Abstract: An automated high speed test solution for Quad Flat Pack device packages that enables connectivity between test equipment and the integrated circuit under test is described. A test probe geometry that provides highly repeatable and reliable connections suitable for use with consumer grade QFP devices coupled with ease of maintenance is provided. In some embodiments, the probe tip ends are chisel-shaped. The probes can be slightly slanted with respect to a vertical axis of the probe retaining block.

Abstract: Embodiments of the present invention provide testing systems with liquid cooled thermal arrays that can pivot freely in three dimensions allowing surfaces to be brought into even, level, and secure contact, thereby preventing air gaps between surfaces and improving thermal performance. In this way, more DUTs can be tested in parallel within a small test space, overall costs of the test system are reduced, and greater cooling capacity can be provided for testing high-powered devices. Gimbaled mounts can be disposed on a bottom surface of individual thermal interface boards (TIBs) of a test system, and/or on top of individual thermal heads of a thermal array (TA) having a common cold plate (or having multiple cold plates).

Abstract: Embodiments of the present invention provide a gimbaling socket structure that uses tension to bring a device under test (DUT) disposed in the socket into secure contact with a liquid cooled thermal array or the like to cool the DUT during testing. The gimbaling socket structure is secured to a tension spring and can move freely in 3 dimensions to bring the surfaces of the DUT and the thermal array (or components thereof, such as TEC/ATI layers) into even, level, and secure contact with each other, thereby preventing air gaps between surfaces and improving thermal performance. The even, secure contact between surfaces improves thermal cooling and reduces variation in cooling efficiency. In this way, more DUTs can be tested in parallel within a small test space, overall costs of the test system are reduced, and greater cooling capacity can be provided for testing high-powered devices.

Abstract: Embodiments of the present invention provide testing systems with liquid cooled thermal arrays that can pivot freely in three dimensions allowing surfaces to be brought into even, level, and secure contact, thereby preventing air gaps between surfaces and improving thermal performance. In this way, more DUTs can be tested in parallel within a small test space, overall costs of the test system are reduced, and greater cooling capacity can be provided for testing high-powered devices. Gimbaled mounts are disposed on a bottom surface of individual thermal interface boards (TIBs) of a test system, and/or on top of individual thermal heads of a thermal array (TA) having a common cold plate (or having multiple cold plates).

Abstract: Lighting devices and methods utilize multiple independently controllable groups of solid state light emitters of different dominant wavelengths, with operation of the emitter groups being automatically adjusted by processor(s) to provide desired illumination. Operation of the emitter groups may be further affected by sensors and/or user input commands (e.g., sound patterns, gesture patterns, or signal transmission). Operation may be adjusted to compensate for presence, absence, intensity, and/or color point of ambient or incident light. Presence of five or more groups of solid state light emitters provide desirable luminous flux, color point, correlated color temperature (CCT), color rendering index (CRI), CRI R9, and luminous efficacy characteristics of aggregate emissions over a wide range of CCT values, and may permit adjustment of vividness (e.g., relative gamut) and/or melatonin suppression characteristics for a selected color point or CCT.

Abstract: Embodiments of the present invention provide testing systems with liquid cooled thermal arrays that can pivot freely in three dimensions allowing surfaces to be brought into even, level, and secure contact, thereby preventing air gaps between surfaces and improving thermal performance. In this way, more DUTs can be tested in parallel within a small test space, overall costs of the test system are reduced, and greater cooling capacity can be provided for testing high-powered devices. Gimbaled mounts are disposed on a bottom surface of individual thermal interface boards (TIBs) of a test system, and/or on top of individual thermal heads of a thermal array (TA) having a common cold plate (or having multiple cold plates).

Abstract: A test probe contactor includes an angled depressible probe configuration that causes the tips of the compressible probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the depressible probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force. The contactor includes an upper block and a main block for housing the plurality of probes. The main block and the upper block include corresponding pluralities of slanted probe cavities. The upper bore axis of one or more of the upper probe cavities is laterally shifted relative to the main bore axis of a corresponding probe cavity of the main block, resulting in a lateral offset between the upper bore axis and the main bore axis.

Abstract: In one example, an apparatus comprises a headset and an auxiliary device. The headset includes a first microphone to detect first egress audio signals and a speaker to output ingress audio signals received wirelessly from a mobile device. The auxiliary device includes a container to hold the headset, as well as a second microphone to detect second egress audio signals. In a first operation mode, one of the headset or the auxiliary device can transmit wireless signals including the first egress audio signals to the mobile device. In a second operation mode, one of the headset or the auxiliary device can transmit wireless signals including the second egress audio signals to the mobile device.

Abstract: An automated high speed test solution for Quad Flat Pack device packages that enables connectivity between test equipment and the integrated circuit under test is described. A test probe geometry that provides highly repeatable and reliable connections suitable for use with consumer grade QFP devices coupled with ease of maintenance is provided. In some embodiments, the probe tip ends are chisel-shaped. The probes can be slightly slanted with respect to a vertical axis of the probe retaining block.

Abstract: High frequency operation of an integrated circuit test system is greatly extended by incorporation of a dedicated high frequency signal element that provides a circuit specific compensation network as part of the intermediation circuit board that enables connectivity between test equipment and the integrated circuit under test.

