Patents by Inventor Wan-Lin Hsieh
Wan-Lin Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250007456Abstract: A frequency generating device and an operation method thereof are provided. The frequency generating device includes an oscillator circuit and a processor circuit. The oscillator circuit generates a clock signal and adjust a clock frequency of the clock signal according to a control voltage generated by the processor circuit. The processor circuit calculates a current frequency aging rate value based on a current clock frequency. The processor circuit calculates a control voltage regulation rate value based on the current frequency aging rate value and a control voltage slope, and compensates the control voltage based on the control voltage regulation rate value in the holdover state. Alternatively, the processor circuit calculates a frequency regulation value based on the current frequency aging rate value and an oscillator resolution of the synchronizer, and provides the frequency regulation value to the synchronizer in the holdover state to compensate an output frequency of the synchronizer.Type: ApplicationFiled: September 12, 2024Publication date: January 2, 2025Applicant: TXC CorporationInventors: Wan-Lin Hsieh, Wen-Cheng Wang, Sheng-Hsiang Kao
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Patent number: 12117865Abstract: A frequency generating device and an operation method thereof are provided. The frequency generating device includes an oscillator circuit and a processor circuit. The oscillator circuit is configured to generate a clock signal and adjust a clock frequency of the clock signal according to a control voltage. The processor circuit is coupled to the oscillator circuit and is configured to generate the control voltage. The processor circuit reads a frequency aging rate value and a control voltage slope of the oscillator circuit from the oscillator circuit, calculates a control voltage regulation rate value corresponding to the frequency aging rate value and the control voltage slope, and compensates the control voltage based on the control voltage regulation rate value. Alternatively, the processor circuit reads the control voltage regulation rate value from the oscillator circuit, and compensates the control voltage based on the control voltage regulation rate value.Type: GrantFiled: December 19, 2022Date of Patent: October 15, 2024Assignee: TXC CorporationInventors: Wan-Lin Hsieh, Wen-Cheng Wang, Sheng-Hsiang Kao
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Publication number: 20240201726Abstract: A frequency generating device and an operation method thereof are provided. The frequency generating device includes an oscillator circuit and a processor circuit. The oscillator circuit is configured to generate a clock signal and adjust a clock frequency of the clock signal according to a control voltage. The processor circuit is coupled to the oscillator circuit and is configured to generate the control voltage. The processor circuit reads a frequency aging rate value and a control voltage slope of the oscillator circuit from the oscillator circuit, calculates a control voltage regulation rate value corresponding to the frequency aging rate value and the control voltage slope, and compensates the control voltage based on the control voltage regulation rate value. Alternatively, the processor circuit reads the control voltage regulation rate value from the oscillator circuit, and compensates the control voltage based on the control voltage regulation rate value.Type: ApplicationFiled: December 19, 2022Publication date: June 20, 2024Applicant: TXC CorporationInventors: Wan-Lin Hsieh, Wen-Cheng Wang, Sheng-Hsiang Kao
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Patent number: 11949378Abstract: A crystal oscillator and an oscillating device are provided. The crystal oscillator includes a resonator, a low-thermal conductivity glue, an integrated circuit chip, and a heating element. In the resonator, a crystal blank is hermetically encapsulated. The low-thermal conductivity glue wraps the resonator to suppress temperature variation in the resonator. The integrated circuit chip is disposed below the resonator, and the heating element is configured to supply heat to the resonator.Type: GrantFiled: August 29, 2022Date of Patent: April 2, 2024Assignee: TXC CorporationInventors: Erh-Shuo Hsu, Wan-Lin Hsieh
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Publication number: 20240072729Abstract: A crystal oscillator and an oscillating device are provided. The crystal oscillator includes a resonator, a low-thermal conductivity glue, an integrated circuit chip, and a heating element. In the resonator, a crystal blank is hermetically encapsulated. The low-thermal conductivity glue wraps the resonator to suppress temperature variation in the resonator. The integrated circuit chip is disposed below the resonator, and the heating element is configured to supply heat to the resonator.Type: ApplicationFiled: August 29, 2022Publication date: February 29, 2024Applicant: TXC CorporationInventors: Erh-Shuo Hsu, Wan-Lin Hsieh
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Patent number: 11876485Abstract: An oscillating device includes a heater, a thermoelectric cooler, a frequency source, a temperature controlled circuit, and a voltage controlled oscillation circuit. When the ambient temperature is in a low-temperature range, the temperature controlled circuit drives the heater to a target temperature to adjust an operating temperature of the frequency source. When the ambient temperature is in a high-temperature range, the temperature controlled circuit drives the thermoelectric cooler to the target temperature to adjust the operating temperature of the frequency source, and the voltage controlled oscillation circuit drives the frequency source to reduce a frequency variation of the frequency source resulted from the variation of the ambient temperature. Alternatively, the heater or the voltage controlled oscillation circuit may be omitted.Type: GrantFiled: September 13, 2022Date of Patent: January 16, 2024Assignee: TXC CORPORATIONInventors: Wan-Lin Hsieh, Sheng-Hsiang Kao
