Patents by Inventor Vivek S

Vivek S has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160269343
    Abstract: The present disclosure provides a detailed description of techniques used in systems, methods, and in computer program products for bi-directional social media broker services that connect multiple social media sites using a common management framework. The claimed embodiments address the problem of efficiently scaling and managing bidirectional interaction with multiple social media publishing channels. More specifically, the claimed embodiments are directed to approaches for a computing platform having multiple message broker modules that enable bi-directional communication of messages between a common resource manager and a plurality of social media sites. The message broker modules can receive messages in a unified message format from the common resource manager, queue the messages for asynchronous processing, translate the messages from the unified message format to a site-specific format, and deliver the translated messages to multiple social media sites.
    Type: Application
    Filed: March 10, 2015
    Publication date: September 15, 2016
    Applicant: ORACLE INTERNATIONAL CORPORATION
    Inventors: Wenhua LI, Vivek NAMA, Yizhou JIANG, Vivek S. SHAH, Natalie YOU, Eran CEDAR, Quan YUAN, Muhan ZOU, Tuo SHI
  • Publication number: 20160119350
    Abstract: Techniques to block unwanted third party calls are disclosed. In various embodiments, an indication is received that third party code included on a web page is attempting to write to the web page content associated with an unauthorized third party call. The unauthorized third party call is blocked. In some embodiments, the unauthorized third party call is blocked by blocking the web page content associated with the unauthorized third party call from being written to the web page.
    Type: Application
    Filed: September 1, 2015
    Publication date: April 28, 2016
    Inventors: Nick P. Sullivan, Vivek S. Vaidya, Tom A. Chavez
  • Patent number: 9160745
    Abstract: Techniques to block unwanted third party calls are disclosed. In various embodiments, an indication is received that third party code included on a web page is attempting to write to the web page content associated with an unauthorized third party call. The unauthorized third party call is blocked. In some embodiments, the unauthorized third party call is blocked by blocking the web page content associated with the unauthorized third party call from being written to the web page.
    Type: Grant
    Filed: May 21, 2012
    Date of Patent: October 13, 2015
    Assignee: Krux Digital, Inc.
    Inventors: Nick P. Sullivan, Vivek S. Vaidya, Tom A. Chavez
  • Publication number: 20150202293
    Abstract: The present invention relates to novel chitosan-based conjugates, e.g. nanocarriers, comprising a derivative of the biocompatible polymer chitosan conjugated to a photosensitising agent, and uses thereof in photochemical internalisation (PCI) and photodynamic therapy (PDT). The invention also relates to the use of the novel conjugates of the invention in treatment or prevention of diseases, particularly cancer, and for vaccination purposes.
    Type: Application
    Filed: May 14, 2013
    Publication date: July 23, 2015
    Applicant: PCI BIOTECH AS
    Inventors: Kristian Berg, Anders Hogset, Mar Masson, Vivek S. Gaware
  • Publication number: 20150155264
    Abstract: Semiconductor devices are described that employ techniques configured to control adhesive application between a substrate and a die. In an implementation, a sacrificial layer is provided on a top surface of the die to protect the surface, and bonds pads thereon, from spill-over of the adhesive. The sacrificial layer and spill-over adhesive are subsequently removed from the die and/or chip carrier. In an implementation, the die includes a die attach film (DAF) on a bottom surface of the die for adhering the die to the cavity of the substrate. The die is applied to the cavity with heat and pressure to cause a portion of the die attach film (DAF) to flow from the bottom surface of the die to a sloped surface of the substrate cavity.
    Type: Application
    Filed: July 8, 2014
    Publication date: June 4, 2015
    Inventors: Vivek S. Sridharan, Srikanth Kulkarni, Khanh Tran
  • Patent number: 9000587
    Abstract: A wafer-level package device and techniques for fabricating the device are described that include embedding a silicon chip onto an active device wafer or a passive device wafer, where the embedded silicon chip is a thin chip (e.g., <50 ?m). In implementations, the wafer-level package device that employs the techniques of the present disclosure includes an active device wafer, a thin integrated circuit chip, an encapsulation structure covering at least a portion of the active device wafer and the thin integrated circuit chip, a redistribution layer structure, and at least one solder bump for providing electrical interconnectivity. Once the wafer is singulated into semiconductor devices, each semiconductor device including the embedded thin integrated circuit chip may be mounted to a printed circuit board.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: April 7, 2015
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Amit S. Kelkar, Vivek S. Sridharan
  • Publication number: 20150008576
    Abstract: Semiconductor devices are described that have bump assemblies configured to furnish shock absorber functionality. In an implementation, a wafer-levelchip-scale package devices include an integrated circuit chip having an array of bump assemblies disposed over the integrated circuit chip. The array of bump assemblies comprises a plurality of first bump assemblies that include solder bumps composed at least substantially of a solder composition (i.e., solder bumps that do not include a core). The array further comprises a plurality of second bump assemblies that includes a solder bump having a core configured to furnish shock absorber functionality to the integrated circuit chip.
