such as a stylus is disclosed. The input device can include one or more components, such as one or more Schottky diodes, that can be damaged by ESD events. To reduce the likelihood of damage to sensitive components, the parasitic capacitance between sensitive conductive paths and reference ground paths of the input device that could otherwise provide electrostatic discharge paths can be reduced (arranging current limiting resistance at specific locations among sensitive components, creating physical separation between sensitive conductive paths and reference ground paths), shielding can be added to shield the sensitive electronics from ESD pulses, and high dielectric breakdown material can be added to prevent ESD pulse entry or exit of not otherwise protected circuit parts.Type: ApplicationFiled: September 24, 2020Publication date: March 24, 2022Inventors: Daniel Jacob Benjamin BECHSTEIN, MohammadAli KHORRAMI, Vipin AYANOOR-VITIKKATE, Blake R. MARSHALL, Zhibin WANG, Ying CAO, Robert Ubo LIU, John Stephen SMITH
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Patent number: 10811392Abstract: A semiconductor device is disclosed including semiconductor dies stacked with an offset in two orthogonal directions. TSVs may then be formed connecting corresponding die bond pads on respective dies in the stack. By offsetting the dies in two orthogonal directions, the overall stepped offset, and consequently the size of the unused keep-out area of the stack, is reduced.Type: GrantFiled: February 27, 2019Date of Patent: October 20, 2020Assignee: Western Digital Technologies, Inc.Inventors: Toshiki Hirano, Vipin Ayanoor-Vitikkate, Nagesh Vodrahalli
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Publication number: 20200273844Abstract: A semiconductor device is disclosed including semiconductor dies stacked with an offset in two orthogonal directions. TSVs may then be formed connecting corresponding die bond pads on respective dies in the stack. By offsetting the dies in two orthogonal directions, the overall stepped offset, and consequently the size of the unused keep-out area of the stack, is reduced.Type: ApplicationFiled: February 27, 2019Publication date: August 27, 2020Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.Inventors: Toshiki Hirano, Vipin Ayanoor-Vitikkate, Nagesh Vodrahalli
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Patent number: 10153005Abstract: A hermetically-sealed container for one or more data storage devices may include a first container part or base including a planar main portion, a plurality of sidewalls extending from the main portion, and a plurality of diffusion length extender flanges extending inward or outward from a corresponding sidewall. A pressure-sensitive adhesive tape, including a layer of adhesive and a layer of low-permeability material, is positioned at the interface or edge of each flange to hermetically seal the container, whereby the diffusion length corresponding to the leakage of gas from the hermetically-sealed container corresponds generally to the width of the flange(s). The hermetically-sealed container may then be filled with a lighter-than-air gas such as helium.Type: GrantFiled: August 4, 2017Date of Patent: December 11, 2018Assignee: Western Digital Technologies, Inc.Inventors: Vipin Ayanoor-Vitikkate, Toshiki Hirano
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Patent number: 10141032Abstract: A system assembly includes a hermetically-sealed enclosure, a double-barrier sealing system comprising first and second sealing members spaced from each other, and a vacuum source that operates in the space between sealing members to generate a lower pressure in the space than in the enclosure. A lighter-than-air gas may be enclosed in the enclosure, and a plurality of non-hermetically-sealed data storage devices may be housed within the enclosure. Air, humidity, and other contaminants may be intercepted by the vacuum system rather than leak into and pollute the sealed internal environment of the storage system enclosure.Type: GrantFiled: March 8, 2018Date of Patent: November 27, 2018Assignee: Western Digital Technologies, Inc.Inventors: Darya Amin-Shahidi, Vipin Ayanoor-Vitikkate, Toshiki Hirano
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Patent number: 10121518Abstract: A hermetically-sealed container for one or more data storage devices may include a base having grooves, and corresponding sidewalls disposed within each groove, with an adhesive disposed within each groove and bonding each sidewall to the base, and with gap spacing mechanisms positioned within each groove between the corresponding sidewall and the base, thereby ensuring a gap for sufficient flow of the adhesive between each sidewall and the base. The adhesive may be a liquid-based epoxy adhesive, and whereby the spacing mechanisms enable sufficient capillary action to wet all the surfaces to form a sound hermetic bond or seal between the sidewalls and the base. The container may, then, be filled with a lighter-than-air gas such as helium.Type: GrantFiled: June 21, 2017Date of Patent: November 6, 2018Assignee: Western Digital Technologies, Inc.Inventors: Vipin Ayanoor-Vitikkate, Toshiki Hirano, Neale M. Jones
