Abstract: A process and a means for automatic assembly of the top and bottom sides of circuitboards with SMDs is described. The SMD assembly machine in this means has two parallel pickup stations for conveyor belts for the circuitboards for this purpose.

Abstract: A method and apparatus for performing digital signal error detection through the use of a string of received incoming system address bits. The incoming address bits are divided into groups according to whether they contain a high value of "1" or a low value of "0". At least one address parity bit is then generated from each group and used in checking the integrity of data received.

Abstract: A component made of an intermetallic compound of titanium and aluminum, or of alloys of such intermetallic compounds with alloying additions forming the base material, and with an aluminum diffusion coating on the base material, is provided. The component has, between the base material and the aluminum diffusion coating, a closed zone which is close to the surface and has a recrystallization structure. For this purpose, the component is cold-formed or slightly melted in a zone which is close to the surface, is then annealed at the recrystallization temperature, and finally has an aluminum diffusion coating applied to the recrystallized zone. The process is used for components in engines and, particularly, for components in the hot-gas duct of an engine.

Abstract: A method of making and electrically interconnecting layers of printed circuitry involves the steps of: (1) coating an insulator on both sides with an adhesive; (2) punching holes through the insulator at points where interconnections are to be made; (3) laminating conductor planes to both sides of the insulator by means of the adhesive; (4) forming printed circuit patterns on the conductors such that a proper conductor geometry is created at the points where the interconnections are to be made; (5) applying pre-punched, adhesive-coated cover layers of insulation over the exposed printed circuits, except in the area of the interconnections; and (6) applying solder to the conductor pattern. Since the geometry at the interconnections is carefully controlled a solder bridge is formed, which connects the two conductor patterns during step (6) by the flow of solder into the interconnection area, past the upper conductor, to the lower conductor.