PRODUCTION METHOD OF THREE-DIMENSIONAL PATTERN

- COMPAL ELECTRONICS, INC.

A production method of a three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured.

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Description
CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of U.S.A. provisional application Ser. No. 61/241,963, filed on Sep. 14, 2009. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to a production method of a three-dimensional pattern, and more particularly, to a method of forming a three-dimensional pattern on a three-dimensional workpiece.

2. Description of Related Art

Currently, electronic devices such as notebook computers, mobile phones, or digital cameras mostly adopt metal material for constituting the exterior. In order to advance the overall aesthetic appearance of electronic devices, various patterns are usually formed on the appealing configuration.

Patterns are produced on the surface of metal material frequently by etching metal material with a solvent or by paint-spraying and transfer printing. Nonetheless, the surface treatment technique of the former is complicated and difficult, and the production thereof is highly contaminative. The latter is restrained by the chemical property of metal material, such that artistic configuration cannot be produced. Taking the injection molding case made of magnesium alloy as an example, due to the high chemical activity of the alloy and the needs to perform lapping or repairing during the surface process, it is unable to make an original-color appearance with metallic sense on the workpiece surface.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to a production method of a three-dimensional pattern so as to form a three-dimensional pattern on a three-dimensional workpiece.

An embodiment of the present invention provides a production method of a three-dimensional pattern. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is formed on the adhesive layer by using vacuum adsorption, so that the film is impressed on the adhesive layer and a three-dimensional pattern is formed on the adhesive layer. Finally, the adhesive layer is cured.

Based on the depiction above, in the embodiment of the present invention, the above-mentioned film is formed on the adhesive layer by using vacuum adsorption so that the film can be impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. In this way, the impressing process of the three-dimensional pattern is not limited by the shape of the workpiece; i.e. a workpiece with any shape can have a three-dimensional pattern by using the production method of the embodiment. Moreover, the present invention saves burdensome process operations to form a three-dimensional pattern on the surface of a three-dimensional workpiece made of metal material.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

FIGS. 1-5 are flow diagrams of a production method of a three-dimensional pattern according to an embodiment of the present invention.

FIG. 6 is a diagram of a production method of a three-dimensional pattern according to another embodiment of the present invention.

FIGS. 7-9 are diagrams for fabricating the film in FIG. 1.

DESCRIPTION OF EMBODIMENTS

FIGS. 1-5 are flow diagrams of a production method of a three-dimensional pattern according to an embodiment of the present invention. Referring to FIGS. 1-3, first, a first adhesive layer 120 is applied on a three-dimensional workpiece 110 and the three-dimensional workpiece 110 is disposed on a vacuum heat transfer equipment (VHT equipment) 200. In the embodiment, the three-dimensional workpiece 110 is an injection molding case made of magnesium alloy, which the present invention is not limited to; in other unshown embodiments, the three-dimensional workpiece 110 can be an injection molding parts made of plastic, carbon fiber or other appropriate metal materials. Next, a film 130 is fixed on the VHT equipment 200 and disposed on the three-dimensional workpiece 110.

Referring to FIGS. 4 and 5, the VHT equipment 200 would conduct a vacuum processing on the space where the three-dimensional workpiece 110 is located in, so that the film 130 is adsorbed on the three-dimensional workpiece 110. The film 130 herein has a three-dimensional pattern, so that when the film 130 is adsorbed on the three-dimensional workpiece 110, the three-dimensional pattern of the film 130 would be transferred onto the first adhesive layer 120 on the three-dimensional workpiece 110 by impressing. Next, the VHT equipment 200 conducts a curing process to cure the first adhesive layer 120 on the three-dimensional workpiece 110. Finally, the film 130 on the three-dimensional workpiece 110 is removed so as to form the three-dimensional pattern on the three-dimensional workpiece 110.

Continuing to FIG. 3, in the embodiment, prior to vacuum adsorbing the film 130 onto the three-dimensional workpiece 110, the VHT equipment 200 would heat the film 130 by means of infrared radiation so that the film 130 gets softened, which facilitates the successive process where the film 130 can be tightly adhered onto the surface of the three-dimensional workpiece 110 during the vacuum adsorption. In addition, the first adhesive layer 120 can also thereby reduce the fluidity thereof to reach a semi-dry status, which facilitates the successive process where the film 130 is impressed onto the first adhesive layer 120. On the other hand, after the film 130 is impressed onto the first adhesive layer 120, the first adhesive layer 120 can be cured by photo-curing or thermal-curing depending on the type of the first adhesive layer 120 to be used.

