Patents by Inventor Wade Sonnenberg
Wade Sonnenberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7384535Abstract: Analytical methods are disclosed for determining the quantity of brightener and leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. The methods improve the reproducibility of measuring brighteners and levelers in electroplating baths.Type: GrantFiled: April 24, 2004Date of Patent: June 10, 2008Assignee: Rohm and Haas Electronic Materials LLCInventors: Wade Sonnenberg, Leon R. Barstad, Raymond Cruz, Gary Hamm, Mark J. Kapeckas, Erik Reddington, Katie Price, Thomas Buckley, Trevor Goodrich
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Publication number: 20060151327Abstract: Analytical methods are disclosed for determining the quantity of organic components in a bath. The analytical methods work over a broad concentration range of organic components and are sensitive in measuring organic bath components at low concentrations.Type: ApplicationFiled: April 24, 2004Publication date: July 13, 2006Applicant: Rohm and Haas Electronic Materials, L.L.C.Inventors: Wade Sonnenberg, Leon Barstad, Raymond Cruz, Gary Hamm, Mark Kapeckas, Erik Reddington, Katie Price, Thomas Buckley, Trevor Goodrich
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Publication number: 20060081475Abstract: A composition and method for electroplating a metal on a substrate. The composition has a chloride to brightener concentration ratio of from 20:1 to 125:1. The method of electroplating, which employs the composition, employs pulse patterns that improve physical properties of metal surfaces.Type: ApplicationFiled: November 30, 2005Publication date: April 20, 2006Applicant: Shipley Company, L.L.C.Inventors: Leon Barstad, Thomas Buckley, Raymond Cruz, Trevor Goodrich, Gary Hamm, Mark Kapeckas, Katie Price, Erik Reddington, Wade Sonnenberg
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Publication number: 20050155866Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.Type: ApplicationFiled: November 24, 2003Publication date: July 21, 2005Applicant: Shipley Company, L.L.C.Inventors: David Gabe, Andrew Cobley, Leon Barstad, Mark Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley
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Publication number: 20050139118Abstract: A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.Type: ApplicationFiled: December 29, 2004Publication date: June 30, 2005Applicant: SHIPLEY COMPANY, L.L.C.Inventors: Andrew Cobley, Mark Kapeckas, Erik Reddington, Wade Sonnenberg, Leon Barstad, Thomas Buckley
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Patent number: 6911068Abstract: A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.Type: GrantFiled: October 2, 2001Date of Patent: June 28, 2005Assignee: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Patent number: 6899829Abstract: A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.Type: GrantFiled: November 30, 2001Date of Patent: May 31, 2005Assignee: Shipley Company, L.L.C.Inventors: James G. Shelnut, Wade Sonnenberg, Patrick J. Houle
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Publication number: 20050016858Abstract: A composition and method for electroplating a metal on a substrate. The composition has a chloride to brightener concentration ratio of from 20:1 to 125:1. The method of electroplating, which employs the composition, employs pulse patterns that improve physical properties of metal surfaces.Type: ApplicationFiled: December 19, 2003Publication date: January 27, 2005Applicant: Shipley Company, L.L.C.Inventors: Leon Barstad, Thomas Buckley, Raymond Cruz, Trevor Goodrich, Gary Hamm, Mark Kapeckas, Katie Price, Erik Reddington, Wade Sonnenberg
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Publication number: 20050016856Abstract: Analytical methods are disclosed for determining the quantity of brightener and leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. The methods improve the reproducibility of measuring brighteners and levelers in electroplating baths.Type: ApplicationFiled: April 24, 2004Publication date: January 27, 2005Applicant: Rohm and Haas Electronic Materials, L.L.C.Inventors: Wade Sonnenberg, Leon Barstad, Raymond Cruz, Gary Hamm, Mark Kapeckas, Erik Reddington, Katie Price, Thomas Buckley, Trevor Goodrich
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Patent number: 6827839Abstract: Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.Type: GrantFiled: November 2, 2001Date of Patent: December 7, 2004Assignee: Shipley Company, L.L.C.Inventors: Wade Sonnenberg, Mark J. Kapeckas, David L. Jacques, Raymond Cruz, Leon R. Barstad, Elie H. Najjar, Eugene N. Step, Robert A. Binstead
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Publication number: 20040206631Abstract: A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.Type: ApplicationFiled: October 2, 2001Publication date: October 21, 2004Applicant: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Patent number: 6773573Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.Type: GrantFiled: October 2, 2001Date of Patent: August 10, 2004Assignee: Shipley Company, L.L.C.Inventors: David R. Gabe, Andrew J. Cobley, Leon R. Barstad, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley
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Patent number: 6752878Abstract: A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous wetting agent composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. The method can be employed in the circuit board industry to improve bonding between layers in multilayer circuit boards.Type: GrantFiled: September 19, 2001Date of Patent: June 22, 2004Assignee: Shipley Company, L.L.C.Inventors: Joseph R. Montano, Wade Sonnenberg, Mark J. Kapeckas
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Publication number: 20040104124Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as ductility, micro-throwing power and micro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.Type: ApplicationFiled: November 24, 2003Publication date: June 3, 2004Applicant: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Patent number: 6736954Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.Type: GrantFiled: October 2, 2001Date of Patent: May 18, 2004Assignee: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Publication number: 20040074778Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, platinum, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.Type: ApplicationFiled: October 10, 2003Publication date: April 22, 2004Applicant: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Patent number: 6652731Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.Type: GrantFiled: October 2, 2001Date of Patent: November 25, 2003Assignee: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Publication number: 20030102226Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.Type: ApplicationFiled: October 2, 2001Publication date: June 5, 2003Applicant: Shipley Company, L.L.C.Inventors: David R. Gabe, Andrew J. Cobley, Leon R. Barstad, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley
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Publication number: 20030085132Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.Type: ApplicationFiled: October 2, 2001Publication date: May 8, 2003Applicant: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Publication number: 20030070934Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.Type: ApplicationFiled: October 2, 2001Publication date: April 17, 2003Applicant: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley