Abstract: A printed circuit board includes a body, a first conductive pattern layer disposed on a first surface of the body, and a second conductive pattern layer disposed on a second surface of the body. The first conductive pattern layer and the second conductive pattern layer form a capacitor. The present disclosure further provides an motor having the printed circuit board.

Abstract: Various systems and method for acoustic monitoring of smelting furnaces and similar devices are disclosed. Acoustic sensors (and optionally other sensors) are mounted to the furnace. Acoustic emission events generated in the furnace are analyzed to identify conditions that exceed one or more thresholds. The location of acoustic emissions may be identified and reported. Output signals may be generated in response to acoustic emissions. The location of acoustic emissions may be used to identify the location of potential failures in the furnace.

Abstract: A brush assembly includes a circuit board, at least two brushes, power connecting terminals for connecting with an external power supply, and a power supply branch circuit connected in series between a corresponding one of the power connecting terminals and a corresponding one of the brushes. The brush assembly further comprises an EMI suppressor connected between the power supply branch circuit and ground. The EMI suppressor is an axial capacitor formed by a conductor core, a cover, and a filling medium. The cover is attached around the conductor core, and the filling medium is filled between the conductor core and the cover. A motor utilizing the brush assembly is also provided.

Abstract: A first insulation layer comprising stacked prepreg layers is provided, and a metallic protective layer is formed on the first insulation layer. A first alignment mark is formed on the first insulation layer, and an accommodation cavity is formed in the first insulation layer according to the first alignment mark. A second alignment mark is formed on the first insulation layer according to the first alignment mark. A carrier plate is attached on the first insulation layer through a thermal release tape layer, and the semiconductor device is temporarily fixed on the thermal release tape layer within the accommodation cavity according to the second alignment mark. A semi-cured second insulation layer is placed over the first insulation layer, and the second insulation layer is laminated and cured. A re-distribution layer is formed on the second insulation layer, and the re-distribution layer is electrically connected with the semiconductor device.

Abstract: An end cap assembly includes an end cap. The end cap includes an end wall, a sidewall, and a shielding member. The sidewall projects from one side of the end wall. The sidewall defines a cutout for allowing two conducting wires to pass therethrough, and the two conducting wires connect components mounted within the end cap to an external power source. The shielding member is disposed in the cutout. The end cap assembly provides enhanced EMI suppression. In addition, the present invention also provides a motor employing the end cap assembly.

Abstract: A package structure includes a first insulation layer, at least one first electronic component, and a first re-distribution layer. The first electronic component is embedded within the first insulation layer, and the first electronic component includes plural first conducting terminals disposed on a bottom surface of the first electronic component. At least part of the bottom surface of the first electronic component is exposed from a bottom surface of the first insulation layer. The first re-distribution layer is formed on the bottom surface of the first insulation layer and contacted with the corresponding first conducting terminals.

Abstract: A device for tagging an object includes a tag body having an engagement arrangement with a removable strap for engaging the tag body to the object. The engagement arrangement further includes a sensing arrangement having a strap sensor arrv banged to be connected to the removable strap to detect a disengagement of the tag body from the object. The removable strap further includes a conductive member arranged to connect with the strap sensor and disconnect from the strap sensor when the tag body is disengaged from the object.

Abstract: A power module includes a substrate, a first sub-module, a second sub-module and a circuit board. The semiconductor switches and the diodes of the first sub-module and the second sub-module are embedded within insulation layers. Consequently, the first sub-module and the second sub-module are formed as a high-voltage-side switching element and a low-voltage-side switching element of a bridge circuit. The first sub-module and the second sub-module are disposed on a first surface of the substrate. An electrode of the first sub-module and some electrodes of the second sub-module are electrically connected with corresponding conducting parts of a circuit board. A heat sink is disposed on a second surface of the substrate.

Abstract: A power module includes a substrate, a first sub-module and a second sub-module. Each of the first sub-module and the second sub-module includes a semiconductor switch and a diode. The first sub-module is formed as the high-voltage-side switching element. The second sub-module is formed as the low-voltage-side switching element. The plural electrodes of the high-voltage-side switching element and the plural electrodes of the low-voltage-side switching element are electrically connected with the conducting terminals of the corresponding semiconductor switches and the corresponding diodes. The high-voltage-side switching element is disposed on the substrate and electrically connected with the corresponding conducting parts of the substrate. The low-voltage-side switching element is disposed on the high-voltage-side switching element and electrically connected with the corresponding conducting parts of the substrate through the high-voltage-side switching element.

Abstract: A power module includes a substrate, a first sub-module and a second sub-module. The substrate includes plural first conducting parts, plural second conducting parts and a third conducting part. The first sub-module is disposed on the substrate, and includes a first semiconductor switch, a first diode, a first electrode, a second electrode and a third electrode. The first electrode and the second electrode are electrically connected with the corresponding first conducting parts. The third electrode is electrically connected with the third conducting part. The second sub-module is disposed on the substrate, and includes a second semiconductor switch, a second diode, a fourth electrode, a fifth electrode and a sixth electrode. The fourth electrode and the fifth electrode are electrically connected with the corresponding second conducting parts. The sixth electrode is electrically connected with the third conducting part.

