Patents by Inventor Walter Haag
Walter Haag has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12030010Abstract: A filter candle is provided, comprising one or more filter elements shaped as hollow cylinders of porous material, the filter elements having substantially identical inner and outer diameters and are disposed coaxially with each other; a support element comprising a metal tube disposed within the filter element(s), said metal tube having an outer diameter smaller than the inner diameter of the filter element(s), said metal tube having a wall with a plurality of perforations; and at least two annular sealing disks having an outer diameter equal to or larger than that of the filter element(s) and an inner diameter smaller than that of the filter element(s), wherein first and second terminal sealing disks are disposed at opposite axial end faces of a single filter element or of a plurality of filter elements disposed in line, wherein the filter elements are compressed between the first and second terminal sealing disks.Type: GrantFiled: June 1, 2021Date of Patent: July 9, 2024Assignee: Pall CorporationInventors: Steffen Heidenreich, Walter Haag
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Publication number: 20210379521Abstract: A filter candle is provided, comprising one or more filter elements shaped as hollow cylinders of porous material, the filter elements having substantially identical inner and outer diameters and are disposed coaxially with each other; a support element comprising a metal tube disposed within the filter element(s), said metal tube having an outer diameter smaller than the inner diameter of the filter element(s), said metal tube having a wall with a plurality of perforations; and at least two annular sealing disks having an outer diameter equal to or larger than that of the filter element(s) and an inner diameter smaller than that of the filter element(s), wherein first and second terminal sealing disks are disposed at opposite axial end faces of a single filter element or of a plurality of filter elements disposed in line, wherein the filter elements are compressed between the first and second terminal sealing disks.Type: ApplicationFiled: June 1, 2021Publication date: December 9, 2021Inventors: Steffen HEIDENREICH, Walter HAAG
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Patent number: 10130097Abstract: The invention relates to an object having a coating arranged on at least one surface of the object, which comprises at least one antimicrobially active layer having an antimicrobial agent, wherein the agent comprises a copper (I) compound and/or a copper (II) compound.Type: GrantFiled: February 15, 2017Date of Patent: November 20, 2018Assignee: GLAS TROESCH HOLDING AGInventors: Pascal Meier, Walter Haag, Andriy Romanyuk
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Publication number: 20170231229Abstract: The invention relates to an object having a coating arranged on at least one surface of the object, which comprises at least one antimicrobially active layer having an antimicrobial agent, wherein the agent comprises a copper (I) compound and/or a copper (II) compound.Type: ApplicationFiled: February 15, 2017Publication date: August 17, 2017Inventors: Pascal Meier, Walter Haag, Andriy ROMANYUK
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Patent number: 9669344Abstract: The present invention relates to a hot gas filtration system and a process for regenerating such a hot gas filtration system, said filtration system comprising a filter vessel, a tubesheet separating the interior of said filter vessel into a raw gas section and a clean gas section, and a plurality of filter elements. Said filter elements, arranged in two or more groups, are connected to the tubesheet with a clean end and extend with a raw gas portion into the raw gas section. Two or more plenum chambers are accommodated in the clean gas section and groupwise accommodate the clean gas ends of the filter elements, each of said plenum chambers comprising a gas exchange opening providing a direct fluid communication with the clean gas section.Type: GrantFiled: February 25, 2013Date of Patent: June 6, 2017Assignee: Pall CorporationInventors: Steffen Heidenreich, Walter Haag
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Patent number: 7718042Abstract: A magnetron source, a magnetron treatment chamber, and a method of manufacturing substrates with a vacuum plasma treated surface, generate and exploit on asymmetrically unbalanced long-range magnetron magnetic field pattern which is swept along the substrate surface for improving the ion density at a substrate surface being vacuum plasma treated. The long-range field reaches the substrate surface with a component of the magnetic field parallel to the substrate surface of at least 0.1, and preferably between 1 and 20, Gauss. The plasma treating can be sputter-coating, or etching, for example.Type: GrantFiled: March 12, 2004Date of Patent: May 18, 2010Assignee: OC Oerlikon Balzers AGInventors: Stanislav Kadlec, Eduard Kügler, Walter Haag
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Patent number: 7678239Abstract: A magnetron sputtering source includes a plurality of electrodes and a switching circuit. The switching circuit sequentially connects each of the plurality of electrodes to a ground reference, making it anodic, while connecting the remaining of the plurality of electrodes as cathodes. A method of operating the magnetron sputtering source includes steps of: providing a plurality of target arrangements; causing each of the plurality of target arrangements to act as a cathode; and sequentially causing each of the plurality of cathodes to temporarily act as an anode.Type: GrantFiled: July 23, 2004Date of Patent: March 16, 2010Assignee: Oerlikon Solar IP AG, TrubbachInventors: Walter Haag, Pius Gruenenfelder