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Patent number: 11699990Abstract: An oscillating device includes a first quartz crystal resonator, a driving circuit, a first waveform adjustment circuit, and at least two second quartz crystal resonators. The first quartz crystal resonator has a first resonant frequency. The driving circuit, coupled to the first quartz crystal resonator, drives the first quartz crystal resonator to generate a first oscillating signal having the first resonant frequency. The second quartz crystal resonators, coupled in parallel and coupled to the driving circuit and the first quartz crystal resonator, have a second resonant frequency and receive and rectify the first oscillating signal to generate a second oscillating signal having the second resonant frequency. The first waveform adjustment circuit, coupled to the second quartz crystal resonators, receives the second oscillating signal and adjusts the second oscillating signal to generate a first waveform adjustment signal.Type: GrantFiled: August 29, 2022Date of Patent: July 11, 2023Assignee: TXC CORPORATIONInventors: Yu-Liang Chen, Chih-Hsun Chen, Wan-Lin Hsieh, Erh-Shuo Hsu, Sheng-Hsiang Kao
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Publication number: 20230018805Abstract: An oscillating device includes a first quartz crystal resonator, a driving circuit, a first waveform adjustment circuit, and at least two second quartz crystal resonators. The first quartz crystal resonator has a first resonant frequency. The driving circuit, coupled to the first quartz crystal resonator, drives the first quartz crystal resonator to generate a first oscillating signal having the first resonant frequency. The second quartz crystal resonators, coupled in parallel and coupled to the driving circuit and the first quartz crystal resonator, have a second resonant frequency and receive and rectify the first oscillating signal to generate a second oscillating signal having the second resonant frequency. The first waveform adjustment circuit, coupled to the second quartz crystal resonators, receives the second oscillating signal and adjusts the second oscillating signal to generate a first waveform adjustment signal.Type: ApplicationFiled: August 29, 2022Publication date: January 19, 2023Applicant: TXC CORPORATIONInventors: Yu-Liang CHEN, Chih-Hsun CHEN, Wan-Lin HSIEH, Erh-Shuo HSU, Sheng-Hsiang KAO
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Patent number: 11509311Abstract: A temperature-controlled oscillating device includes a supporting base, a mounting glue, an IC, at least one conducting medium, a temperature sensor, a quartz crystal package, and a heater. The mounting glue is formed on the supporting base. The IC is formed on the mounting glue. The conducting medium and the temperature sensor are formed on the IC. The quartz crystal package is formed on the conducting medium. The quartz crystal package includes a first quartz substrate, a second quartz substrate, and a third quartz substrate. The heater is formed on the quartz crystal package or the IC. There is no base arranged between the IC and the quartz crystal package.Type: GrantFiled: August 10, 2021Date of Patent: November 22, 2022Assignee: TXC CORPORATIONInventor: Wan-Lin Hsieh
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Patent number: 11469738Abstract: An oscillating device includes a first quartz crystal resonator, a driving circuit, a first buffer, an attenuator, a second quartz crystal resonator, and a second buffer. The first quartz crystal resonator and the second quartz crystal resonator respectively have a first resonant frequency and a second resonant frequency. The driving circuit drives the first quartz crystal resonator to generate a first oscillating signal having the first resonant frequency. The first buffer generates a first clock signal in response to the first oscillating signal. The attenuator reduces the wave swing of the first clock signal to generate an attenuated signal. The second quartz crystal resonator rectifies the attenuated signal to generate a second oscillating signal having the second resonant frequency. The second buffer generates a second clock signal in response to the second oscillating signal.Type: GrantFiled: July 19, 2021Date of Patent: October 11, 2022Assignee: TXC CORPORATIONInventors: Wan-Lin Hsieh, Yu-Liang Chen, Erh-Shuo Hsu, Chih-Hsun Chen, Sheng-Hsiang Kao
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Patent number: 11447314Abstract: A separation structure includes a support seat having at least one passage defined transversely therethrough. At least two notches are defined from the top of the support seat. Each notch includes a guide portion and a positioning portion. The guide portion opens through the top of the support seat and narrows toward the root portion of the support seat. The positioning portion communicates with the guide portion. The transmission part of a lock is positioned in the positioning portion of the notch via the guide portion. Two operational ends of the lock are located on two sides of the support seat. A user extends his/her finger through the passage to carry the support seat and the locks. The support seats can be piled up to save space.Type: GrantFiled: November 20, 2020Date of Patent: September 20, 2022Assignee: Taiwan Fu Hsing Industrial Co., Ltd.Inventor: Wan-Lin Hsieh
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Publication number: 20220161977Abstract: A separation structure includes a support seat having at least one passage defined transversely therethrough. At least two notches are defined from the top of the support seat. Each notch includes a guide portion and a positioning portion. The guide portion opens through the top of the support seat and narrows toward the root portion of the support seat. The positioning portion communicates with the guide portion. The transmission part of a lock is positioned in the positioning portion of the notch via the guide portion. Two operational ends of the lock are located on two sides of the support seat. A user extends his/her finger through the passage to carry the support seat and the locks. The support seats can be piled up to save space.Type: ApplicationFiled: November 20, 2020Publication date: May 26, 2022Inventor: WAN-LIN HSIEH
