Abstract: A system for selecting audio-video (AV) streams associated with an event may include a processor and a memory. The processor may be configured to determine when a primary audio-video (AV) stream generated by a primary content producer for an event is being transmitted to a device of a user. The processor may be configured to select alternative AV streams generated by alternative content producers for the event based at least on attributes of the user, characteristics of the alternative content producers, and/or action events occurring within the event. In one or more implementations, the attributes of the user may include associations of the user with one or more of the alternative content producers in a social network. The processor may be configured to provide representations of the selected alternative AV streams to the device for selection by the user in connection with a display of the primary AV stream.

Abstract: A system for presentation timeline synchronization across audio-video (AV) streams associated with a common event may include memory and a processor. The processor may be configured to receive metadata items from a user device during a live event, the metadata items corresponding to points-in-time marked by the user while being presented with an audio-video (AV) stream associated with the live event. The metadata items may include timing indicators that are indicative of the marked points-in-time relative to the start of the live event. The processor may be configured to provide to the user device with other AV streams associated with the live event that were available at one of the points-in-time marked by the user. The processor may be configured to provide the other AV streams to the user device beginning with a frame that corresponds to the one of the points-in-time marked by the user.

Abstract: An apparatus for cyclical depositing of thin films on semiconductor substrates, comprising a process chamber having a gas distribution system with separate paths for process gases and an exhaust system synchronized with operation of valves dosing the process gases into a reaction region of the chamber.

Abstract: In a first aspect, a method is provided that includes (1) forming a first barrier layer over the sidewalls and bottom of a via using atomic layer deposition within an atomic layer deposition (ALD) chamber; (2) removing at least a portion of the first barrier layer from the bottom of the via by sputter etching; and (3) depositing a second barrier layer on the sidewalls and bottom of the via within the ALD chamber. Numerous other embodiments are provided, as are systems, methods and computer program products in accordance with these and other aspects.

Abstract: A multi-station deposition apparatus capable of simultaneous processing multiple substrates using a plurality of stations, where a gas curtain separates the stations. The apparatus further comprises a multi-station platen that supports a plurality of wafers and rotates the wafers into specific deposition positions at which deposition gases are supplied to the wafers. The deposition gases may be supplied to the wafer through single zone or multi-zone gas dispensing nozzles.

Abstract: In a first aspect, a method is provided that includes (1) forming a first barrier layer over the sidewalls and bottom of a via using atomic layer deposition within an atomic layer deposition (ALD) chamber; (2) removing at least a portion of the first barrier layer from the bottom of the via by sputter etching; and (3) depositing a second barrier layer on the sidewalls and bottom of the via within the ALD chamber. Numerous other embodiments are provided, as are systems, methods and computer program products in accordance with these and other aspects.

Abstract: Embodiments of the present invention generally relate to a small volume chamber with a substrate support. One embodiment of a processing chamber includes a first assembly having a substrate support, a pumping ring disposed around a perimeter of the substrate receiving surface, and a gas distribution assembly disposed over the substrate support. The chamber may further include a gas distribution assembly disposed over the substrate support. The first assembly and the gas distribution assembly can be selectively positioned between an open position and a closed position.