Patents by Inventor Vivekananda P. Adiga

Vivekananda P. Adiga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220209770
    Abstract: Devices and/or computer-implemented methods to facilitate a programmable and/or reprogrammable quantum circuit are provided. According to an embodiment, a device can comprise a superconducting coupler device having a superconducting fuse device that is used to alter the coupling of a first quantum computing element and a second quantum computing element.
    Type: Application
    Filed: December 24, 2020
    Publication date: June 30, 2022
    Inventors: Elbert Emin Huang, Charles Thomas Rettner, Michael Justin Beckley, Russell A. Budd, Vivekananda P. Adiga, David C. Mckay, Sarah Elizabeth Sheldon
  • Publication number: 20220158068
    Abstract: The subject disclosure is directed towards layered substrate structures with aligned optical access to electrical devices formed thereon for laser processing and electrical device tuning. According to an embodiment, a layered substrate structure is provided that comprises an optical substrate having a first surface and a second surface and a patterned bonding layer formed on the second surface that comprises a bonding region and an open region, wherein the open region exposes a portion of the second surface. The layered substrate structure further comprises a device chip bonded to the patterned bonding layer via the bonding region and comprising at least one electrical component aligned with the optical substrate and the open region. The at least one electrical component can include for example, a thin film wire, an air bridge, a qubit, an electrode, a capacitor or a resonator.
    Type: Application
    Filed: November 13, 2020
    Publication date: May 19, 2022
    Inventors: Stephen M. Gates, Russell A. Budd, Kevin Shawn Petrarca, Vivekananda P. Adiga, Douglas Max Gill
  • Publication number: 20220149263
    Abstract: Techniques regarding encapsulating one or more superconducting devices of a quantum processor are provided. For example, one or more embodiments described herein can regard a method that can comprise depositing a metal fluoride layer onto a superconducting resonator and a silicon substrate that can be comprised within a quantum processor. The superconducting resonator can be positioned on the silicon substrate. Also, the metal fluoride layer can coat the superconducting resonator.
    Type: Application
    Filed: October 13, 2021
    Publication date: May 12, 2022
    Inventors: Richard Alan Haight, Vivekananda P. Adiga, Martin O. Sandberg, Hanhee Paik
  • Publication number: 20220123195
    Abstract: Devices, systems, methods, and/or computer-implemented methods that can facilitate protection of a substrate in a qubit device using sacrificial material are provided. According to an embodiment, a device can comprise a superconducting lead provided on a pillar of a sacrificial material provided on a substrate. The device can further comprise a collapsed superconducting junction provided on the substrate and coupled to the superconducting lead.
    Type: Application
    Filed: October 15, 2020
    Publication date: April 21, 2022
    Inventors: Vivekananda P. Adiga, Martin S. Sandberg, Jeng-Bang Yau, David L. Rath, John Bruley, Cihan Kurter, Kenneth P. Rodbell, Hongwen Yan
  • Patent number: 11289638
    Abstract: A method for improving lifetime and coherence time of a qubit in a quantum mechanical device is provided. The method includes providing a substrate having a frontside and a backside, the frontside having at least one qubit formed thereon, the at least one qubit having capacitor pads. The method further includes at least one of removing an amount of substrate material from the backside of the substrate at an area opposite the at least one qubit or depositing a superconducting metal layer at the backside of the substrate at the area opposite the at least one qubit to reduce radiofrequency electrical current loss due to at least one of silicon-air (SA) interface, metal-air (MA) interface or silicon-metal (SM) interface so as to enhance a lifetime (T1) and a coherence time (T2) in the at least one qubit.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: March 29, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Douglas Max Gill, Martin O. Sandberg, Vivekananda P. Adiga, Yves Martin, Hanhee Paik
  • Patent number: 11289637
    Abstract: A qubit includes a substrate, and a first capacitor structure having a lower portion formed on a surface of the substrate and at least one first raised portion extending above the surface of the substrate. The qubit further includes a second capacitor structure having a lower portion formed on the surface of the substrate and at least one second raised portion extending above the surface of the substrate. The first capacitor structure and the second capacitor structure are formed of a superconducting material. The qubit further includes a junction between the first capacitor structure and the second capacitor structure. The junction is disposed at a predetermined distance from the surface of the substrate and has a first end in contact with the first raised portion and a second end in contact with the second raised portion.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: March 29, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Vivekananda P. Adiga, Martin O. Sandberg, Jerry M. Chow, Hanhee Paik
  • Patent number: 11223005
    Abstract: Techniques regarding parallel gradiometric SQUIDs and the manufacturing thereof are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise a first pattern of superconducting material located on a substrate. Also, the apparatus can comprise a second pattern of superconducting material that can extend across the first pattern of superconducting material at a position. Further, the apparatus can comprise a Josephson junction located at the position, which can comprise an insulating barrier that can connect the first pattern of superconductor material and the second pattern of superconductor material.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: January 11, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Martin O. Sandberg, Vivekananda P. Adiga, Hanhee Paik
  • Publication number: 20210399199
    Abstract: Systems and techniques that facilitate spurious junction prevention via in-situ ion milling are provided. In various embodiments, a method can comprise forming a tunnel barrier of a Josephson junction on a substrate during a shadow evaporation process. In various instances, the method can further comprise etching an exposed portion of the tunnel barrier during the shadow evaporation process. In various embodiments, the shadow evaporation process can comprise patterning a resist stack onto the substrate. In various instances, the etching the exposed portion of the tunnel barrier can leave a protected portion of the tunnel barrier within a shadow of the resist stack. In various instances, the shadow of the resist stack can be based on a direction of the etching the exposed portion of the tunnel barrier.
