Patents by Inventor Wan-Li Chuang
Wan-Li Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9290039Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process with a first irradiating energy is performed on the adhesive layer. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process with a second irradiating energy is performed on the adhesive layer after the workpiece is punched, wherein the second irradiating energy intensity is higher than the first irradiating energy intensity.Type: GrantFiled: November 24, 2011Date of Patent: March 22, 2016Assignee: COMPAL ELECTRONICS, INC.Inventors: Wan-Li Chuang, Chien-Min Chang, Tsung-Sheng Chuang
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Publication number: 20160052247Abstract: A manufacturing process for vacuum heat transfer printing is used for transfer printing a pattern of a film onto a main surface of a workpiece. The manufacturing process for vacuum heat transfer printing includes: disposing the workpiece and the film in a mold cavity, wherein the film is located above the main surface of the workpiece, and the main surface is divided into a plurality of blocks; heating the mold cavity; and providing different negative pressures into the mold cavity corresponding to each of the blocks, such that the film is vacuumed onto the blocks in sequence and the patterns are transfer printed onto the main surface of the workpiece in sequence. A jig for the manufacturing process for vacuum heat transfer printing is also provided.Type: ApplicationFiled: January 18, 2015Publication date: February 25, 2016Applicant: COMPAL ELECTRONICS, INC.Inventors: Wan-Li Chuang, Kuo-Nan Ling, Po-An Lin
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Patent number: 9242505Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.Type: GrantFiled: November 24, 2011Date of Patent: January 26, 2016Assignee: COMPAL ELECTRONICS, INC.Inventors: Wan-Li Chuang, Chien-Min Chang, Ju-Chen Chiu, Chih-Hua Liu, Tsung-Sheng Chuang
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Publication number: 20140205699Abstract: A production method of three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured by implementing a plurality of heat treatments thereon. A workpiece of three-dimensional pattern and a production device of three-dimensional pattern are also disclosed.Type: ApplicationFiled: March 21, 2014Publication date: July 24, 2014Applicant: COMPAL ELECTRONICS, INC.Inventors: Chien-Min Chang, Wan-Li Chuang, Jung-Chin Wu
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Patent number: 8721824Abstract: A production method of three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured by implementing a plurality of heat treatments thereon. A workpiece of three-dimensional pattern and a production device of three-dimensional pattern are also disclosed.Type: GrantFiled: September 14, 2010Date of Patent: May 13, 2014Assignee: Compal Electronics, Inc.Inventors: Chien-Min Chang, Wan-Li Chuang, Jung-Chin Wu
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Patent number: 8684579Abstract: An electronic device includes a display module, a base and a keyboard module. The display module is pivoted on the base. The keyboard module is disposed on the base. The keyboard module has a plurality of keys. Each of the keys includes a main body and an imprinted structure. The main body has a top surface. The imprinted structure is disposed on the top surface of the main body and includes a light guiding portion and a light scattering portion. A light emitted by the display module illuminates the keyboard module. The light is guided towards a specific direction when the light passes through the light guiding portion, and the light is scattered in other directions when the light passes through the light scattering portion.Type: GrantFiled: May 22, 2012Date of Patent: April 1, 2014Assignee: Compal Electronics, Inc.Inventors: Wan-Li Chuang, Chien-Min Chang, Li-Jung Yu, Mei-Hsiung Tsai, Yung-Ching Chang, Ju-Chen Chiu
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Patent number: 8681502Abstract: A shell structure suitable for an electronic device is provided. The electronic device has a heat generating element. The shell structure includes a core layer, a first material layer, and a second material layer. The core layer includes a thermal insulating area and a thermal conducting area. The core layer has first and second surfaces opposite to each other. The first material layer is configured on the first surface. The second material layer is configured on the second surface. The thermal insulating area is aligned to the heat generating element, and the shell structure covers the heat generating element, such that heat generated by the heat generating element is transferred to the first material layer through the second material layer and the heat conducting area to perform heat dissipation, and a position of the first material layer aligned to the heat generating element is prevented from generating a heat point.Type: GrantFiled: December 21, 2011Date of Patent: March 25, 2014Assignee: Compal Electronics, Inc.Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Wan-Li Chuang
