Patents by Inventor Wang Liang

Wang Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100204095
    Abstract: The present invention provides long half life genetically modified TFPI sequences (LTFPI) for anticoagulation. On the genetically modified TFPI sequence, the lysine at the carboxy-terminal sites 241, 254, 260 and 261 are replaced by alanin and the amino acid asparagine at glycosylation sites 117, 167, 228 and the amino acids serine and threonine at glycosylation sites 174 and 175 are substitutionally mutated. The present invention also provides methods of making the LTFPI through high efficient LTFPI expression from yeast production system.
    Type: Application
    Filed: March 19, 2009
    Publication date: August 12, 2010
    Inventors: Duan MA, Jingui MU, Jiping WANG, Huijun WANG, Wang LIANG
  • Patent number: 7752479
    Abstract: An exemplary CPU frequency regulating circuit includes a detecting circuit, and a comparing circuit. The detecting circuit receives a PWM signal from a super I/O chipset, and converts the PWM signal to a load voltage responsive to a workload of a CPU. The comparing circuit is coupled to the detecting circuit for receiving the load voltage, and compares the load voltage with a reference voltage, and adjusts a frequency of the CPU according to a result of the comparison.
    Type: Grant
    Filed: November 25, 2006
    Date of Patent: July 6, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Wang Liang, Han-Chiang Chuang, Hung-Ju Chen, Chien-Chung Huang, Wen-Lung Liang, Chih-Liang Kuo
  • Publication number: 20100164381
    Abstract: A long linear-type microwave plasma source using a variably-reduced-height rectangular waveguide as the plasma reactor has been developed. Microwave power is fed from the both sides of the waveguide and is coupled into plasma through a long slot cut on the broad side of the waveguide. The reduced height of the waveguide is variable in order to control the coupling between microwave and plasma so that the plasma uniformity can remain a high quality when extending the length of the linear-type plasma source.
    Type: Application
    Filed: May 22, 2009
    Publication date: July 1, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: CHIH-CHEN CHANG, TUNG-CHUAN WU, CHAN-HSING LO, CHING-HUEI WU, MUH-WANG LIANG, FU-CHING TUNG, SHIH-CHIN LIN, JEN-RONG HUANG
  • Publication number: 20100141147
    Abstract: A capacitively coupled plasma (CCP) generator with two input ports, which is especially used as a large-area capacitively coupled plasma (CCP) generator. In the inventive CCP generator, only a RF power supply is required to provide the two input ports with RF power. The input impedance at each of the input ports is adjustable so that the standing wave between two rectangular electrodes can be eliminated to achieve plasma uniformity.
    Type: Application
    Filed: April 16, 2009
    Publication date: June 10, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: CHIH-CHEN CHANG, TUNG-CHUAN WU, CHAN-HSING LO, CHING-HUEI WU, JEN-RONG HUANG, MUH-WANG LIANG, CHIA-HAO CHANG
  • Publication number: 20100123381
    Abstract: A cathode discharge device is provided. The cathode discharge apparatus includes an anode, a cathode and plural cathode chambers. The cathode is located inside the anode, where the cathode has plural flow channels and at least one flow channel hole, and the plural flow channels are connected to one another through the flow channel hole. The plural cathode chambers are located inside the cathode, wherein each of the cathode chambers has a chamber outlet and a chamber inlet connected with at least one of the flow channels.
    Type: Application
    Filed: March 26, 2009
    Publication date: May 20, 2010
    Applicant: Industrial Technology Research Institute
    Inventors: FU-CHING TUNG, Tean-Mu Shen, Jung-Chen Ho, Pei-Shan Wu, Chia-Ming Chen, Kuan-Chou Chen, Jung-Chen Chien, Muh-Wang Liang
  • Publication number: 20100116623
    Abstract: A transmission device for thin and brittleness substrate is disclosed, which comprises: a plurality of transportation rollers and a plurality of pinch rollers. Each transportation roller further comprises: a rigid spindle; and a plurality of elastic supporting wheels, mounted on the spindle. Each pinch roller comprises: a sleeve; a spindle, ensheathed in the sleeve; and a plurality of pressing wheels, mounted on the sleeve at positions corresponding to the supporting wheels. When the transportation rollers are driven to rotate, a substrate sandwiched between the supporting wheels and the pressing wheels will be push to move while subjecting to a friction originated from a sufficient holding force by the supporting wheels and the pressing wheels, and consequently, providing an improved buffering capability for deformation absorption that enables the transmission device to guide the thin substrate to move smoothly without causing buckling or scratching to the thin substrate.
