Patents by Inventor Wai Lai
Wai Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240027400Abstract: A system and method for assessing deterioration of a metallurgical runner using acoustic emissions. The system may be referred to as an acoustic emission runner integrity system (AERIS). The system comprises acoustic emission sensors mounted on the runner. At least some of the sensors can detect acoustic emission signals in the runner. The sensors may be able to emit acoustic emission signals into the runner. The sensors are in communication with a controller. The controller is configured to one or more of identify and monitor deterioration of the runner based on the acoustic emission signals of the sensors. The method comprises affixing AE sensors to the runner, detecting AE signals with the sensors, and assessing deterioration of the runner based on the AE signals of the sensors.Type: ApplicationFiled: January 18, 2021Publication date: January 25, 2024Inventors: Wai Lai Winnie Ying, Maria Tibbo
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Patent number: 11459215Abstract: A safety system for a load carrying machine including: a controller, a location sensing arrangement in electronic communication with the processor, the location sensing arrangement configured to determine a location parameter of a load, a monitoring arrangement, the controller configured to receive the location parameter and determine a projected area of the load and control the monitoring arrangement to focus on the projected area to monitor the projected area.Type: GrantFiled: December 1, 2015Date of Patent: October 4, 2022Assignee: Hong Kong R&D Centre for Logistics and Supply Chain Management Enabling Technologies LimitedInventors: Kwong Yeung Simon Wong, Chun Wai Lai, Chi Wai Leung
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Patent number: 11391069Abstract: A system and a method for a security strap device including a strap; a lock, the lock comprising a locking mechanism; a fixed portion of the strap being secured inside the lock; a free end of the strap insertable into the lock to form a loop in the strap, the lock is configured to lock a portion of the strap to form the loop in the strap, wherein; the locking mechanism comprises a plurality of latches moveable between a locking position and an unlocking position; the plurality of latches engaging one or more locking slots within the lock when in the locking position to the lock the strap within the lock; and wherein the latches are all simultaneously biased toward the locked position and the latches are required to be simultaneously displaced to an unlocking position to unlock the strap.Type: GrantFiled: February 14, 2020Date of Patent: July 19, 2022Assignee: Logistics and Supply Chain MultiTech R&D Centre LimitedInventors: Chun Wai Lai, Kwong Man Pun, Yiu Man Chan
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Publication number: 20210254372Abstract: A system and a method for a security strap device including a strap; a lock, the lock comprising a locking mechanism; a fixed portion of the strap being secured inside the lock; a free end of the strap insertable into the lock to form a loop in the strap, the lock is configured to lock a portion of the strap to form the loop in the strap, wherein; the locking mechanism comprises a plurality of latches moveable between a locking position and an unlocking position; the plurality of latches engaging one or more locking slots within the lock when in the locking position to the lock the strap within the lock; and wherein the latches are all simultaneously biased toward the locked position and the latches are required to be simultaneously displaced to an unlocking position to unlock the strap.Type: ApplicationFiled: February 14, 2020Publication date: August 19, 2021Inventors: Chun Wai Lai, Kwong Man Pun, Yiu Man Chan
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Publication number: 20200255267Abstract: A safety system for a load carrying machine comprising: a controller, a location sensing arrangement in electronic communication with the processor, the location sensing arrangement configured to determine a location parameter of a load, a monitoring arrangement, the controller configured to receive the location parameter and determine a projected area of the load and control the monitoring arrangement to focus on the projected area to monitor the projected area.Type: ApplicationFiled: December 1, 2015Publication date: August 13, 2020Inventors: Kwong Yeung Simon Wong, Chun Wai Lai, Chi Wai Leung
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Patent number: 10637334Abstract: A printed circuit board includes a body, a first conductive pattern layer disposed on a first surface of the body, and a second conductive pattern layer disposed on a second surface of the body. The first conductive pattern layer and the second conductive pattern layer form a capacitor. The present disclosure further provides an motor having the printed circuit board.Type: GrantFiled: May 17, 2017Date of Patent: April 28, 2020Assignee: JOHNSON ELECTRIC INTERNATIONAL AGInventors: Qing Bin Luo, Chi Wai Lai, Wen Ming Wu
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Patent number: 10552750Abstract: Described is a multiple-camera system and process for disambiguating between multiple users and identifying which of the multiple users performed an event. For example, when an event is detected, user patterns near the location of the event are determined, along with touch points at the location of the event. User pattern orientation and/or arm trajectories between the event location and the user patterns may be determined and processed to disambiguate between multiple users and determine which user pattern is involved in the event.Type: GrantFiled: December 23, 2014Date of Patent: February 4, 2020Assignee: Amazon Technologies, Inc.Inventors: Sudarshan Narasimha Raghavan, Emilio Ian Maldonado, David Allen Smith, Min Xu, Nishitkumar Ashokkumar Desai, Daniel Bibireata, Kevin Kar Wai Lai, Pahal Kamlesh Dalal