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Patent number: 8580485Abstract: A method for forming a three-dimensional pattern includes following steps. A shaped workpiece having an inner surface and an outer surface is provided, and a first photoresist layer and a second photoresist layer are respectively formed on the outer surface and the inner surface. The shaped workpiece is placed on a transparent fixture. The first photoresist layer and the second photoresist layer are exposed and developed, such that the first photoresist layer forms a patterned photoresist layer, and the second photoresist layer forms an etching protection layer. The shaped workpiece is etched to form the three-dimensional pattern on the outer surface of the shaped workpiece. The patterned photoresist layer and the etching protection layer are removed.Type: GrantFiled: November 12, 2010Date of Patent: November 12, 2013Assignee: Compal Electronics, Inc.Inventors: Chien-Min Chang, Jung-Chin Wu, Wan-Li Chuang
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Publication number: 20130265799Abstract: An electronic device includes a display module, a base and a keyboard module. The display module is pivoted on the base. The keyboard module is disposed on the base. The keyboard module has a plurality of keys. Each of the keys includes a main body and an imprinted structure. The main body has a top surface. The imprinted structure is disposed on the top surface of the main body and includes a light guiding portion and a light scattering portion. A light emitted by the display module illuminates the keyboard module. The light is guided towards a specific direction when the light passes through the light guiding portion, and the light is scattered in other directions when the light passes through the light scattering portion.Type: ApplicationFiled: May 22, 2012Publication date: October 10, 2013Applicant: COMPAL ELECTRONICS, INC.Inventors: Wan-Li Chuang, Chien-Min Chang, Li-Jung Yu, Mei-Hsiung Tsai, Yung-Ching Chang, Ju-Chen Chiu
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Publication number: 20120321840Abstract: A three-dimensional workpiece including a first ductile plate, a second ductile plate and a core layer is provided. The core layer is located between the first ductile plate and the second ductile plate. The first ductile plate, the second ductile plate and the core layer are bound together and have a three-dimensional shape. The first ductile plate has a flat area and a curved area. The core layer has a core flat area and a core curved area. The core flat area is superposed with the plate flat area and the core curved area is superposed with the plate curved area.Type: ApplicationFiled: June 13, 2012Publication date: December 20, 2012Applicant: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Wan-Li Chuang
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Publication number: 20120162921Abstract: A shell structure suitable for an electronic device is provided. The electronic device has a heat generating element. The shell structure includes a core layer, a first material layer, and a second material layer. The core layer includes a thermal insulating area and a thermal conducting area. The core layer has first and second surfaces opposite to each other. The first material layer is configured on the first surface. The second material layer is configured on the second surface. The thermal insulating area is aligned to the heat generating element, and the shell structure covers the heat generating element, such that heat generated by the heat generating element is transferred to the first material layer through the second material layer and the heat conducting area to perform heat dissipation, and a position of the first material layer aligned to the heat generating element is prevented from generating a heat point.Type: ApplicationFiled: December 21, 2011Publication date: June 28, 2012Applicant: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Wan-Li Chuang
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Publication number: 20120088074Abstract: A workpiece with three-dimensional pattern having a three-dimensional surface and suitable for an electronic device is provided. A multiple three-dimensional micro patterns formed on the three-dimensional surface reflects an environment light to form images with a visual effect. The workpiece with three-dimensional pattern includes a workpiece and an adhesive layer. The adhesive layer is disposed on the workpiece and impressed to form the multiple three-dimensional micro patterns, and the workpiece is punched to form the three-dimensional surface. A first part of the multiple three-dimensional micro patterns on the three-dimensional surface reflects the environment light to form a first reflecting light beam. A second part of the multiple three-dimensional micro patterns on the three-dimensional surface reflects the environment light to form a second reflecting light beam.Type: ApplicationFiled: December 19, 2011Publication date: April 12, 2012Applicant: COMPAL ELECTRONICS, INC.Inventors: Wan-Li Chuang, Chien-Min Chang, Li-Jung Yu, Yung-Ching Chang, Ying-Ching Chen, Tsung-Sheng Chuang