    Type: Application
    Filed: April 8, 2009
    Publication date: May 13, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chen-Chung Du, Kang-Feng Lee, Muh-Wang Liang, Chan-Hsing Lo, Tung-Chuan Wu
  • Publication number: 20090283042
    Abstract: A susceptor positioning and supporting device of a vacuum apparatus for carrying and elevating a substrate in a vacuum apparatus chamber is provided. The device has a lateral positioning and supporting mechanism to perform clamping and positioning at a side of a susceptor, preventing the susceptor from slanting inside the vacuum apparatus chamber. The lateral positioning and supporting mechanism and the susceptor thereby forms a closed beam support mechanism capable of reducing load suspension deformation at the ends of the large susceptor. The device improves planarity of the large susceptor and the substrate, and in turn improves uniformity of a thin film deposited on the substrate.
    Type: Application
    Filed: August 19, 2008
    Publication date: November 19, 2009
    Inventors: Chen-Chung DU, Muh-Wang Liang, Ching-Huei Wu, Ming-Tung Chiang
  • Publication number: 20090151637
    Abstract: A microwave-excited plasma source using a ridged wave-guide line-type microwave plasma reactor is disclosed. The microwave-excited plasma source comprises a reaction chamber, a ridged wave-guide and a separation plate. The ridged wave-guide is disposed on the reaction chamber, and comprises a frame portion, a ridge portion and a line-shaped slot. The line-shaped slot is disposed on a first side of the frame portion, and the ridge portion facing the line-shaped slot is disposed on a second side of the frame portion. The separation plate is disposed on the line-shaped slot. Moreover, the ridged wave-guide is suitable for concentrating microwave power, which is transmitted to the reaction chamber through the line-shaped slot in order to excite plasma.
    Type: Application
    Filed: May 29, 2008
    Publication date: June 18, 2009
    Applicant: Industrial Technology Research Institute
    Inventors: CHIH-CHEN CHANG, TUNG-CHUAN WU, FU-CHING TUNG, MUH-WANG LIANG, CHING-HUEI WU, CHAN-HSING LO, TEAN-MU SHEN, JUNG-CHEN CHIEN, JUNG-CHEN HO
  • Publication number: 20090090616
    Abstract: A system and a method for plasma enhanced thin film deposition are disclosed, in which the system comprises a plasma enhanced thin film deposition apparatus and a plasma process monitoring device. The plasma enhanced thin film deposition apparatus receives pulsed power and a reactive gas, whereby plasma discharging occurs to ionize the reactive gas into a plurality of radicals for thin film deposition. The plasma process monitoring device comprises an optical emission spectroscopy (OES) and a pulsed plasma modulation device, in which the OES detects spectrum intensities of the radicals and the pulsed plasma modulation device calculates a spectrum intensity ratio of the radicals so as to modulate the plasma duty time of pulsed power, thereby high deposition rate as well as real-time monitoring on thin film deposition quality can be achieved.
    Type: Application
    Filed: January 17, 2008
    Publication date: April 9, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: CHEN-CHUNG DU, JEN-RONG HUANG, MUH-WANG LIANG, CHIH-CHEN CHANG, SHENG-LANG LEE, CHING-HUEI WU, CHAN-HSING LO
  • Publication number: 20090046957
    Abstract: The invention teaches a new way to make mesh bags using adhesive labels and continuous mesh tubing. Using adhesive labels on continuous mesh tubing is made possible by guiding the mesh tubing both on the outside of the tubing and the inside of the tubing so that an adhesive label does not stick to the mesh surface on the other side of the mesh tubing. As a result the invention also teaches a new type of mesh bag made with this process and a new machine used for making mesh bags.