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Patent number: 11299316Abstract: A separation structure for a lock packing assembly includes a rectangular board with multiple holes which accommodate the handle of a lock, and the mounting plate of the lock contacts the board. The board includes a panel extending from each of four sides thereof, and the panels each have a first bending line and a second bending line. Each of the panels is bent along the first bending line and toward the board. Each of the panels is bent along the second bending line to form a separation plate which is perpendicular to the board and located between the holes. The locks are installed through the holes and separated by the separation plates such that the locks do not hit each other. The lock packing assembly includes low cost and can protect the locks.Type: GrantFiled: July 1, 2019Date of Patent: April 12, 2022Assignee: Taiwan Fu Hsing Industrial Co., Ltd.Inventor: Wan-Lin Hsieh
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Patent number: 11283403Abstract: A temperature-controlled and temperature-compensated oscillating device and a method of temperature control and temperature compensation is disclosed. The operating temperature of a frequency source is adjusted by driving a heater to a target temperature when the ambient temperature is in a first range between a first temperature and a second temperature higher than the third temperature. The frequency variation of the frequency source resulted from a variation of the ambient temperature is reduced by applying a voltage to the frequency source when the ambient temperature is in a second range between a third temperature and a fourth temperature higher than the third temperature. The third temperature is higher than the first temperature.Type: GrantFiled: December 23, 2020Date of Patent: March 22, 2022Assignee: TXC CORPORATIONInventors: Wan-Lin Hsieh, Sheng-Hsiang Kao
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Patent number: 10855289Abstract: An oven controlled crystal oscillator consisting includes a substrate, which includes a substrate, at least one base, a crystal blank, a first cover lid, an IC chip, a heat-insulating adhesive, a heater, and a second cover lid. The top of the base is provided with a cavity, and the top of the base is connected to the substrate through conductive wires without using solder. The crystal blank is mounted in the cavity. The first cover lid seals the cavity. The IC chip is mounted on the bottom of the base. The base is mounted on the substrate through the IC chip and the heat-insulating adhesive, and the IC chip is mounted to the bottom of the base. Alternatively, the IC chip and the base are horizontally arranged. The second cover lid is mounted on the top of the substrate.Type: GrantFiled: November 7, 2019Date of Patent: December 1, 2020Assignee: TXC CorporationInventors: Wan-Lin Hsieh, Erh-Shuo Hsu, Shao-Po Sun, Sheng-Hsiang Kao, Yu-Shun Yen
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Publication number: 20200354102Abstract: A separation structure for a lock packing assembly includes a rectangular board with multiple holes which accommodate the handle of a lock, and the mounting plate of the lock contacts the board. The board includes a panel extending from each of four sides thereof, and the panels each have a first bending line and a second bending line. Each of the panels is bent along the first bending line and toward the board. Each of the panels is bent along the second bending line to form a separation plate which is perpendicular to the board and located between the holes. The locks are installed through the holes and separated by the separation plates such that the locks do not hit each other. The lock packing assembly includes low cost and can protect the locks.Type: ApplicationFiled: July 1, 2019Publication date: November 12, 2020Inventor: WAN-LIN HSIEH
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Publication number: 20200076438Abstract: An oven controlled crystal oscillator consisting includes a substrate, which includes a substrate, at least one base, a crystal blank, a first cover lid, an IC chip, a heat-insulating adhesive, a heater, and a second cover lid. The top of the base is provided with a cavity, and the top of the base is connected to the substrate through conductive wires without using solder. The crystal blank is mounted in the cavity. The first cover lid seals the cavity. The IC chip is mounted on the bottom of the base. The base is mounted on the substrate through the IC chip and the heat-insulating adhesive, and the IC chip is mounted to the bottom of the base. Alternatively, the IC chip and the base are horizontally arranged. The second cover lid is mounted on the top of the substrate.Type: ApplicationFiled: November 7, 2019Publication date: March 5, 2020Inventors: WAN-LIN HSIEH, ERH-SHUO HSU, SHAO-PO SUN, SHENG-HSIANG KAO, YU-SHUN YEN
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Patent number: D915190Type: GrantFiled: March 3, 2020Date of Patent: April 6, 2021Assignee: Taiwan Fu Hsing Industrial Co., Ltd.Inventors: Shih-Ting Yuan, Wan-Lin Hsieh
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Patent number: D915191Type: GrantFiled: March 3, 2020Date of Patent: April 6, 2021Assignee: Taiwan Fu Hsing Industrial Co., Ltd.Inventors: Shih-Ting Yuan, Wan-Lin Hsieh
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Patent number: D1036255Type: GrantFiled: May 25, 2022Date of Patent: July 23, 2024Assignee: TAIWAN FU HSING INDUSTRIAL CO., LTD.Inventors: Shih-Ting Yuan, Wan-Lin Hsieh, Wen-Fa Wu