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Publication number: 20120070639Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.Type: ApplicationFiled: November 24, 2011Publication date: March 22, 2012Applicant: COMPAL ELECTRONICS, INC.Inventors: Wan-Li Chuang, Chien-Min Chang, Ju-Chen Chiu, Chih-Hua Liu, Tsung-Sheng Chuang
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Publication number: 20120070631Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process with a first irradiating energy is performed on the adhesive layer. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process with a second irradiating energy is performed on the adhesive layer after the workpiece is punched, wherein the second irradiating energy intensity is higher than the first irradiating energy intensity.Type: ApplicationFiled: November 24, 2011Publication date: March 22, 2012Applicant: COMPAL ELECTRONICS, INC.Inventors: Wan-Li Chuang, Chien-Min Chang, Tsung-Sheng Chuang
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Publication number: 20110183270Abstract: A method for forming a three-dimensional pattern includes following steps. A shaped workpiece having an inner surface and an outer surface is provided, and a first photoresist layer and a second photoresist layer are respectively formed on the outer surface and the inner surface. The shaped workpiece is placed on a transparent fixture. The first photoresist layer and the second photoresist layer are exposed and developed, such that the first photoresist layer forms a patterned photoresist layer, and the second photoresist layer forms an etching protection layer. The shaped workpiece is etched to form the three-dimensional pattern on the outer surface of the shaped workpiece. The patterned photoresist layer and the etching protection layer are removed.Type: ApplicationFiled: November 12, 2010Publication date: July 28, 2011Applicant: COMPAL ELECTRONICS, INC.Inventors: Chien-Min Chang, Jung-Chin Wu, Wan-Li Chuang
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Publication number: 20110064924Abstract: A production method of three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured by implementing a plurality of heat treatments thereon. A workpiece of three-dimensional pattern and a production device of three-dimensional pattern are also disclosed.Type: ApplicationFiled: September 14, 2010Publication date: March 17, 2011Applicant: COMPAL ELECTRONICS, INC.Inventors: Chien-Min Chang, Wan-Li Chuang, Jung-Chin Wu
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Publication number: 20110061798Abstract: A production method of a three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured.Type: ApplicationFiled: April 12, 2010Publication date: March 17, 2011Applicant: COMPAL ELECTRONICS, INC.Inventors: Chien-Min Chang, Wan-Li Chuang, Jung-Chin Wu
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Publication number: 20110064915Abstract: A production method of metal workpiece is provided. First, an adhesive layer is applied on a metal workpiece. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. The adhesive layer is then cured by implementing a plurality of heat treatments thereon. A metal workpiece with three-dimensional pattern is also provided.Type: ApplicationFiled: September 14, 2010Publication date: March 17, 2011Applicant: COMPAL ELECTRONICS, INC.Inventors: Chien-Min Chang, Wan-Li Chuang, Jung-Chin Wu
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Publication number: 20090236772Abstract: A pattern transfer mold is suitable for transferring at least one decorative pattern of a film to at least one workpiece. The pattern transfer mold includes a mold base and a mold core. The mold base has a mold cavity and an air vent associated with the mold cavity. The mold core is inserted in the mold cavity of the mold base and has an upper surface and a plurality of upper air grooves on the upper surface. The mold cavity and the mold core have a plurality of mold air channels located between the mold cavity and the mold core. The upper air grooves are associated with the air vent via the mold air channels.Type: ApplicationFiled: December 1, 2008Publication date: September 24, 2009Applicant: COMPAL ELECTRONICS, INC.Inventors: Chien-Min Chang, Jung-Chin Wu, Wan-Li Chuang, Ho-Hsiang Wang