Abstract: Optical cross-connect switches include input optical paths, output optical paths, and an array of electromechanical optical switches such as movable reflectors that are arranged in rows of the electromechanical optical switches and columns of the electromechanical optical switches, and that selectively move to couple the input optical paths to the output optical paths. Row address lines also are provided, a respective one of which is electromagnetically (i.e. electrically and/or optically) coupled to a respective row of the electromechanical optical switches. Column address lines also are provided, a respective one of which is electromagnetically coupled to a respective column of the electromechanical optical switches. If there are n2 electromechanical optical switches that couple n optical paths to n optical output paths, less than n2 row and column address lines may be provided. Preferably, 2n row and column address lines may be provided.

Abstract: A MEMs microactuator can be positioned in an interior region of a frame having at least one opening therein, wherein the frame expands in response to a change in temperature of the frame. A load outside the frame can be coupled to the microactuator through the at least one opening. The microactuator moves relative to the frame in response to the change in temperature to remain substantially stationary relative to the substrate. Other MEMs structures, such as latches that can engage and hold the load in position, can be located outside the frame. Accordingly, in comparison to some conventional structures, temperature compensated microactuators according to the present invention can be made more compact by having the interior region of the frame free of other MEMs structures such as latches.

Abstract: An optical connection module attaches an active or passive optical component to a substrate and aligns the optical component with a first laser. The optical connection module includes a fiber submount that is attached to the substrate and that includes a thermally insulating material having a thickness greater than 20 micrometers. The optical component is soldered to the fiber submount using heat from a second laser. A laser submount is attached to the substrate. The first laser is attached to the laser submount. A fiber bonding pad is located between the thermally insulating material and the optical component. The thermally insulating material and the fiber bonding pad promote lateral heat transfer and limit vertical heat transfer to the substrate during soldering. The thermally insulating material can be integrally formed in the substrate by flame hydrolysis or by anodic bonding.

Abstract: A MEMs structure can include a recess in a substrate, the recess having a side wall and a floor. A tail portion of a moveable reflector is on the substrate and extends beyond the side wall of the recess opposite the recess floor and is configured to rotate into the recess. A head portion of the moveable reflector extends on the substrate outside the recess.

Abstract: A microelectromechanical device comprises first and second beam members that have respective first ends connected to anchors, and that are also connected together. The first and second beam members are connected to a dielectric tether by a first tether anchor. The microelectromechanical device further comprises a third beam member that has a first end that is connected to an anchor and that is connected to the dielectric tether by a second tether anchor. At least one of the first and the second beam members are configured to elongate when the first and/or the second beam member is heated to a temperature that is greater than a temperature of the third beam member.

Abstract: A variable capacitor is provided having first and second capacitor plates, a tandem mover and an actuator. The first and second capacitor plates are positioned such that the first and second capacitor plates face one another in a spaced apart relationship. The tandem mover is configured to move the first and second capacitor plates in tandem in response to changes in ambient temperature to maintain a consistent spaced apart relationship between the capacitor plates. The actuator is then configured to vary the spaced apart relationship between the first and second capacitor plates in response to an external input. The capacitance of the variable capacitor can therefore be varied by increasing and decreasing the spaced apart relationship between the first and second capacitor plates.

Abstract: A variable capacitor is provided having first and second capacitor plates, a tandem mover and an actuator. The first and second capacitor plates are positioned such that the first and second capacitor plates face one another in a spaced apart relationship. The tandem mover is configured to move the first and second capacitor plates in tandem in response to changes in ambient temperature to maintain a consistent spaced apart relationship between the capacitor plates. The actuator is then configured to vary the spaced apart relationship between the first and second capacitor plates in response to an external input. The capacitance of the variable capacitor can therefore be varied by increasing and decreasing the spaced apart relationship between the first and second capacitor plates.

Abstract: A microelectromechanical device comprises first and second beam members that have respective first ends connected to anchors, and that are also connected together. The first and second beam members are connected to a dielectric tether by a first tether anchor. The microelectromechanical device further comprises a third beam member that has a first end that is connected to an anchor and that is connected to the dielectric tether by a second tether anchor. At least one of the first and the second beam members are configured to elongate when the first and/or the second beam member is heated to a temperature that is greater than a temperature of the third beam member.

Abstract: A MEMs microactuator can be positioned in an interior region of a frame having at least one opening therein, wherein the frame expands in response to a change in temperature of the frame. A load outside the frame can be coupled to the microactuator through the at least one opening. The microactuator moves relative to the frame in response to the change in temperature to remain substantially stationary relative to the substrate. Other MEMs structures, such as latches that can engage and hold the load in position, can be located outside the frame. Accordingly, in comparison to some conventional structures, temperature compensated microactuators according to the present invention can be made more compact by having the interior region of the frame free of other MEMs structures such as latches.