Abstract: A system for dissipating heat in an electronic power module is provided. The system includes a semiconductor die, a substrate, and a heat sink in which is contained a first fluid, and a conduit through which a second fluid is permitted to flow. The substrate is attached on one surface to the die and configured to conduct heat from the die. The heat sink is attached to another surface of the substrate and transfers heat from the die to the first fluid contained therein, which evaporates due to the heat provided by the substrate. The fluid is condensed on a condensing wall cooled by the second fluid, which flows across the outer surface of the condensing wall, to transport heat away from the heat sink.

Abstract: The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an electrical component. The system for conducting heat energy in an electronic assembly includes an electrical component, an elastically deformable member, and a housing. The elastically deformable member is placed in a compressed position between the electrical component and the housing such that the elastically deformable member is fixed into an assembled location. The elastically deformable member conducts heat energy away from the electrical component into the housing where it is dissipated into the environment. Since the compressed position fixes the location of the elastically deformable member, the system does not require a mechanical fastening to the electrical component thereby reducing thermo-mechanical fatigue.

Abstract: An electric machine for converting electrical energy to mechanical energy is disclosed. The electric machine includes a stator having an outer layer, a first intermediate layer, a second intermediate layer, and an inner layer. The electric machine further includes a rotor axially aligned and positioned within the stator. The rotor has at least one permanent magnet, and at least one busbar. The busbar is attached to the first intermediate layer. The busbar includes at least one bare power die in electrical communication therewith.

Abstract: The present invention provides a circuit board including a first conductor layer forming a plurality of conductive circuit traces for interconnecting electronic components. The circuit board includes a substrate for supporting the first conductor layer and a pedestal formed from the substrate for supporting at least one of the plurality of electronic components. The pedestal provides a heat conduction path for conducting heat away from the at least one of the plurality of electronic components and a aperture in the substrate adjacent the pedestal for allowing a fluid to pass through the substrate.

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics.

Abstract: A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics by causing a first insulating layer to separate from a portion of a first conductive layer of the multi-layer electronic circuit board 10 which allows for communication by and between some or all of the various component containing surfaces, and portions of the formed multi-layer electrical circuit board 10, which selectively allows components contained within and/or upon these portions and surfaces to be interconnected.

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26, and which includes grooves or troughs 20, 22 which are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures 26.

Abstract: A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.

Abstract: A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.

Abstract: A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.

Abstract: A bobbin assembly for a vehicle instrument gauge is provided. The bobbin assembly includes an upper and a lower bobbin, which together define a chamber therebetween and an axis of rotation therethrough. The bobbin assembly also includes a permanent magnet rotatably disposed within the chamber. A shaft rotatably supports the magnet within the chamber for rotative movement about the axis of rotation, and a viscous damping fluid, carried in the chamber, damps the rotational movement of the magnet. The upper bobbin includes a nose portion defining a bore therethrough which extends along the axis of rotation. The bore is open to the chamber and receives the shaft therethrough. The nose portion also defines an inner dam portion disposed within the chamber. The upper bobbin further includes a trough which is in fluid communication with the chamber and extends radially outwardly from the inner dam portion.

Abstract: A gas flow distribution system for a solder dispensing head includes a base member adapted to be connected to the solder dispensing head and a structure connected to a source of an inert gas for distributing at least one continuous stream of the inert gas radially and axially below the solder dispensing head to exclude oxygen in the surrounding air therefrom.