    Type: Application
    Filed: June 22, 2020
    Publication date: December 23, 2021
    Inventors: Vivekananda P. Adiga, Martin O. Sandberg, Jeng-Bang Yau, Keith Fogel, John Bruley, Markus Brink, Benjamin Wymore
  • Publication number: 20210399192
    Abstract: A method for improving lifetime and coherence time of a qubit in a quantum mechanical device is provided. The method includes providing a substrate having a frontside and a backside, the frontside having at least one qubit formed thereon, the at least one qubit having capacitor pads. The method further includes at least one of removing an amount of substrate material from the backside of the substrate at an area opposite the at least one qubit or depositing a superconducting metal layer at the backside of the substrate at the area opposite the at least one qubit to reduce radiofrequency electrical current loss due to at least one of silicon-air (SA) interface, metal-air (MA) interface or silicon-metal (SM) interface so as to enhance a lifetime (T1) and a coherence time (T2) in the at least one qubit.
    Type: Application
    Filed: June 22, 2020
    Publication date: December 23, 2021
    Inventors: Douglas Max Gill, Martin O. Sandberg, Vivekananda P. Adiga, Yves Martin, Hanhee Paik
  • Patent number: 11189435
    Abstract: Devices, systems, methods, computer-implemented methods, apparatus, and/or computer program products that can facilitate a switch device that shifts frequency of a resonator in a quantum device are provided. According to an embodiment, a device can comprise a readout resonator coupled to a qubit. The device can further comprise a switch device formed across the readout resonator that shifts frequency of the readout resonator based on position of the switch device. According to another embodiment, a device can comprise a bus resonator coupled to a plurality of qubits. The device can further comprise a switch device formed across the bus resonator that shifts frequency of the bus resonator based on position of the switch device.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: November 30, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Vivekananda P. Adiga, Martin O. Sandberg, Firat Solgun, Jerry M. Chow
  • Patent number: 11158782
    Abstract: Techniques regarding encapsulating one or more superconducting devices of a quantum processor are provided. For example, one or more embodiments described herein can regard a method that can comprise depositing a metal fluoride layer onto a superconducting resonator and a silicon substrate that can be comprised within a quantum processor. The superconducting resonator can be positioned on the silicon substrate. Also, the metal fluoride layer can coat the superconducting resonator.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: October 26, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Richard Alan Haight, Vivekananda P. Adiga, Martin O. Sandberg, Hanhee Paik
  • Patent number: 11145801
    Abstract: Techniques regarding encapsulating one or more superconducting devices of a quantum processor are provided. For example, one or more embodiments described herein can regard a method that can comprise depositing an adhesion layer onto a superconducting resonator and a silicon substrate that are comprised within a quantum processor. The superconducting resonator can be positioned on the silicon substrate. Also, the adhesion layer can comprise a chemical compound having a thiol functional group.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: October 12, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Richard Alan Haight, Ali Afzali-Ardakani, Vivekananda P. Adiga, Martin O. Sandberg, Hanhee Paik
  • Patent number: 11126776
    Abstract: A system includes a memory that stores computer executable components, and a processor executes the computer executable components stored in the memory. The computer executable components comprise: an assessment component that determines locations for mode suppression structures on a coplanar waveguide of a quantum chip having qubits; a simulation component that simulates performance of the quantum chip based on a subset of the locations for the mode suppression structures and parameters of the quantum chip, and generates a mode suppression structures placement model. A template component generates a template of specific coordinates for placement of a subset of the mode suppression structures on the quantum chip based on the mode suppression structures placement model; and a driver component employs the template to drive an auto-bonder to install the subset of the mode suppression structures on the quantum chip at the specific coordinates.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: September 21, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore Bernardo Olivadese, Vivekananda P. Adiga, Jared Barney Hertzberg
  • Patent number: 11121304
    Abstract: A method of making a Josephson junction for a superconducting qubit includes providing a substructure having a surface with first and second trenches perpendicular to each other defined therein. The method further includes evaporating a first superconducting material to deposit the first superconducting material and evaporating a second superconducting material to deposit the second superconducting material in the first trench to provide a first lead, and forming an oxidized layer on the first and second superconducting materials. The method includes evaporating a third superconducting material at an angle substantially perpendicular to the surface of the substructure to deposit the third superconducting material in the second trench without rotating the substructure to form a second lead. A vertical Josephson junction is formed at the intersection of the first and second trenches electrically connected through the first lead and through the second lead.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: September 14, 2021
    Assignee: International Business Machines Corporation
    Inventors: Vivekananda P. Adiga, Benjamin B. Wymore, Keith Fogel, Martin O. Sandberg
  • Publication number: 20210280633
    Abstract: Devices, systems, and/or methods that can facilitate local heating of a superconducting flux biasing loop are provided. According to an embodiment, a device can comprise a substrate having a superconducting flux bias circuit comprising a biasing loop coupled to a flux controlled qubit device. The device can further comprise a heating device coupled to the biasing loop.