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Patent number: 10067542Abstract: A storage canister is provided. The storage canister in one example includes an enclosure, multiple Hard Disk Drives (HDDs) located within the enclosure, a plurality of mounting elements configured to receive the multiple HDDs, wherein each mounting element of the plurality of mounting elements is configured to receive a HDD, a plurality of suspension elements supporting the plurality of mounting elements, with each suspension element of the plurality of suspension elements supporting and providing vibration isolation to a corresponding HDD of the multiple HDDs, and an external connector configured to be externally accessible, with the external connector being electrically coupled to the plurality of mounting elements.Type: GrantFiled: November 2, 2017Date of Patent: September 4, 2018Assignee: Western Digital Technologies, Inc.Inventors: Darya Amin-Shahidi, Michael Stephen Bell, Toshiki Hirano, Vipin Ayanoor Vitikkate
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Publication number: 20180197581Abstract: A system assembly includes a hermetically-sealed enclosure, a double-barrier sealing system comprising first and second sealing members spaced from each other, and a vacuum source that operates in the space between sealing members to generate a lower pressure in the space than in the enclosure. A lighter-than-air gas may be enclosed in the enclosure, and a plurality of non-hermetically-sealed data storage devices may be housed within the enclosure. Air, humidity, and other contaminants may be intercepted by the vacuum system rather than leak into and pollute the sealed internal environment of the storage system enclosure.Type: ApplicationFiled: March 8, 2018Publication date: July 12, 2018Inventors: Darya Amin-Shahidi, Vipin Ayanoor-Vitikkate, Toshiki Hirano
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Publication number: 20180143670Abstract: A storage canister is provided. The storage canister in one example includes an enclosure, multiple Hard Disk Drives (HDDs) located within the enclosure, a plurality of mounting elements configured to receive the multiple HDDs, wherein each mounting element of the plurality of mounting elements is configured to receive a HDD, a plurality of suspension elements supporting the plurality of mounting elements, with each suspension element of the plurality of suspension elements supporting and providing vibration isolation to a corresponding HDD of the multiple HDDs, and an external connector configured to be externally accessible, with the external connector being electrically coupled to the plurality of mounting elements.Type: ApplicationFiled: November 2, 2017Publication date: May 24, 2018Inventors: Darya Amin-Shahidi, Michael Stephen Bell, Toshiki Hirano, Vipin Ayanoor Vitikkate
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Patent number: 9916872Abstract: A data storage system assembly includes a hermetically-sealed enclosure, a double-barrier sealing system comprising first and second sealing members spaced from each other, and a vacuum source that operates in the space between sealing members to generate a lower pressure in the space than in the enclosure. A lighter-than-air gas may be enclosed in the enclosure, and a plurality of non-hermetically-sealed data storage devices may be housed within the enclosure. Air, humidity, and other contaminants may be intercepted by the vacuum system rather than leak into and pollute the sealed internal environment of the storage system enclosure.Type: GrantFiled: December 20, 2016Date of Patent: March 13, 2018Assignee: Western Digital Technologies, Inc.Inventors: Darya Amin-Shahidi, Vipin Ayanoor-Vitikkate, Toshiki Hirano
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Patent number: 9829937Abstract: A storage canister is provided. The storage canister in one example includes an enclosure, multiple Hard Disk Drives (HDDs) located within the enclosure, a plurality of mounting elements configured to receive the multiple HDDs, wherein each mounting element of the plurality of mounting elements is configured to receive a HDD, a plurality of suspension elements supporting the plurality of mounting elements, with each suspension element of the plurality of suspension elements supporting and providing vibration isolation to a corresponding HDD of the multiple HDDs, and an external connector configured to be externally accessible, with the external connector being electrically coupled to the plurality of mounting elements.Type: GrantFiled: June 5, 2014Date of Patent: November 28, 2017Assignee: Western Digital Technologies, Inc.Inventors: Toshiki Hirano, Vipin Ayanoor Vitikkate, Michael Stephen Bell, Darya Amin-Shahidi