Abstract: A test probe contactor includes an angled depressible probe configuration that causes the tips of the compressible probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the depressible probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force. The contactor includes an upper block and a main block for housing the plurality of probes. The main block and the upper block include corresponding pluralities of slanted probe cavities. The upper bore axis of one or more of the upper probe cavities is laterally shifted relative to the main bore axis of a corresponding probe cavity of the main block, resulting in a lateral offset between the upper bore axis and the main bore axis.

Abstract: A test probe assembly for testing packaged integrated circuit (IC) devices includes a plurality of probes, a pad and a PCB/interposer. The plurality of probes is configured to repeatedly maintain reliable electrical contact, for example, reliable grounding, with a corresponding plurality of DUT contacts when under a compliant force. Reliability and/or grounding can be accomplished by introducing a small angular differential between the bore axis of the upper block and the bore axis of the main block.

Abstract: A test probe assembly for testing packaged integrated circuit (IC) devices includes a plurality of probes, a pad and a PCB/interposer. The plurality of probes is configured to repeatedly maintain reliable electrical contact, for example, reliable grounding, with a corresponding plurality of DUT contacts when under a compliant force. Reliability and/or grounding can be accomplished by introducing a small angular differential between the bore axis of the upper block and the bore axis of the main block.

Abstract: Lighting devices and methods utilize multiple independently controllable groups of solid state light emitters of different dominant wavelengths, with operation of the emitter groups being automatically adjusted by processor(s) to provide desired illumination. Operation of the emitter groups may be further affected by sensors and/or user input commands (e.g., sound patterns, gesture patterns, or signal transmission). Operation may be adjusted to compensate for presence, absence, intensity, and/or color point of ambient or incident light. Presence of five or more groups of solid state light emitters provide desirable luminous flux, color point, correlated color temperature (CCT), color rendering index (CRI), CRI R9, and luminous efficacy characteristics of aggregate emissions over a wide range of CCT values, and may permit adjustment of vividness (e.g., relative gamut) and/or melatonin suppression characteristics for a selected color point or CCT.

Abstract: Lighting devices and methods utilize multiple independently controllable groups of solid state light emitters of different dominant wavelengths, with operation of the emitter groups being automatically adjusted by processor(s) to provide desired illumination. Operation of the emitter groups may be further affected by sensors and/or user input commands (e.g., sound patterns, gesture patterns, or signal transmission). Operation may be adjusted to compensate for presence, absence, intensity, and/or color point of ambient or incident light. Presence of five or more groups of solid state light emitters provide desirable luminous flux, color point, correlated color temperature (CCT), color rendering index (CRI), CRI R9, and luminous efficacy characteristics of aggregate emissions over a wide range of CCT values, and may permit adjustment of vividness (e.g., relative gamut) and/or melatonin suppression characteristics for a selected color point or CCT.

Abstract: A test probe contactor includes an angled depressible probe configuration that causes the tips of the compressible probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the depressible probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force. The contactor includes an upper block and a main block for housing the plurality of probes. The main block and the upper block include corresponding pluralities of slanted probe cavities. The upper bore axis of one or more of the upper probe cavities is laterally shifted relative to the main bore axis of a corresponding probe cavity of the main block, resulting in a lateral offset between the upper bore axis and the main bore axis.

Abstract: The present invention relates to systems and methods for preventing over pressurization in a fluid management system used in an integrated circuit (IC) device tester. The prevention of the over pressurization in the fluid management system is based on the use of a pressure relief valve coupled to the fluid management system.

Abstract: Solid state light engines are disclosed that emit a bright, non-symmetrical emission pattern, with a relatively high luminous flux and from a relatively small area. The light engines can be used in many different types and sizes of light sources, with some embodiments providing a light quantity, quality and distribution similar to conventional J-type Halogen light sources. The light engines are arranged with integral power supplies and heat management features that allow for the engines to provide high emission intensities while generating significantly less heat at the light source. This can result in significantly higher efficiency and greater life space. In some embodiments, the light can perform similarly to a halogen J-type Lamp 80 mm light tube, while generating similar or greater amounts of light. The light engines according to the present invention provide the capability to be used in low profile light fixtures.

Abstract: The present invention relates to systems and methods that enable a connection to be made to a high speed, packaged or unpackaged semiconductor device that preserves signal integrity using probes that exhibit the properties of a coaxial transmission line so as to provide an accurate representation of the environment in which the device under test will be used. The coaxial structure further reduces capacitive coupling between probes resulting in significantly improved crosstalk performance.

Abstract: An adjustable pillow device and a pillow adjusting method are disclosed, the adjustable pillow device comprising: a headrest body (1), the height of a region thereof being self-adjustable according to the posture of a sleeper; an inflation/deflation mechanism (2) connected to the headrest body (1) for adjusting the height of a region of the headrest body (1); a sensor (3) for collecting information about the sleeper and providing feedback; a central information processor (4) connected to the sensor (3) and the control end of the inflation/deflation mechanism (2) respectively for receiving information from the sensor (3) and sending an adjustment direction to the control end of the inflation/deflation mechanism (2) according to the sleeping posture information and the body data figure of the sleeper.