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Patent number: 10484265Abstract: An IP network topology update system may update IP network topology in near real-time and on-demand with minimum overheads. It identifies likely impact area (e.g., layer 2 or layer 3), objects (e.g., link or node such a device), and timing (e.g., what topology objects located where or when the topology update process should be performed) in the IP Layer 3 network and its underlying SDN Layer 2 network under virtualized networking infrastructure as candidates of impacts for topology update.Type: GrantFiled: April 27, 2017Date of Patent: November 19, 2019Assignee: AT&T Intellectual Property I, L.P.Inventors: Tsong-Ho Wu, Wen-Jui Li, Wai Lai
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Patent number: 10483829Abstract: A brush assembly includes a circuit board, at least two brushes, power connecting terminals for connecting with an external power supply, and a power supply branch circuit connected in series between a corresponding one of the power connecting terminals and a corresponding one of the brushes. The brush assembly further comprises an EMI suppressor connected between the power supply branch circuit and ground. The EMI suppressor is an axial capacitor formed by a conductor core, a cover, and a filling medium. The cover is attached around the conductor core, and the filling medium is filled between the conductor core and the cover. A motor utilizing the brush assembly is also provided.Type: GrantFiled: March 2, 2017Date of Patent: November 19, 2019Assignee: Johnson Electric International AGInventors: Qing Bin Luo, Chi Wai Lai, Xin Peng Wei, Gui Hong Tian, Bo Hu, Xiao Lin Ren, Wen Ming Wu
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Patent number: 10277098Abstract: An end cap assembly for an electric motor has a brush assembly, a circuit board, an inductor and a grounded metal element. The brush assembly has a plurality of brushes. The circuit board is fixed relative to the brush assembly. The inductor is electrically connected to the circuit board. The grounded metal element is positioned between the brushes and the inductor to absorb high frequency electromagnetic radiation transmitted from the brushes to the inductor.Type: GrantFiled: August 6, 2015Date of Patent: April 30, 2019Assignee: Johnson Electric International AGInventors: Chi Wai Lai, Qing Bin Luo, Gong Wu Xu, Xin Peng Wei, Xiao Lin Ren, Gui Hong Tian, Hong Wei Zhang, Xia Han
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Publication number: 20180316594Abstract: An IP network topology update system may update IP network topology in near real-time and on-demand with minimum overheads. It identifies likely impact area (e.g., layer 2 or layer 3), objects (e.g., link or node such a device), and timing (e.g.Type: ApplicationFiled: April 27, 2017Publication date: November 1, 2018Inventors: Tsong-Ho Wu, Wen-Jui Li, Wai Lai
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Publication number: 20180301907Abstract: Various distribution side controllers for power systems are disclosed. Power systems includes a power generation subsystem and one or more distribution networks. Power systems may also include a transmission system coupled between the power generation subsystem and the distribution networks. The distribution side controller monitors the operation and availability of power from distributed power sources coupled to its respective distribution network, as well as load demand from loads on the distribution network. The distribution side controller may also monitor conditions on the distribution network to identify a power imbalance within the distribution network. The distribution side controller responds to such imbalances to reduce their effect on the power system as a whole. In some embodiments, multiple distribution side controllers for various distribution networks may cooperate to provide efficient power generation for the whole power systems.Type: ApplicationFiled: April 11, 2018Publication date: October 18, 2018Inventors: Reza Iravani, Mohammad Sedighy, Tom Wai Lai Ma
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Patent number: 10084389Abstract: A power module includes a substrate, a first sub-module and a second sub-module. Each of the first sub-module and the second sub-module includes a semiconductor switch and a diode. The first sub-module is formed as the high-voltage-side switching element. The second sub-module is formed as the low-voltage-side switching element. The plural electrodes of the high-voltage-side switching element and the plural electrodes of the low-voltage-side switching element are electrically connected with the conducting terminals of the corresponding semiconductor switches and the corresponding diodes. The high-voltage-side switching element is disposed on the substrate and electrically connected with the corresponding conducting parts of the substrate. The low-voltage-side switching element is disposed on the high-voltage-side switching element and electrically connected with the corresponding conducting parts of the substrate through the high-voltage-side switching element.Type: GrantFiled: May 26, 2016Date of Patent: September 25, 2018Assignee: DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTDInventors: Yiu-Wai Lai, Da-Jung Chen
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Patent number: 9973104Abstract: A power module includes a substrate, a first sub-module, a second sub-module and a circuit board. The semiconductor switches and the diodes of the first sub-module and the second sub-module are embedded within insulation layers. Consequently, the first sub-module and the second sub-module are formed as a high-voltage-side switching element and a low-voltage-side switching element of a bridge circuit. The first sub-module and the second sub-module are disposed on a first surface of the substrate. An electrode of the first sub-module and some electrodes of the second sub-module are electrically connected with corresponding conducting parts of a circuit board. A heat sink is disposed on a second surface of the substrate.Type: GrantFiled: October 12, 2016Date of Patent: May 15, 2018Assignee: DELTA ELECTRONICS, INT'L (SINGAPORE) PTE LTDInventors: Yiu-Wai Lai, Da-Jung Chen
