Abstract: An air inlet system for an automotive HVAC system has a housing comprising a first cylindrical segment enclosing an interior space and having a first radial surface with a first angular divergence. The first radial surface has a fresh air aperture and a recirculation aperture for radially receiving fresh air and recirculated air, respectively. The housing further comprises an outlet body with an exit aperture. A pivoting door element is mounted in the interior space and shaped as a second cylindrical segment with a second radial surface with a second angular divergence which is less than the first angular divergence. The door element has a pivot axis that allows the second radial surface to slide along the first radial surface.

Abstract: An automotive HVAC diffuser connects to a blower and a variable blower control (VBC) module having a plurality of cooling fins. An inlet receives air flow from the blower. An outlet is downstream from the inlet. An enclosed passageway is provided between the inlet and the outlet for forming a diffused air stream at the outlet. The enclosed passageway has a plurality of peripheral walls for guiding the air stream between the inlet and the outlet, including a curved outer peripheral wall corresponding to a region with a tendency for a high flow as a result of centrifugal effects. One of the peripheral walls includes a VBC receptacle formed as a depression into the peripheral wall having a substantially flat mounting surface and a first sloped side at an upstream end of the VBC receptacle to shape a portion of the diffused air stream.

Abstract: A case for an HVAC system has at least two molded shells joined together along a parting line to enclose a heat exchanger chamber, a blower chamber, and a diffuser section. The diffuser section includes a floor, a ceiling, an outer wall, and an inner wall around a longitudinal axis. The walls provide an airflow path through the diffuser between the blower and heat exchanger chamber, and the airflow path makes a substantially right angle turn into the heat exchanger chamber which results in a tendency to create a high flow region at the outer wall because of centrifugal effects. The outer wall is shaped to form a wall guide partially projecting into the airflow path in the diffuser, wherein the wall guide has an upstream encroaching surface and a downstream retreating surface so that a portion of the guided air is directed from the outer wall toward the inner wall.

Abstract: A diffuser for carrying air flow to an evaporator in an air conditioning system of an automotive vehicle includes an inlet and an outlet, a wall extending between the inlet and the outlet, and a guide vane, extending at least partially between the inlet and the outlet, spaced from the wall by a containing a control region whose area ratio changes along a length of the guide vane.

Abstract: An automotive HVAC diffuser connects to a blower and a variable blower control (VBC) module having a plurality of cooling fins. An inlet receives air flow from the blower. An outlet is downstream from the inlet. An enclosed passageway is provided between the inlet and the outlet for forming a diffused air stream at the outlet. The enclosed passageway has a plurality of peripheral walls for guiding the air stream between the inlet and the outlet, including a curved outer peripheral wall corresponding to a region with a tendency for a high flow as a result of centrifugal effects. One of the peripheral walls includes a VBC receptacle formed as a depression into the peripheral wall having a substantially flat mounting surface and a first sloped side at an upstream end of the VBC receptacle to shape a portion of the diffused air stream.

Abstract: An air inlet system for an automotive HVAC system has a housing comprising a first cylindrical segment enclosing an interior space and having a first radial surface with a first angular divergence. The first radial surface has a fresh air aperture and a recirculation aperture for radially receiving fresh air and recirculated air, respectively. The housing further comprises an outlet body with an exit aperture. A pivoting door element is mounted in the interior space and shaped as a second cylindrical segment with a second radial surface with a second angular divergence which is less than the first angular divergence. The door element has a pivot axis that allows the second radial surface to slide along the first radial surface.

Abstract: A diffuser for carrying air flow to an evaporator in an air conditioning system of an automotive vehicle includes an inlet and an outlet, a wall extending between the inlet and the outlet, and a guide vane, extending at least partially between the inlet and the outlet, spaced from the wall by a containing a control region whose area ratio changes along a length of the guide vane.

Abstract: A nozzle for a low pressure fuel injection that improves the control and size of the spray angle, as well as enhances the atomization of the fuel delivered to the cylinder for an engine, at relatively low pressures. The nozzle includes a metering plate having inner and outer exit cavities in rings spaced circumferentially about a center exit cavity.

Abstract: A fuel injector having a nozzle with depressions for increasing fluid turbulence and preventing deposit build up within the injector to increase performance, longevity and fuel economy.