FIG. 6 is a diagram of a production method of a three-dimensional pattern according to another embodiment of the present invention. In the embodiment, it is different from the above-mentioned embodiment that prior to applying the first adhesive layer 120 on the three-dimensional workpiece 110, a primer layer 140 is applied on the surface of the three-dimensional workpiece 110 so as to connect the three-dimensional workpiece 110 and the first adhesive layer 120 to each other, followed by applying a color layer 150 on the primer layer 140 so as to color the three-dimensional workpiece 110. However, the embodiment does not limit the primer layer 140 and the color layer 150. In another unshown embodiment, prior to applying the first adhesive layer 120, a color primer layer is applied on the three-dimensional workpiece 110, where the primer layer is doped by color dye therein so as to save the operation to apply the color layer 150 on the primer layer 140 as shown in FIG. 6.

FIGS. 7-9 are diagrams for fabricating the film in FIG. 1. Referring to FIGS. 7-9, first, a second adhesive layer 132 is applied on a substrate 134. In the embodiment, the material of the substrate 134 is, for example, polycarbonate (PC), polyethylene terephthalate (PET) or polyvinyl choloride (PVC). Next, a mold 300 is impressed onto the second adhesive layer 132 so as to transfer-print the three-dimensional pattern of the mold 300 to the second adhesive layer 132, followed by curing the second adhesive layer 132. Finally, the mold 300 is removed so that a three-dimensional pattern complementary to the three-dimensional pattern of the mold 300 is formed on the second adhesive layer 132.

In summary, in the embodiment of the present invention, the film is impressed on the adhesive layer on the three-dimensional workpiece so as to form the three-dimensional pattern on the three-dimensional workpiece. The method can effectively simplify the fabrication procedure of forming the three-dimensional pattern on the three-dimensional workpiece and avoid burdensome surface process operations on the three-dimensional workpiece. In addition, the film can be adsorbed on a three-dimensional workpiece with different shapes by using the production method of the embodiments, which is advantageous in reducing the technical difficulty of forming the pattern on a three-dimensional workpiece and the production cost.

Although the invention has been described with reference to the above embodiments, it will be apparent to one of the ordinary skill in the art that modifications to the described embodiment may be made without departing from the spirit of the invention. Accordingly, the scope of the invention will be defined by the attached claims not by the above detailed descriptions.

Claims

1. A production method of a three-dimensional pattern, comprising:

applying a first adhesive layer on a three-dimensional workpiece;
vacuum adsorbing a film on the first adhesive layer so that the film is impressed onto the first adhesive layer and a first three-dimensional pattern is formed on the first adhesive layer; and
curing the first adhesive layer.

2. The production method of a three-dimensional pattern as claimed in claim 1, further comprising:

applying a primer layer on the three-dimensional workpiece before applying the first adhesive layer.

3. The production method of a three-dimensional pattern as claimed in claim 2, further comprising:

disposing a color layer on the primer layer.

4. The production method of a three-dimensional pattern as claimed in claim 2, wherein the primer layer is a color primer layer.

5. The production method of a three-dimensional pattern as claimed in claim 1, further comprising:

softening the film before vacuum adsorbing the film onto the first adhesive layer.

6. The production method of a three-dimensional pattern as claimed in claim 1, wherein the first adhesive layer is cured by photo-curing or thermal-curing.

7. The production method of a three-dimensional pattern as claimed in claim 1, wherein the fabrication method of the film comprises:

applying a second adhesive layer on a substrate;
using a mold to be impressed onto the second adhesive layer to form a second three-dimensional pattern on the second adhesive layer;
curing the second adhesive layer; and
removing the mold.

8. The production method of a three-dimensional pattern as claimed in claim 7, wherein the first three-dimensional pattern and the second three-dimensional pattern are complementary to each other.

9. The production method of a three-dimensional pattern as claimed in claim 1, wherein the material of the three-dimensional workpiece is metal.

10. The production method of a three-dimensional pattern as claimed in claim 1, wherein the material of the three-dimensional workpiece is plastic or carbon fiber.

Patent History
Publication number: 20110061798
Type: Application
Filed: Apr 12, 2010
Publication Date: Mar 17, 2011
Applicant: COMPAL ELECTRONICS, INC. (Taipei City)
Inventors: Chien-Min Chang (Taipei City), Wan-Li Chuang (Taipei City), Jung-Chin Wu (Taipei City)
Application Number: 12/758,774
Classifications
Current U.S. Class: In Configured Mold (156/245); With Coating Or Impregnating A Face To Be Adhered (156/307.3); To Polymerize Or Cure Material In Work (156/275.5)
International Classification: B32B 37/24 (20060101); B32B 38/00 (20060101);