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Patent number: 9935414Abstract: A commutator has a conductive layer, a segment layer and an insulating layer separating the conductive layer and the segment layer. The segment layer includes multiple commutator segments. A mounting hole is defined along an axis of the commutator passing through the conductive layer. The three-layer structure of the commutator forms a capacitor having an increased confronting area and reduced inter-plate distance. The capacitor thus has a greater capacitance and hence greater EMI absorbing capability, making it possible to reduce EMI emissions without additional EMI reduction components outside the commutator. A rotor and a motor employing the commutator are also disclosed.Type: GrantFiled: December 11, 2015Date of Patent: April 3, 2018Assignee: JOHNSON ELECTRIC S.A.Inventors: Qing Bin Luo, Chi Wai Lai, Wen Ming Wu, Zhao Sen Meng, Xiao Lin Ren, Xian Xue Ao, Bei Bei He, Hong Jiang Zhao, Ying Song Ye
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Publication number: 20180083517Abstract: The present invention provides an electric motor which includes a stator and a rotor rotatable relative to the stator. The stator includes a stator core and a winding. The stator core includes a yoke and a plurality of teeth extending from the yoke. The winding is wound on the teeth. The stator further comprises a shielding member mounted to at least one axial end of the stator core, and at least one of opposite axial ends of the winding is completely covered by the shielding member. The electric motor of the present invention has a reduced electromagnetic interference (EMI) and improved electromagnetic compatibility (EMC).Type: ApplicationFiled: September 18, 2017Publication date: March 22, 2018Inventors: Yue LI, Mao Xiong JIANG, You Qing XIANG, Chi Wai LAI, Ying Song YE, Hai Jun HUA, Ya Ming ZHANG
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Patent number: 9913380Abstract: An embedded package structure includes an insulation substrate, a first conductive layer, a second conductive layer, an electronic component and a passive component. The insulation substrate has a first conductive via and a second conductive via. The first conductive layer is formed on a top surface of the insulation substrate and contacted with the first conductive via. The second conductive layer is formed on a bottom surface of the insulation substrate, and contacted with the second conductive via. The electronic component is embedded within the insulation substrate. Moreover, plural conducting terminals of the electronic components are electrically connected with the first conductive layer and the second conductive layer through the first conductive via and the second conductive via. The passive component is located near a first side of the electronic component and separated from the electronic component. The passive component is at least partially embedded within the insulation substrate.Type: GrantFiled: April 18, 2017Date of Patent: March 6, 2018Assignee: DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTDInventors: Yiu-Wai Lai, Da-Jung Chen
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Patent number: 9871463Abstract: A power module includes a substrate, a first sub-module and a second sub-module. The substrate includes plural first conducting parts, plural second conducting parts and a third conducting part. The first sub-module is disposed on the substrate, and includes a first semiconductor switch, a first diode, a first electrode, a second electrode and a third electrode. The first electrode and the second electrode are electrically connected with the corresponding first conducting parts. The third electrode is electrically connected with the third conducting part. The second sub-module is disposed on the substrate, and includes a second semiconductor switch, a second diode, a fourth electrode, a fifth electrode and a sixth electrode. The fourth electrode and the fifth electrode are electrically connected with the corresponding second conducting parts. The sixth electrode is electrically connected with the third conducting part.Type: GrantFiled: May 26, 2016Date of Patent: January 16, 2018Assignee: DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTDInventors: Yiu-Wai Lai, Da-Jung Chen
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Publication number: 20170347458Abstract: An embedded package structure includes an insulation substrate, a first conductive layer, a second conductive layer, an electronic component and a passive component. The insulation substrate has a first conductive via and a second conductive via. The first conductive layer is formed on a top surface of the insulation substrate and contacted with the first conductive via. The second conductive layer is formed on a bottom surface of the insulation substrate, and contacted with the second conductive via. The electronic component is embedded within the insulation substrate. Moreover, plural conducting terminals of the electronic components are electrically connected with the first conductive layer and the second conductive layer through the first conductive via and the second conductive via. The passive component is located near a first side of the electronic component and separated from the electronic component. The passive component is at least partially embedded within the insulation substrate.Type: ApplicationFiled: April 18, 2017Publication date: November 30, 2017Inventors: Yiu-Wai Lai, Da-Jung Chen
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Publication number: 20170338722Abstract: A printed circuit board includes a body, a first conductive pattern layer disposed on a first surface of the body, and a second conductive pattern layer disposed on a second surface of the body. The first conductive pattern layer and the second conductive pattern layer form a capacitor. The present disclosure further provides an motor having the printed circuit board.Type: ApplicationFiled: May 17, 2017Publication date: November 23, 2017Inventors: Qing Bin LUO, Chi Wai LAI, Wen Ming WU