    Type: Application
    Filed: March 4, 2020
    Publication date: September 9, 2021
    Inventors: Rasit Onur Topaloglu, Vivekananda P. Adiga, Martin O. Sandberg
  • Publication number: 20210280764
    Abstract: Devices, systems, and/or methods that can facilitate local heating of a superconducting flux biasing loop are provided. According to an embodiment, a method can comprise forming on a substrate a biasing loop and a flux controlled qubit device of a superconducting flux bias circuit. The method can further comprise forming a heating device on the substrate to couple the heating device to the biasing loop.
    Type: Application
    Filed: March 4, 2020
    Publication date: September 9, 2021
    Inventors: Rasit Onur Topaloglu, Vivekananda P. Adiga, Martin O. Sandberg
  • Publication number: 20210264308
    Abstract: A resonator is based on a coplanar waveguide (CPW) structure that includes a first end portion having a first width and configured to be coupled to a first qubit. There is a a middle portion having a second width that is narrower than the first width. There is a second end portion having a third width that is wider than the second width and configured to be coupled to a second qubit.
    Type: Application
    Filed: February 26, 2020
    Publication date: August 26, 2021
    Inventors: Martin O. Sandberg, Vivekananda P. Adiga, Hanhee Paik
  • Publication number: 20210249582
    Abstract: Devices, methods, and/or computer-implemented methods that can facilitate formation of a self assembled monolayer on a quantum device are provided. According to an embodiment, a device can comprise a qubit formed on a substrate. The device can further comprise a self assembled monolayer formed on the qubit.
    Type: Application
    Filed: February 7, 2020
    Publication date: August 12, 2021
    Inventors: Ali Afzali-Ardakani, Richard Alan Haight, Martin O. Sandberg, Vivekananda P. Adiga
  • Patent number: 11088310
    Abstract: On a first superconducting layer deposited on a first surface of a substrate, a first component of a resonator is pattered. On a second superconducting layer deposited on a second surface of the substrate, a second component of the resonator is patterned. The first surface and the second surface are disposed relative to each other in a non-co-planar disposition. In the substrate, a recess is created, the recess extending from the first superconducting layer to the second superconducting layer. On an inner surface of the recess, a third superconducting layer is deposited, the third superconducting layer forming a superconducting path between the first superconducting layer and the second superconducting layer. Excess material of the third superconducting layer is removed from the first surface and the second surface, forming a completed through-silicon via (TSV).
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: August 10, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Joshua M. Rubin, Jared Barney Hertzberg, Sami Rosenblatt, Vivekananda P. Adiga, Markus Brink, Arvind Kumar
  • Publication number: 20210234085
    Abstract: A method for adjusting a resonance frequency of a qubit in a quantum mechanical device includes providing a substrate having a frontside and a backside, the frontside having at least one qubit formed thereon, the at least one qubit comprising capacitor pads; and removing substrate material from the backside of the substrate at an area opposite the at least one qubit to alter a capacitance around the at least one qubit so as to adjust a resonance frequency of the at least one qubit.
    Type: Application
    Filed: January 24, 2020
    Publication date: July 29, 2021
    Inventors: Douglas M. Gill, Martin O. Sandberg, Vivekananda P. Adiga, Jason S. Orcutt, Jerry M. CHOW