    Type: Application
    Filed: August 15, 2007
    Publication date: February 19, 2009
    Inventor: Hsiehyueh Wang Liang
  • Patent number: 7449091
    Abstract: A wafer electroplating apparatus with a function of bubble removal includes an electroplating bath main body and a fixing device. The electroplating bath main body has an inlet device, a first de-bubble tank and at least an air hole. The fixing device has a second de-bubble tank and an outer shell. The air hole guides gathering bubbles to an outside of the electroplating bath main body so as to remove bubbles. The fixing device can be put into the first de-bubble tank within the electroplating bath main body to form a de-bubble area and is separated easily therefrom to clean the wafer electroplating apparatus. The electroplating bath main body further includes a baffle for rectifying electroplating solution flow before entering the inlet device.
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: November 11, 2008
    Assignee: Industrial Technology Research Institute
    Inventors: Chen-Chung Du, Jen-Rong Huang, Pang-Ming Chiang, Chih-Yuan Tseng, Muh-Wang Liang, Chih-Cheng Wang, Yi-Chao Weng
  • Publication number: 20080147806
    Abstract: The present invention relates to a mobile terminal, computer program products and an associated method. The mobile terminal is arranged for using a session based service, wherein the session based service requires exchange of control information between the mobile terminal and a second unit. The mobile terminal comprises means for transmitting and/or receiving control information of the session based service in the body field of an MSRP-message and means for identifying said control information in said body field by means of a content type field of the MSRP-message.
    Type: Application
    Filed: February 8, 2005
    Publication date: June 19, 2008
    Inventors: Ling Robbie, Zhang Jialu, Wang Liang, Lu Yunjie
  • Publication number: 20080063322
    Abstract: The invention teaches a new type of mesh bag suitable for machine packaging. The first end of the mesh bag is a reserved opening for filling and sealing. The second end of the mesh bag includes a one-pull, easy-open mechanism and a re-closing mechanism. The re-closing mechanism is a drawstring perforating around the second end of the mesh bag. The one-pull, easy open mechanism is a line of easy open stitches which sews a small strip of hard paper with the wall of the mesh bag at its second end. The two mechanisms can be pre-set in parallel or integrated in a same line with the small strip of the hard paper overlaid on the drawstring.
    Type: Application
    Filed: September 1, 2006
    Publication date: March 13, 2008
    Inventor: Hsiehyueh Wang Liang
  • Publication number: 20070170963
    Abstract: An exemplary CPU frequency regulating circuit includes a detecting circuit, and a comparing circuit. The detecting circuit receives a PWM signal from a super I/O chipset, and converts the PWM signal to a load voltage responsive to a workload of a CPU. The comparing circuit is coupled to the detecting circuit for receiving the load voltage, and compares the load voltage with a reference voltage, and adjusts a frequency of the CPU according to a result of the comparison.
    Type: Application
    Filed: November 25, 2006
    Publication date: July 26, 2007
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HSIN-WANG LIANG, HAN-CHIANG CHUANG, HUNG-JU CHEN, CHIEN-CHUNG HUANG, WEN-LUNG LIANG, CHIH-LIANG KUO
  • Patent number: 7163377
    Abstract: An apparatus and method for mounting a fixture to a ceiling according to which a tubular retainer extends in an opening of an arm and a fastener extends through the retainer and is retained by the retainer. The fastener is adapted to engage a device at the ceiling to mount the arm to the device.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: January 16, 2007
    Assignee: Diani, LLC.
    Inventors: Frank Blateri, Wang Liang Chou
  • Publication number: 20060137974
    Abstract: A wafer electroplating apparatus with a function of bubble removal includes an electroplating bath main body and a fixing device. The electroplating bath main body has an inlet device, a first de-bubble tank and at least an air hole. The fixing device has a second de-bubble tank and an outer shell. The air hole guides gathering bubbles to an outside of the electroplating bath main body so as to remove bubbles. The fixing device can be put into the first de-bubble tank within the electroplating bath main body to form a de-bubble area and is separated easily therefrom to clean the wafer electroplating apparatus. The electroplating bath main body further includes a baffle for rectifying electroplating solution flow before entering the inlet device.