    Type: Application
    Filed: March 4, 2014
    Publication date: January 8, 2015
    Applicant: MAXIM INTEGRATED PRODUCTS, INC.
    Inventors: Viren Khandekar, Karthik Thambidurai, Vivek S. Sridharan
  • Patent number: 8878350
    Abstract: Semiconductor devices are described that include a semiconductor device having multiple, stacked die on a substrate (e.g., a semiconductor wafer). In one or more implementations, wafer-level package devices that employ example techniques in accordance with the present disclosure include an ultra-thin semiconductor wafer with metallization and vias formed in the wafer and an oxide layer on the surface of the wafer, an integrated circuit chip placed on the semiconductor wafer, an underfill layer between the integrated circuit chip and the semiconductor wafer, a buffer material formed on the semiconductor wafer, the underfill layer, and at least one side of the integrated circuit chip, an adhesive layer placed on the buffer layer and the integrated circuit chip, and a stiffener layer placed on the adhesive layer. The semiconductor device may then be segmented into individual semiconductor chip packages.
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: November 4, 2014
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Vivek S. Sridharan, Amit S. Kelkar, Peter R. Harper
  • Publication number: 20140306337
    Abstract: Semiconductor devices are described that include a semiconductor device having multiple, stacked die on a substrate (e.g., a semiconductor wafer). In one or more implementations, wafer-level package devices that employ example techniques in accordance with the present disclosure include an ultra-thin semiconductor wafer with metallization and vias formed in the wafer and an oxide layer on the surface of the wafer, an integrated circuit chip placed on the semiconductor wafer, an underfill layer between the integrated circuit chip and the semiconductor wafer, a buffer material formed on the semiconductor wafer, the underfill layer, and at least one side of the integrated circuit chip, an adhesive layer placed on the buffer layer and the integrated circuit chip, and a stiffener layer placed on the adhesive layer. The semiconductor device may then be segmented into individual semiconductor chip packages.
    Type: Application
    Filed: September 13, 2013
    Publication date: October 16, 2014
    Inventors: Vivek S. Sridharan, Amit S. Kelkar, Peter R. Harper
  • Publication number: 20140174741
    Abstract: Disclosed herein are settable compositions and methods of using settable compositions in a wellbore. In one embodiment a method of introducing a settable composition into a wellbore is described. The method comprises providing a settable composition comprising pumice, hydrated lime, a set retarder, and water. Introducing the settable composition into a wellbore. Allowing the settable composition to remain static in the wellbore, wherein the settable composition remains in a pumpable fluid state for a period of about 1 day or longer while static in the wellbore.
    Type: Application
    Filed: February 28, 2014
    Publication date: June 26, 2014
    Applicant: HALLIBURTON ENERGY SERVICES, INC.
    Inventors: Kyriacos Agapiou, Juan Humberto Martinez, Thomas Jason Pisklak, Vivek S. Goel, Lance Everett Brothers, Benjamin John Iverson
  • Publication number: 20140019224
    Abstract: An electronic card device includes a Radio Frequency (RF) circuit configured to receive information from a remote broadcast transmitter, a memory associated with the RF circuit to store a unique identifier of the electronic card device, and a processor communicatively coupled to the memory. The processor is configured to enable reception of the information from the remote broadcast transmitter based on the unique identifier of the electronic card device in the memory to generate data configured to facilitate consumer activity on part of a user of the electronic card device through the electronic card device. Also, the electronic card device includes a display unit integrated therewith configured to display output data related to the data generated through the processor.
    Type: Application
    Filed: July 10, 2012
    Publication date: January 16, 2014
    Applicant: Vu Cast Media Inc
    Inventors: SERGIO DE ACHA, Vivek S. Pendharkar, Michael Quinn, Tamil Vengan, Prashant Kanhere, Murali Chirala, Derek Kumar
  • Patent number: 8583625
    Abstract: The illustrative embodiments described herein are directed to a system, methods, and computer program product, for network acceleration and efficient indexing for caching file systems. For example, the disclosed embodiments achieve (1) high compression rate, (2) low disk seeks, and (3) low memory pressure using by introducing novel features such as, but not limited to, multi-resolution chunking and intelligent load shedding. In addition, the disclosed embodiments introduces a family of HashCache policies that enable large size web caching with little or no use of main memory.
    Type: Grant
    Filed: March 20, 2010
    Date of Patent: November 12, 2013
    Assignee: The Trustees of Princeton
    Inventors: Larry L. Peterson, Vivek S. Pai, Sunghwan Ihm, Anirudh Badam, KyoungSoo Park
  • Publication number: 20120102009
    Abstract: The illustrative embodiments described herein are directed to a system, methods, and computer program product, for network acceleration and efficient indexing for caching file systems. For example, the disclosed embodiments achieve (1) high compression rate, (2) low disk seeks, and (3) low memory pressure using by introducing novel features such as, but not limited to, multi-resolution chunking and intelligent load shedding. In addition, the disclosed embodiments introduces a family of HashCache policies that enable large size web caching with little or no use of main memory.