Abstract: A low pressure fuel injector capable of atomizing fuel at relatively low pressure is configured to have reduced hydraulic resistance. Reduction in the hydraulic resistance minimizes the pressure drop within the fuel injector and thereby improves atomization of the fuel for improved fuel economy and performance, and decreased emissions.

Abstract: A nozzle for a low pressure fuel injection that improves the control and size of the spray angle, as well as enhances the atomization of the fuel delivered to the cylinder for an engine.

Abstract: A nozzle for a low pressure fuel injection that improves the control and size of the spray angle, as well as enhances the atomization of the fuel delivered to the cylinder for an engine.

Abstract: The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an electrical component. The system for conducting heat energy in an electronic assembly includes an electrical component, an elastically deformable member, and a housing. The elastically deformable member is placed in a compressed position between the electrical component and the housing such that the elastically deformable member is fixed into an assembled location. The elastically deformable member conducts heat energy away from the electrical component into the housing where it is dissipated into the environment. Since the compressed position fixes the location of the elastically deformable member, the system does not require a mechanical fastening to the electrical component thereby reducing thermo-mechanical fatigue.

Abstract: A liquid cooled semiconductor device is provided. The device includes a semiconductor die and a heat spreader. In one aspect of the invention, the heat spreader is mounted to a substrate such that a first side of the spreader is exposed on one side of the substrate and that a second side of the heat spreader is exposed on an opposing side of the substrate. Attached to a first side of the spreader is the semiconductor die. In another aspect of the invention, a wetting material is used to provide a thermal/electrical connection between the die and heat spreader. Sealant is provided between the die and the heat spreader to encapsulate and contain the wetting material.

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics.

Abstract: A liquid cooled semiconductor device is provided. The device includes a semiconductor die, a heat spreader, a wetting material, a sealant, a substrate, and a base. The spreader is mounted to a substrate such that a first side of the spreader is exposed on one side of the substrate and that a second side of the spreader is exposed on an opposing side of the substrate. Attached to a first side of the spreader is the semiconductor die. The wetting material is used to provide a thermal/electrical connection between the die and heat spreader. Sealant is provided between the die and the heat spreader to encapsulate and contain the wetting material. The substrate is mounted to the base, whereby the second side of the spreader is exposed to allow fluid to flow across the second side, directed within a channel defined by the base, and transfer heat away from the spreader.

Abstract: The present invention provides a circuit board including a first conductor layer forming a plurality of conductive circuit traces for interconnecting electronic components. The circuit board includes a substrate for supporting the first conductor layer and a pedestal formed from the substrate for supporting at least one of the plurality of electronic components. The pedestal provides a heat conduction path for conducting heat away from the at least one of the plurality of electronic components and a aperture in the substrate adjacent the pedestal for allowing a fluid to pass through the substrate.

Abstract: An electric machine for converting electrical energy to mechanical energy is disclosed. The electric machine includes a stator having an outer layer, a first intermediate layer, a second intermediate layer, and an inner layer. The electric machine further includes a rotor axially aligned and positioned within the stator. The rotor has at least one permanent magnet, and at least one busbar. The busbar is attached to the first intermediate layer. The busbar includes at least one bare power die in electrical communication therewith.

Abstract: Further, a system is provided for dissipating heat from a semiconductor module including a semiconductor die and the unitary heat sink. The heat sink comprising a unitary body having both a porous and non-porous portion is provided. The non-porous portion is attached to the semiconductor die and configured to transfer heat to the porous portion for dissipation into the environment. In addition, a method for manufacturing the heat sink is provided.

Abstract: A liquid cooled semiconductor device is provided. The device includes a semiconductor die, a heat spreader, a wetting material, a sealant, a substrate, and a base. The spreader is mounted to a substrate such that a first side of the spreader is exposed on one side of the substrate and that a second side of the spreader is exposed on an opposing side of the substrate. Attached to a first side of the spreader is the semiconductor die. The wetting material is used to provide a thermal/electrical connection between the die and heat spreader. Sealant is provided between the die and the heat spreader to encapsulate and contain the wetting material. The substrate is mounted to the base, whereby the second side of the spreader is exposed to allow fluid to flow across the second side, directed within a channel defined by the base, and transfer heat away from the spreader.