    Type: Application
    Filed: March 8, 2005
    Publication date: June 29, 2006
    Inventors: Chen-Chung Du, Jen-Rong Huang, Pang-Ming Chiang, Chih-Yuan Tseng, Muh-Wang Liang, Chih-Cheng Wang, Yi-Chao Weng
  • Patent number: 7021208
    Abstract: The present invention relates to a compress and position apparatus with positioning, orientating functions and providing more uniform pressing force compliantly. The compress and position apparatus comprises a guiding column, a base, a housing, a seat, a annular portion and a pressing plate. The base has a cylinder, a plurality of locating pins and a convex portion. The annular portion has a through hole and a plurality of locating holes. The guiding column and the cylinder are disposed in the housing provided with an opening for the guiding column passing therethrough. The housing is mounted on the base and passed through a through hole of the annular portion and disposed in a cavity of the seat. A plane on the housing abuts a plane on the cavity to prevent the rotation of the housing. The guiding column is combined with the seat. The locating pin is inserted into the locating hole. The pressing plate engages the annular portion. Thus the guiding column is moved up and down by the gas supply device.
    Type: Grant
    Filed: January 27, 2004
    Date of Patent: April 4, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Chen-Chung Du, Pang-Ming Chiang, Jen-Rong Huang, Muh-Wang Liang, Yi-Chao Weng
  • Patent number: 6997664
    Abstract: The present invention proposes an apparatus for loading and unloading wafers to and from the semiconductor fabrication equipment. The present invention uses two U-shaped port plate supporters of high rigidity to respectively join with drive devices such as lead screws, shaft bearings, and a lead device, and then join with components such as a port plate, a port door, and a base. The assembly is driven by a motor via timing pulleys, timing belts, idle wheels, a pair of lead screws, shaft bearings, and a lead device. An encoder is matched for feedback control. Thereby, accurate positioning of the main mechanism of the wafer pod responsible for upward and downward movement can be achieved so as to increase the accuracy and reliability of positioning transfer of wafers. Secondarily, the contamination of particles resulted from the motion of the main mechanism can be reduced by using an intake filtering system.
    Type: Grant
    Filed: July 19, 2000
    Date of Patent: February 14, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Muh-Wang Liang, Chun-Kai Huang, Jiann-Cherng Chen, Tzong-Ming Wu, Ping-Yu Hu, Kuan-Chou Chen
  • Publication number: 20050156389
    Abstract: A suction device includes a substrate having a plurality of apertures. In each of the apertures, an adjusting member is mounted. The adjusting member has a tube and a rim. The tube has a close inner end and an open outer end and the rim is projected from the tube and attached on a sidewall of the aperture. The tube has a gap between the inner end thereof and the rim so that air only flows through the aperture through the gap.
    Type: Application
    Filed: March 16, 2004
    Publication date: July 21, 2005
    Applicant: Chi-Wang LIANG
    Inventors: Chi-Wang Liang, Chung-Heng Yang
  • Patent number: 6883791
    Abstract: A suction device includes a substrate having a plurality of aperture, in each of which an inner ring, a plug and an outer ring are mounted. The plug is moved between the inner ring and the outer ring. The inner ring and the plug are made of a magnet and a magnetic material to attach the plug on the inner ring to seal an axial hole of the inner ring. The plug will move to the outer ring by an external force, such as airflow, to seal an axial hole of the outer ring. An air guide plate is attached on the substrate and has a plurality of channels to be communicated to the axial holes of the outer rings respectively and to extract air therefrom.
    Type: Grant
    Filed: March 10, 2004
    Date of Patent: April 26, 2005
    Inventors: Chi-Wang Liang, Chung-Heng Yang