    Type: Application
    Filed: March 20, 2010
    Publication date: April 26, 2012
    Applicant: THE TRUSTEES OF PRINCETON UNIVERSITY
    Inventors: Larry L. Peterson, Vivek S. Pai, Sunghwan Ihm, Anirudh Badam, KyoungSoo Park
  • Publication number: 20100318418
    Abstract: Computer-readable media, computer systems, and computing devices for responding to advertising inventory queries that specify frequency caps limiting the number of impressions that are shown to a unique user. Impression logs are retrieved from logging servers and processed to generate a unique user distribution that provides information regarding the numbers of unique users that receive ad impressions at a specified location and during a specified time period. Estimates of frequency-capped capacity to fulfill a booking request and estimates of frequency-capped availability of inventory are computed using the unique user distribution.
    Type: Application
    Filed: June 16, 2009
    Publication date: December 16, 2010
    Applicant: MICROSOFT CORPORATION
    Inventors: DAVID L. WERTHEIMER, MANAN SANGHI, ROOPAK GUPTA, VIVEK S. VAIDYA, JAMES P. BEKEMEIER, MICHAEL J. GOLDBACH
  • Patent number: 7662405
    Abstract: This invention provides methods and compositions for localized delivery of IL-12 to a desired site. The composition comprises liposomes carrying IL-12. The liposomes comprise phosphatidyl choline, phosphatidyl glycerol and cholesterol. The size and composition of the liposomes is such that there is minimal leakage into the systemic circulation. These compositions can be used for delivery of IL-12 to selected sites such as tumors.
    Type: Grant
    Filed: August 9, 2006
    Date of Patent: February 16, 2010
    Assignee: The Research Foundation of State University of New York
    Inventors: Sathy V. Balu-Iyer, Richard B. Bankert, Vivek S. Purohit
  • Publication number: 20090197837
    Abstract: Disclosed is a liquid, oral dosage form comprising alendronic acid or pharmaceutically acceptable salts thereof, a process for the preparation of such liquid dosage forms, and use thereof.
    Type: Application
    Filed: February 4, 2009
    Publication date: August 6, 2009
    Inventors: Vivek S. Desai, Yogeeta Suresh Narkar
  • Patent number: 7351688
    Abstract: Methods and composition are described for low immunogenic protein, polypeptide or peptide formulations. The method comprises forming complexes of the protein, polypeptide or peptide with a binding agent which can be a serine containing compound or other phosphatidyl compounds or phospholipids. The complexes formed include simple complexes, micelles, cochleate structures, liposomes, non-bilayer and novel lipidic structures. The antigenicity and imminogenicity of the protein, polypeptides or peptides is reduced upon formation of such complexes.
    Type: Grant
    Filed: February 2, 2005
    Date of Patent: April 1, 2008
    Assignee: The Research Foundation of State University of New York
    Inventors: Sathyamangalam V. Balasubramanian, Robert M. Straubinger, Vivek S. Purohit, Karthik Ramani
  • Patent number: 7231494
    Abstract: The invention provides a storage and retrieval routine for Web objects. A Web page typically includes several objects such as text, images and hyper-links to other Web pages. Each Web page and its objects are usually stored in separate files. A storage and retrieval routine stores objects that correspond to the same Web page in co-located positions on a disk. Therefore, when the Web page and its embedded and hyper-linked Web objects are retrieved, the seek time is reduced, thereby reducing the object retrieval time as perceived by a computer user and increasing the number of requests per second that a Web content server can deliver.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: June 12, 2007
    Assignee: Ironport System, Inc.
    Inventors: Alan L. Cox, Y. Charlie Hu, Vijay S. Pai, Vivek S. Pai, Willy Zwaenepoel
  • Publication number: 20040229793
    Abstract: Composition and methods are described for low immunogenic protein formulations. An example of such a protein is antihemophilic factor (FVIII). The composition generally includes the protein, polypeptide or peptide, one or more agents that bind to epitope domains of the proteins to form a complex. Buffers containing salts may be used to stabilize this interaction. For example, Factor VIII and serine containing phospholipids in buffer salts containing Ca2+ and Na+ can be used to prepare protein-lipid structures. These complexes are useful for treatment of diseases such as Hemophilia. A method for the formation of novel non-liposomal structures is also disclosed.
    Type: Application
    Filed: February 5, 2004
    Publication date: November 18, 2004
    Inventors: Sathyamangalam V. Balasubramanian, Robert M. Straubinger, Vivek S. Purohit, Karthik Ramani
  • Publication number: 20040046781
    Abstract: A movie description language which enables objects and the corresponding transformation rules to be specified, and a corresponding movie to be played. An object may be specified by attributes such as shape, size, color, location, illumination, texture. Transformation rules specify change of any of the attributes on a time scale (including frame count). In addition, many instances of an object may be instantiated with different transformation rules. A real time video rendering device receives the movie data (including instance/object definitions and transformation rules) and plays the corresponding movie.
    Type: Application
    Filed: September 5, 2002
    Publication date: March 11, 2004
    Applicant: Texas Instruments Incorporated
    Inventor: Vivek S. Nittoor