Abstract: A package structure includes a first insulation layer, at least one first electronic component, and a first re-distribution layer. The first electronic component is embedded within the first insulation layer, and the first electronic component includes plural first conducting terminals disposed on a bottom surface of the first electronic component. At least part of the bottom surface of the first electronic component is exposed from a bottom surface of the first insulation layer. The first re-distribution layer is formed on the bottom surface of the first insulation layer and contacted with the corresponding first conducting terminals.

Abstract: A commutator has a conductive layer, a segment layer and an insulatim layer separating the conductive layer and the segment layer. The segment layer includes multiple commutator segments. A mounting hole is defined along an axis of the commutator passing through the conductive layer. The three-layer structure of the commutator forms a capacitor having an increased confronting area and reduced inter-plate distance. The capacitor thus has a greater capacitance and hence greater EMI absorbing capability, making it possible to reduce EMI emissions without additional EMI reduction components outside the commutator. A rotor and a motor employing the commutator are also disclosed.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for providing personal knowledge panels. One of the methods includes receiving, at an Internet search system, a search query. Multiple search results identifying Internet resources indexed by the search system that satisfy the query are obtained. If the search query matches a name of a user that submitted the search query, a ranking of one or more of the search results and a personal knowledge panel comprising one or more items of user provided information about the user is provided, wherein the personal knowledge panel includes multiple input fields for updating the user provided information of the knowledge panel. Updated user information that was provided using the input fields of the personal knowledge panel is received, and the updated user information is associated with an account of the user.

Abstract: An end cap assembly for an electric motor has a brush assembly, a circuit board, an inductor and a grounded metal element. The brush assembly has a plurality of brushes. The circuit board is fixed relative to the brush assembly. The inductor is electrically connected to the circuit board. The grounded metal element is positioned between the brushes and the inductor to absorb high frequency electromagnetic radiation transmitted from the brushes to the inductor.

Abstract: Herein is provided a device for tagging an object comprising a tag body having an engagement arrangement for engaging the tag body to the object, wherein the engagement arrangement includes at least one sensing arrangement arranged to detect a disengagement of the tag body from the object.

Abstract: A motor includes motor terminals for connecting with an external power supply and an internal circuit connected to the motor terminals. The motor further includes a RF filter. The RF filter includes a conductive wire coiled in either a helical manner or a spiral manner. Terminals of the conductive wire at opposite axial ends of the coil are connected to a corresponding one of the motor terminals and the internal circuit, respectively. The intensity of the electromagnetic waves radiated from most parts of the conductive wire of the RF filter is attenuated by reflected electromagnetic waves from other parts of the conductive wire. Therefore, the intensity of the electromagnetic wave radiated from the motor is greatly reduced. A RF filter for the motor is also provided.

Abstract: This invention provides a device for preserving and dispensing a beverage, having: (a) a housing including one or more compartments, each compartment for storing a beverage container; and (b) one or more dispensing head removably connected to a cartridge, wherein said dispensing head having an aerator for aerating said beverage, wherein said cartridge removably and securely holds a beverage container, wherein said beverage flows from said container to said dispensing head by the force of a pump connected to said cartridge. In one embodiment, the beverage is wine.

Abstract: This invention provides a device for preserving and dispensing a beverage, comprising: (a) a housing comprising one or more compartments, each compartment for storing a beverage container; and (b) one or more dispensing head removably connected to a cartridge, wherein said dispensing head comprises an aerator for aerating said beverage, wherein said cartridge removably and securely holds a beverage container, wherein said beverage flows from said container to said dispensing head by the force of a pump connected to said cartridge. In one embodiment, the beverage is wine.

Abstract: Various systems and method for acoustic monitoring of smelting furnaces and similar devices are disclosed. Acoustic sensors (and optionally other sensors) are mounted to the furnace. Acoustic emission events generated in the furnace are analyzed to identify conditions that exceed one or more thresholds. The location of acoustic emissions may be identified and reported. Output signals may be generated in response to acoustic emissions. The location of acoustic emissions may be used to identify the location of potential failures in the furnace.

Abstract: Various distribution side controllers for power systems are disclosed. Power systems includes a power generation subsystem and one or more distribution networks. Power systems may also include a transmission system coupled between the power generation subsystem and the distribution networks. The distribution side controller monitors the operation and availability of power from distributed power sources coupled to its respective distribution network, as well as load demand from loads on the distribution network. The distribution side controller may also monitor conditions on the distribution network to identify a power imbalance within the distribution network. The distribution side controller responds to such imbalances to reduce their effect on the power system as a whole. In some embodiments, multiple distribution side controllers for various distribution networks may cooperate to provide efficient power generation for the whole power systems.