Abstract: The present invention relates to a compress and position apparatus with positioning, orientating functions and providing more uniform pressing force compliantly. The compress and position apparatus comprises a guiding column, a base, a housing, a seat, a annular portion and a pressing plate. The base has a cylinder, a plurality of locating pins and a convex portion. The annular portion has a through hole and a plurality of locating holes. The guiding column and the cylinder are disposed in the housing provided with an opening for the guiding column passing therethrough. The housing is mounted on the base and passed through a through hole of the annular portion and disposed in a cavity of the seat. A plane on the housing abuts a plane on the cavity to prevent the rotation of the housing. The guiding column is combined with the seat. The locating pin is inserted into the locating hole. The pressing plate engages the annular portion. Thus the guiding column is moved up and down by the gas supply device.

Abstract: A dynamic clock pulse adjusting device is disclosed. It is comprised of a detection mechanism, a logic circuit, and a clock pulse generator. The detection mechanism performs real-time detection of the work temperature or load of the CPU. The logic circuit determines whether the work temperature or load exceeds a predetermined threshold. The clock pulse generator then adjusts the frequency of the output clock pulses, so as to increase or reduce the CPU work frequency.

Abstract: An energy saving type vibration device for cellular phone comprises a vibration member, a magnetic actuator, elastic means activated by the vibration member, and an electric coil. In response to an incoming call, a magnetic force of the electric coil is generated. The actuator is continuously attracted and repelled for moving back and forth respectively by the magnetic force of the electric coil as cyclic actions of charge and discharge of capacitors. The vibration member is thus capable of generating a resonance for causing the cellular phone to vibrate continuously, thereby informing a user of the incoming call.

Abstract: A method for low temperature liquid-phase deposition and a method for cleaning a liquid-phase deposition apparatus are disclosed. The method for low temperature liquid-phase deposition is employed so as to form a low-temperature grown film or a film with excellent step-coverage on the surface of a semiconductor device having independent circuit functions. The method for cleaning liquid-phase deposition apparatus is characterized in that a loop used exclusively for cleaning is employed so as to prevent SiO2 powders from remaining in the loop.

Abstract: A method for low temperature liquid-phase deposition and a method for cleaning a liquid-phase deposition apparatus are disclosed. The method for low temperature liquid-phase deposition is employed so as to form a low-temperature grown film or a film with excellent step-coverage on the surface of a semiconductor device having independent circuit functions. The method for cleaning liquid-phase deposition apparatus is characterized in that a loop used exclusively for cleaning is employed so as to prevent SiO2 powders from remaining in the loop.

Abstract: A wafer loading system positioning method and device, comprising a loading system, having a base and a rear plate for docking on a positioning frame of a production equipment. The main characteristic thereof is that the loading system in an upper part of the rear plate has a holding seat and the positioning frame in an upper part of a front side has an upward extending positioning element. Two eccentric cams on the holding seat and the positioning element allow to adjust a relative position of the holding seat with respect to the positioning element. A lifting mechanism enables raising of the loading system for lifting said holding seat above said positioning element, so as to enable said holding seat to engage with said positioning element.

Abstract: The present invention provides an apparatus for liquid phase deposition, comprising: a saturation reaction system, including a mixture trough, at least two supply devices for raw materials, a stirrer device, a filter device, and valve control devices; a steady-flow over-saturation loop reaction system, including an over-saturation reaction trough, at least one liquid level control trough, at least two supply devices for raw materials, a stirrer device, a filter device, and valve control devices; an automatic solution concentration monitoring system, for controlling the reactant concentrations; and a waste liquid recycling system, comprising at least two storage troughs, a recycled waste liquid level sensor, a recycled waste liquid sensor, and valve control devices.

Abstract: A method for liquid phase deposition, including the steps of providing at least two raw materials from at least two supply devices of a saturation reaction system into a mixture trough and stirring until saturation occurs, filtering out unnecessary solid-state particles, and providing saturated and filtered liquid into an over-saturation reaction trough of a steady-flow over-saturation loop reaction system and stopping the saturated and filtered liquid when the over-saturation reaction trough is filled and the saturated and filtered liquid over-flows into a liquid level control trough to a pre-determined level. The method also includes the steps of providing a substrate in the over-saturation reaction trough, providing reactants from at least two supply devices into the over-saturation reaction trough, and depositing a thin film onto the substrate when the saturated liquid becomes over-saturated.