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Publication number: 20070175748Abstract: Sputtering is performed by making use of a stationary magnetic field (Hs). Uneroded areas of the sputtering surface (3) which are subject to re-deposition are minimized or omitted by modulating the stationary magnetic field (Hs) adjacent to one of the magnetic poles responsible for the stationary magnetic field, by superimposing a modulating magnetic field (Hm) to said stationary field (Hs).Type: ApplicationFiled: December 22, 2006Publication date: August 2, 2007Applicant: OC OERLIKON BALZERS AGInventors: Fachri Atamny, Stanislav Kadlec, Siegfried Krassnitzer, Walter Haag, Pius Gruenenfelder
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Publication number: 20070009670Abstract: The invention relates to a method or a device for the production of especially natural voltage optimized coatings, especially low tensile stress coatings, by means of sputter processes, wherein a bipolar voltage shape is produced on the target (cathode). The positive voltage pulse is adjusted on the target in such a way that a bias voltage on the substrate is thus replaced.Type: ApplicationFiled: April 30, 2003Publication date: January 11, 2007Inventor: Walter Haag
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Publication number: 20050233089Abstract: The invention relates to a method or a device for the production of especially natural voltage optimized coatings, especially low tensile stress coatings, by means of sputter processes, wherein a bipolar voltage shape is produced on the target (cathode). The positive voltage pulse is adjusted on the target in such a way that a bias voltage on the substrate is thus replaced.Type: ApplicationFiled: April 30, 2003Publication date: October 20, 2005Inventor: Walter Haag
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Publication number: 20050199485Abstract: A magnetron source, a magnetron treatment chamber, and a method of manufacturing substrates with a vacuum plasma treated surface, generate and exploit on asymmetrically unbalanced long-range magnetron magnetic field pattern which is swept along the substrate surface for improving the ion density at a substrate surface being vacuum plasma treated. The long-range field reaches the substrate surface with a component of the magnetic field parallel to the substrate surface of at least 0.1, and preferably between 1 and 20, Gauss. The plasma treating can be sputter-coating, or etching, for example.Type: ApplicationFiled: March 12, 2004Publication date: September 15, 2005Inventors: Stanislav Kadlec, Eduard Kugler, Walter Haag
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Patent number: 6878248Abstract: A method of manufacturing an object in a vacuum treatment apparatus having a vacuum recipient for containing an atmosphere, includes the steps of supporting a substrate on a work piece carrier arrangement in the recipient and treating the substrate to manufacture the object in the vacuum recipient. The treating process includes generating electrical charge carriers in the atmosphere and in the recipient which are of the type that form electrically insulating material and providing at least two electroconductive surfaces in the recipient. Power, such as a DC signal, is supplied to at least one of the electroconductive surfaces so that at least one of the electroconductive surfaces receives the electrically insulating material for covering at least part of that electroconductive surface. This causes electrical isolation of that electroconductive surface which leads to arcing and damage to the object.Type: GrantFiled: March 17, 2003Date of Patent: April 12, 2005Inventors: Hans Signer, Eduard Kügler, Klaus Wellerdieck, Helmut Rudigier, Walter Haag
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Patent number: 6860977Abstract: A workpiece is manufactured using a magnetron source that has an optimized yield of sputtered-off material as well as service life of the target. Good distribution values of the layer on the workpiece are obtained that are stable over the entire target service life, and a concave sputter face in a configuration with small target-to-workpiece distance is combined with a magnet system to form the magnetron electron trap in which the outer pole of the magnetron electron trap is stationary and an eccentrically disposed inner pole with a second outer pole part is rotatable about the central source axis.Type: GrantFiled: November 6, 2003Date of Patent: March 1, 2005Assignee: Unaxis Balzers LimitedInventors: Bernd Heinz, Martin Dubs, Thomas Eisenhammer, Pius Grunenfelder, Walter Haag, Stanislav Kadlec, Siegfried Krassnitzer
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Publication number: 20050034975Abstract: A magnetron sputtering source includes a plurality of electrodes and a switching circuit. The switching circuit sequentially connects each of the plurality of electrodes to a ground reference, making it anodic, while connecting the remaining of the plurality of electrodes as cathodes. A method of operating the magnetron sputtering source includes steps of: providing a plurality of target arrangements; causing each of the plurality of target arrangements to act as a cathode; and sequentially causing each of the plurality of cathodes to temporarily act as an anode.Type: ApplicationFiled: July 23, 2004Publication date: February 17, 2005Applicant: Unaxis Balzers Ltd.Inventors: Walter Haag, Pius Gruenenfelder
