Abstract: An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

Abstract: An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

Abstract: An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

Abstract: A lock package is provided. The package holder is suitable to simultaneously position at least two locks. The package holder includes a plate portion and a partition. The plate portion has two opposite surfaces, at least two positioning portions, and a non-positioning portion. The surfaces are configured to be disposed with the locks. The positioning portions are configured to position plural escutcheons of the locks, and a portion of each of the escutcheons is exposed, in which the non-positioning portion is configured to cover a plurality of handles of the locks.

Abstract: A lock package is provided. The package holder is suitable to simultaneously position at least two locks. The package holder includes a plate portion and a partition. The plate portion has two opposite surfaces, at least two positioning portions, and a non-positioning portion. The surfaces are configured to be disposed with the locks. The positioning portions are configured to position plural escutcheons of the locks, and a portion of each of the escutcheons is exposed, in which the non-positioning portion is configured to cover a plurality of handles of the locks.

Abstract: An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

Abstract: A multiple-fluid system generates waveforms at its fluid interface, e.g. in a manner to prevent complete dewetting of a surface by the electrically non-conductive fluid and/or wetting of the surface by the electrically conductive fluid. In an example, a feedback controller senses capacitance across the non-conductive fluid, e.g. between one or more electrodes on the substrate and the conductive fluid. This first example controls voltages applied to the electrodes, based on the capacitive sensing, to create a static waveform, such as a standing wave, at the fluid interface. Another example manipulates the voltages applied to the electrodes to generate a propagating wave at the fluid interface.