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Patent number: 9736940Abstract: A low permeability electrical feed-through involves a laminated structure having a conductor layer sandwiched between adjacent insulator layers, which are sandwiched between adjacent diffusion control layers, where the laminated structure provides a relatively narrow and long, high aspect ratio diffusion channel to inhibit the leakage of gas from within a sealed device to the external environment. The electrical feed-through may comprise lower and upper electrical connection pads that are positioned within different regions of the feed-through but still electrically connected by way of a first via positioned in a sealed region, the conductor layer, and a second via positioned in an external environment region.Type: GrantFiled: August 4, 2016Date of Patent: August 15, 2017Assignee: Western Digital Technologies, Inc.Inventors: Thomas R. Albrecht, Darya Amin-Shahidi, Vipin Ayanoor-Vitikkate, Toshiki Hirano
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Patent number: 9691434Abstract: Disclosed herein is one embodiment of an apparatus that includes a housing that defines an interior cavity. The housing also includes a spring aperture. The apparatus further includes a spring coupled to the housing over the spring aperture, with the spring having a deflection portion and a feedthrough aperture. The apparatus also has an electrical connector coupled to the spring and extending through the feedthrough aperture and the spring aperture. The electrical connector may have a plurality of electrical traces extending from a location external to the housing to a location within the interior cavity of the housing.Type: GrantFiled: July 29, 2016Date of Patent: June 27, 2017Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.Inventors: Toshiki Hirano, Vipin Ayanoor Vitikkate
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Patent number: 9612629Abstract: A sealed storage canister is provided. The sealed storage canister in one example includes a sealed enclosure configured to be substantially hermetically sealed for retaining a predetermined gas or gas mixture, multiple unsealed Hard Disk Drives (HDDs) located within the sealed enclosure, with the multiple unsealed HDDs configured to allow the predetermined gas or gas mixture to move through the multiple unsealed HDDs, at least one mounting element configured to receive the multiple HDDs, and an external connector configured to be externally accessible, with the external connector being directly or indirectly electrically coupled to the multiple unsealed HDDs.Type: GrantFiled: June 5, 2014Date of Patent: April 4, 2017Assignee: Western Digital Technologies, Inc.Inventors: Toshiki Hirano, Michael Stephen Bell, Darya Amin-Shahidi, Vipin Ayanoor Vitikkate
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Publication number: 20170086294Abstract: A low permeability electrical feed-through involves a laminated structure having a conductor layer sandwiched between adjacent insulator layers, which are sandwiched between adjacent diffusion control layers, where the laminated structure provides a relatively narrow and long, high aspect ratio diffusion channel to inhibit the leakage of gas from within a sealed device to the external environment. The electrical feed-through may comprise lower and upper electrical connection pads that are positioned within different regions of the feed-through but still electrically connected by way of a first via positioned in a sealed region, the conductor layer, and a second via positioned in an external environment region.Type: ApplicationFiled: August 4, 2016Publication date: March 23, 2017Inventors: Thomas R. Albrecht, Darya Amin-Shahidi, Vipin Ayanoor-Vitikkate, Toshiki Hirano
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Publication number: 20160336044Abstract: Disclosed herein is one embodiment of an apparatus that includes a housing that defines an interior cavity. The housing also includes a spring aperture. The apparatus further includes a spring coupled to the housing over the spring aperture, with the spring having a deflection portion and a feedthrough aperture. The apparatus also has an electrical connector coupled to the spring and extending through the feedthrough aperture and the spring aperture. The electrical connector may have a plurality of electrical traces extending from a location external to the housing to a location within the interior cavity of the housing.Type: ApplicationFiled: July 29, 2016Publication date: November 17, 2016Inventors: Toshiki Hirano, Vipin Ayanoor Vitikkate