Abstract: The present invention provides an instrument assembly that is expandable in steps for providing precise measurement of bone gap and distraction of bone in a controlled manner. It discloses a tool performing expandable Bi-Surface Mechanism to expand a bi-compartmental structure. The disclosed system is equipped with two active surfaces (Bottom base and a top plate) between which a force is applied to move the surfaces in relation to each other for providing precise measurement of bone gap and distraction of bone in a controlled manner. Additionally, the control mechanism of the present invention includes applying direct and/or measured/graduated separation force between the two surfaces and able to deliver haptic and sensor-based feedback to the surgeon for the critical ligament tensioning and balancing aspects of the procedure.

Abstract: Methods and apparatuses for on-die logic that allow dies, such as a system-on-a-chips (SoCs), to support multiple memory devices in various die configurations. In one example, a die package comprises a first memory device and a system-on-a-chip (SoC). The SoC includes a first plurality of physical layer interfaces electrically connected to the first memory device, wherein the SoC and the first memory device are in a first die package configuration. The SoC also includes a second plurality of physical layer interfaces configured to electrically connect to a second memory device, wherein the SoC and the second memory device are in a second die package configuration In some instances, the first die package configuration is package-on-package (POP), and the second die configuration is system-in-a-package (SiP).

Abstract: A die includes a first set of physical layer (PHY) blocks arranged in a first column, wherein the first column extends along a side of the die. The die also includes a second set of PHY blocks arranged in a second column adjacent to the first column. The first set of PHY blocks include a first PHY block, the second set of PHY blocks include a second PHY block, and the first PHY block and the second PHY block share one or more clock resources.

Abstract: A method of manufacturing a structural part includes accessing memory storing code for a software tool to determine a template profile for the structural part. The method includes executing the code to cause an apparatus to execute the software tool for accessing a 3D model of the structural part. The method also includes generating a profile from the 3D model and dimensioning the profile, and accessing and searching a database for stock profiles that match search criteria that include the dimension measurements of the profile set as lower bounds of the corresponding dimension measurements. The method also includes performing a decision analysis to evaluate attributes of the matching stock profiles and identify a selected stock profile. The method also includes outputting an indication of the selected stock profile for manufacturing the structural part from a stock structural part having a cross-sectional profile corresponding to the selected stock profile.

Abstract: A system, method and device for integrating the application of acoustic resonance, as correlated with a wearer of the device, with the application of a continuous positive airway pressure system. The aspects disclosed herein are directed to improving CPAP compliance and efficacy. In various embodiments, the acoustic resonance may be applied directly to a wearer's paranasal sinus, or to an air passageway that communicates with an orifice of a person.

Abstract: A method of managing a design lifecycle of a structural part includes accessing memory storing computer-readable program code for identifying a supplier for the structural part. The method includes executing the code to cause an apparatus to identify the supplier. The method also includes generating a first design of the structural part, the first design describing a geometry of the structural part and requirements for attributes of the structural part. The method also includes performing a search of a database of existing designs for a second design based on search criteria including multiple ones of the geometry and the requirements, and selecting a design from the first design and the second design based on the search. The method also includes performing a multiple-criteria decision analysis to evaluate the design, identifying the supplier from multiple suppliers, and outputting an indication of the supplier for use in ordering of the structural part.

Abstract: A method of manufacturing a structural part includes accessing memory storing code for a software tool to determine a template profile for the structural part. The method includes executing the code to cause an apparatus to execute the software tool for accessing a 3D model of the structural part. The method also includes generating a profile from the 3D model and dimensioning the profile, and accessing and searching a database for stock profiles that match search criteria that include the dimension measurements of the profile set as lower bounds of the corresponding dimension measurements. The method also includes performing a decision analysis to evaluate attributes of the matching stock profiles and identify a selected stock profile. The method also includes outputting an indication of the selected stock profile for manufacturing the structural part from a stock structural part having a cross-sectional profile corresponding to the selected stock profile.

Abstract: The present invention provides an instrument assembly that is expandable in steps for providing precise measurement of bone gap and distraction of bone in a controlled manner. It discloses a tool performing expandable Bi-Surface Mechanism to expand a bi-compartmental structure. The disclosed system is equipped with two active surfaces (Bottom base and a top plate) between which a force is applied to move the surfaces in relation to each other for providing precise measurement of bone gap and distraction of bone in a controlled manner. Additionally, the control mechanism of the present invention includes applying direct and/or measured/graduated separation force between the two surfaces and able to deliver haptic and sensor-based feedback to the surgeon for the critical ligament tensioning and balancing aspects of the procedure.

Abstract: Apparatus having corresponding methods and non-transitory computer-readable media comprise: a wireless local-area network (WLAN) module comprising a receiver configured to receive a WLAN signal into the WLAN module; a transmitter; and a loopback controller configured to selectively loop back the WLAN signal to the transmitter, wherein the transmitter is configured to transmit the looped-back WLAN signal from the WLAN module.

Abstract: An interface input has an input circuit adapted to receive input signal levels higher than a maximum signal level that a host circuitry's electronic components can reliably handle. The input circuit shifts the level of the input signal to a desired signal level. A keeper circuit is coupled to the input circuit and maintains trigger levels of the shifted signals consistent with the input signal level.

