Abstract: A method for achieving voltage-controlled gate-modulated light emission using monolithic integration of fin- and nanowire-n-i-n vertical FETs with bottom-tunnel junction planar InGaN LEDs is described. This method takes advantage of the improved performance of bottom-tunnel junction LEDs over their top-tunnel junction counterparts, while allowing for strong gate control on a low-cross-sectional area fin or wire without sacrificing LED active area as in lateral integration designs. Electrical modulation of 5 orders, and an order of magnitude of optical modulation are achieved in the device.

Abstract: A DUV-LED including a bottom substrate, a n-contact/injection layer formed on the bottom substrate, a p-contact region, and an emitting active region between the n-contact/injection layer and the contact region. The emitting active region includes at least one GaN quantum heterostructure. The at least one GaN quantum heterostructures is sized and shaped to determine a certain emission wavelength. Preferably, the certain emission wavelength is in a range of approximately 219-280 nm. In one embodiment, the size is controlled by precisely controlling parameters selected from the group consisting of: an epitaxial deposition time; a Ga/N ratio; a thermal annealing time; a temperature during deposition; and combinations thereof.

Abstract: A polarization field assisted DUV-LED including a bottom substrate and a n-contact/injection layer formed on the bottom substrate. The n-contact/injection layer includes: a first region for accommodating strain relaxation; a second region for lateral access with a low sheet resistance and higher conductivity compared to the first region to minimize resistive losses and heat generation; and a third region of a graded vertical injection layer with low vertical resistance to minimize heat loss due to vertical resistance. The DUV-LED also includes a p-contact region, and an emitting active region between the n-contact/injection layer and the p-contact region. The injection of electrons and holes into quantum wells proceeds due to tunneling of electrons and holes under the barriers due to less than 2 nm thickness of barriers. This carrier injection lowers the Turn ON voltage of LEDs and reduces heat generation.

Abstract: A DUV-LED including a bottom substrate, a n-contact/injection layer formed on the bottom substrate, a p-contact region, and an emitting active region between the n-contact/injection layer and the contact region. The emitting active region includes at least one GaN quantum heterostructure. The at least one GaN quantum heterostructures is sized and shaped to determine a certain emission wavelength. Preferably, the certain emission wavelength is in a range of approximately 219-280 nm. In one embodiment, the size is controlled by precisely controlling parameters selected from the group consisting of: an epitaxial deposition time; a Ga/N ratio; a thermal annealing time; a temperature during deposition; and combinations thereof.

Abstract: A polarization field assisted DUV-LED including a bottom substrate and a n-contact/injection layer formed on the bottom substrate. The n-contact/injection layer includes: a first region for accommodating strain relaxation; a second region for lateral access with a low sheet resistance and higher conductivity compared to the first region to minimize resistive losses and heat generation; and a third region of a graded vertical injection layer with low vertical resistance to minimize heat loss due to vertical resistance. The DUV-LED also includes a p-contact region, and an emitting active region between the n-contact/injection layer and the p-contact region. The injection of electrons and holes into quantum wells (dots, discs) proceeds due to tunneling of electrons and holes under the barriers due to less than 2 nm thickness of barriers. This carrier injection lowers the Turn ON voltage of LEDs and reduces heat generation compared with conventional thermionic over-barrier injection.