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Patent number: 6776881Abstract: For optimizing the yield of atomized-off material on a magnetron atomization source, a process space, on the source side, is predominantly walled by the atomization surface of the target body. The magnetron atomization source has a target body with a mirror-symmetrical, concavely constructed atomization surface with respect to at least one plane and a magnetic circuit arrangement operable to generate a magnetic field over the atomization surface. The magnetic circuit arrangement includes an anode arrangement, a receiving frame which extends around an edge of the target body and is electrically insulated with respect thereto. The receiving frame has a receiving opening for at least one workpiece to be coated. The magnetron source can be used to provide storage disks, such as CDs, with an atomization coating.Type: GrantFiled: September 25, 2002Date of Patent: August 17, 2004Assignee: Unaxis Balzers AktiengesellschaftInventors: Pius Gruenenfelder, Hans Hirscher, Urs Schwendener, Walter Haag
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Publication number: 20040149565Abstract: A workpiece is manufactured using a magnetron source that has an optimized yield of sputtered-off material as well as service life of the target. Good distribution values of the layer on the workpiece are obtained that are stable over the entire target service life, and a concave sputter face in a configuration with small target-to-workpiece distance is combined with a magnet system to form the magnetron electron trap in which the outer pole of the magnetron electron trap is stationary and an eccentrically disposed inner pole with a second outer pole part is rotatable about the central source axis.Type: ApplicationFiled: November 6, 2003Publication date: August 5, 2004Applicant: Unaxis Balzers LimitedInventors: Bernd Heinz, Martin Dubs, Thomas Eisenhammer, Pius Grunenfelder, Walter Haag, Stanislav Kadlec, Siegfried Krassnitzer
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Patent number: 6682637Abstract: To optimize the yield of sputtered-off material as well as the service life of the target on a magnetron source, in which simultaneously good attainable distribution values of the layer on the substrate, stable over the entire target service life, a concave sputter face 20 in a configuration with small target-substrate distance d is combined with a magnet system to form the magnetron electron trap in which the outer pole 3 of the magnetron electron trap is disposed stationarily and an eccentrically disposed inner pole 4 with a second outer pole part 11 is developed rotatable about the central source axis 6.Type: GrantFiled: June 4, 2002Date of Patent: January 27, 2004Assignee: Unaxis Balzers LimitedInventors: Bernd Heinz, Martin Dubs, Thomas Eisenhammer, Pius Grunenfelder, Walter Haag, Stanislav Kadlec, Siegfried Krassnitzer
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Patent number: 6679977Abstract: A method for producing flat panels for TFT or plasma display applications includes forming a sputter source within a sputter coating chamber, the source having at least two electrically mutually isolated stationery bar-shaped target arrangements. A controlled magnet arrangement provided under each target with a time-varying magnetron field.Type: GrantFiled: September 6, 2002Date of Patent: January 20, 2004Assignee: Unakis Trading AGInventors: Walter Haag, Pius Grunenfelder, Urs Schwendener, Markus Schlegel, Siegfried Krassnitzer
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Publication number: 20030178300Abstract: A method of manufacturing an object in a vacuum treatment apparatus having a vacuum recipient for containing an atmosphere, includes the steps of supporting a substrate on a work piece carrier arrangement in the recipient and treating the substrate to manufacture the object in the vacuum recipient. The treating process includes generating electrical charge carriers in the atmosphere and in the recipient which are of the type that form electrically insulating material and providing at least two electroconductive surfaces in the recipient. Power, such as a DC signal, is supplied to at least one of the electroconductive surfaces so that at least one of the electroconductive surfaces receives the electrically insulating material for covering at least part of that electroconductive surface. This causes electrical isolation of that electroconductive surface which leads to arcing and damage to the object.Type: ApplicationFiled: March 17, 2003Publication date: September 25, 2003Inventors: Hans Signer, Eduard Kugler, Klaus Wellerdieck, Helmut Rudigier, Walter Haag
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Publication number: 20030136671Abstract: To optimize the yield of sputtered-off material as well as the service life of the target on a magnetron source, in which simultaneously good attainable distribution values of the layer on the substrate, stable over the entire target service life, a concave sputter face 20 in a configuration with small target-substrate distance d is combined with a magnet system to form the magnetron electron trap in which the outer pole 3 of the magnetron electron trap is disposed stationarily and an eccentrically disposed inner pole 4 with a second outer pole part 11 is developed rotatable about the central source axis 6.Type: ApplicationFiled: June 4, 2002Publication date: July 24, 2003Inventors: Bernd Heinz, Martin Dubs, Thomas Eisenhammer, Pius Grunenfelder, Walter Haag, Stanislav Kadlec, Siegfried Krassnitzer