Abstract: A first I/O pad has a first type transistor disposed at a first end of the first I/O pad. A second I/O pad has another first type transistor disposed at a first end of the second I/O pad. The first end of the first I/O pad abuts the first end of the second I/O pad, so the first type transistor is adjacent to the other first type transistor.

Abstract: A signal driver for an interface circuit has a first stage level shifter to accept input signals and output signals at a first signal level. The signal driver also has a second stage level shifter coupled to the first stage level shifter to output signals at a second signal level. Electronic components of the first and second stage level shifter have reliability limits less than the second signal level. The first and second stage configurations of the first stage level shifter and the second stage level shifter prevents exposing the electronic components to terminal to terminal signal levels higher than the reliability limits when processing signals for output at the second signal level.

Abstract: A level shifter has at least one of either a pull up or a pull down circuit. The circuit is made of electronic components with reliability limits less than a maximum signal level output by the level shifter. The level shifter also has a timing circuit coupled to at least on of either the pull up or pull down circuit. The timing circuit controls a time of application of an input signal to at least one of either the pull up or pull down circuit preventing a terminal to terminal signal level experienced by the electronic components exceeding the reliability limits.

Abstract: A multiple supply voltage device includes an input/output (I/O) network operative at a first supply voltage, a core network coupled to the I/O network and operative at a second supply voltage, and a power-on-control (POC) network coupled to the I/O network and the core network. The POC network is configured to transmit a POC signal to the I/O network and includes an adjustable current power up/down detector configured to detect a power state of the core network. The POC network also includes processing circuitry coupled to the adjustable current power up/down detector and configured to process the power state into the POC signal, and one or more feedback circuits. For reducing the leakage current while also improving the power-up/down detection speed, the feedback circuit(s) are coupled to the adjustable current power up/down detector and configured to provide feedback signals to adjust a current capacity of the adjustable current power up/down detector.

Abstract: A protection system implemented on one die of a multi-die package provides a discharge path for excess voltages incurred on one or more other die of the package. Ground paths are provided for certain circuitry in the package that have high noise-sensitivity, and ground paths are provided for certain circuitry in the package that have low noise-sensitivity relative to the high noise-sensitivity circuitry. The grounds of high noise-sensitivity circuitry of multiple die are shorted together, resulting in a common high noise-sensitivity ground. The grounds of low noise-sensitivity circuitry of multiple die are shorted together, resulting in a common low noise-sensitivity ground. A pre-designated removable path is included on the package external to the die, which shorts the common high noise-sensitivity ground and the common low noise-sensitivity ground. The removable path may be removed during manufacturing, if noise present on the shorted grounds results in unacceptable performance degradation.

Abstract: A break-before-make predriver for disabling a PFET of an output driver before enabling an NFET, and vice versa. The predriver includes an input inverter, two cross-coupled inverters, and output buffers. The predriver provides enhanced break-before-make action through sizing the NFETs larger than the PFETs in the predriver's cross-coupled inverters. The input inverter, the cross-coupled inverters and the first and second output buffers are sized with respect to each other such that substantially equal break before make action is provided on both rising and falling edges. The predriver also includes level-shifting capabilities through a different voltage supply at the PFETs of the cross-coupled inverter. The predriver also includes two data output nodes for connection to the two inputs of an output driver. The predriver provides for tristate action by disabling the signal from the predriver output nodes.

Abstract: A level detector has an input circuit adapted to accept signals of multiple signal levels for detecting a specific level. The signal levels include a first signal level and a larger second signal level. Electronic components of the input circuit have reliability levels less than the second signal level. A latch circuit is coupled to the input circuit for latching a signal consistent with a detected level of an accepted signal.

Abstract: A signal interface circuit has a signal path for communicatively coupling host circuitry to peripheral circuitry of multiple peripherals. Communication signals in the signal path are of a peripheral signal level. The signal path has electronic components adapted for use in communicating signals between the host circuitry and the peripheral circuitry. The electronic components in the signal path have reliability limits less than the peripheral signal level. The configuration of the electronic components in the signal path allow communication of signals at the peripheral signal level.

Abstract: A main die and a stacked die are included in the same component package. A transmission gate (370) is implemented on the main die, and can be enabled to receive leakage current in a connection (318) between the main die and the stacked die, and to conduct the leakage current to a bonding pad (344) that is accessible external to the package. Thus, the connectivity between the main die and the stacked die can be tested after the dies are packaged. The transmission gate is disabled during high-speed testing and normal operation. The package can also include a multiplexer (364) that is enabled during high-speed testing to input and output test signals at the package level. A direction signal is used to indicate whether test signals are being input to or output from the main die.

Abstract: A multiple supply voltage device includes an input/output (I/O) network operative at a first supply voltage, a core network coupled to the I/O network and operative at a second supply voltage, and a power-on-control (POC) network coupled to the I/O network and the core network. The POC network is configured to transmit a POC signal to the I/O network and includes an adjustable current power up/down detector configured to detect a power state of the core network. The POC network also includes processing circuitry coupled to the adjustable current power up/down detector and configured to process the power state into the POC signal, and one or more feedback circuits. For reducing the leakage current while also improving the power-up/down detection speed, the feedback circuit(s) are coupled to the adjustable current power up/down detector and configured to provide feedback signals to adjust a current capacity of the adjustable current power up/down detector.