Abstract: The present invention provides a fabricating process for forming multi-layered metal bumps by electroless plating, comprising the steps of: providing an IC chip or a semiconductor substrate on which there are provided a plurality of pads; dispensing a first dielectric layer, exposing the pads, roughing the surface to be redistributed by chemical or physical approaches, activating the surface in order to follow-up electroless plating deposition advantageously, and dispensing a second dielectric layer so as to define a redistribution path; depositing a conductive film on the redistribution path by electroless plating, in which the conductive film allows the positions of the pads to be changed so as to be connected to the external circuit; forming a photoresist pattern, exposing a plurality of pre-determined positions on the conductive film so as to redistribute the positions for the metal bumps formed later; performing activation on the pre-determined positions so as to generate an activator; forming initial me

Abstract: A lighting fixture in which a subhousing for a ballast circuit is disposed between two spaced portions of a bottom plate and a top plate. Sockets are connected to the respective ends of the plates for receiving at least one bulb.

Abstract: A lighting fixture in which a housing defines a center channel, and at least one side channel extending to a side of the center channel and parallel to the center channel. A ballast is disposed in the center channel, and two sockets are connected to the respective ends of each side channel to form an assembly the height of which is less than the combined height of the socket and the ballast. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure; and is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims under 37CFR 1.

Abstract: A Modified door for wafer container, includes a rotatable cammed member, two first links coupled to the rotatable cammed member and vertically aligned and moved in and out of respective first latch holes on the wafer transport module upon rotary motion of the rotatable cammed member, and two second links respectively coupled to the first links and horizontally moved in and out of respective second latch holes on the wafer transport module upon movement of the first links. The links each have a slope adapted to be moved with the respective link over a respective bearing means of the door body to force the door body inwards against the wafer transport module, keeping the wafer transport module well sealed.

Abstract: An airlift piston mechanism is disclosed to include a casing having a piston chamber, an air inlet, a check valve in the air inlet, and an air outlet, a link, a piton reciprocated by the link in the piston chamber, the piston having an air accumulation chamber in communication with the piston chamber, annular grooves around the periphery, and an air passage in communication between the air accumulation chamber and the annular grooves, and seal rings mounted in the annular grooves, the seal rings each having radial through holes for discharging of air from the air accumulation chamber for enabling the seal rings to be lifted subject to the variation of air pressure in the air accumulation chamber to reduce friction resistance between the casing and the piston.

Abstract: A chemiluminescence analyzer determines the level of chemiluminescence of a specimen. The chemiluminescence analyzer includes a light detection chamber for containing the specimen to be analyzed. The light detection chamber includes a chamber access device, for allowing the positioning of the specimen within the light detection chamber, and a shutter device. The shutter device and the chamber access device are configured to each have an open position and a closed position. A light detector is positioned behind the shutter device. When the shutter device is in the open position, the light detector detects light within the light detection chamber. An interlock assembly is interfaced with the shutter device and the chamber access device, such that the interlock assembly prevents the shutter device and the chamber access device from being simultaneously opened.

Abstract: A personal guided transport vehicle is disclosed to include a horizontal motion unit, a vertical motion unit, and a gear set coupled between a shaft of the horizontal motion unit and a shaft of the vertical motion unit for enabling the shafts to be interlocked. When operating a horizontal operating lever of the horizontal motion unit, a lock pin is forced into engagement with a mounting hole of the shaft of the vertical motion unit. The horizontal motion unit and the vertical motion unit each have a spring plunger for self-lock. A docking mechanism is disclosed to enable the vehicle to be easily positioned in a docking flange. The docking mechanism includes a locating plate and a coupling plate, the locating plate having a locating notch for quick alignment, the coupling plate having hooks for hooking on the docking flange to hold the vehicle in position.

Abstract: A personal guided transport vehicle is disclosed to include a horizontal motion unit, a vertical motion unit, and a gear set coupled between a shaft of the horizontal motion unit and a shaft of the vertical motion unit for enabling the shafts to be interlocked. When operating a horizontal operating lever of the horizontal motion unit, a lock pin is forced into engagement with a mounting hole of the shaft of the vertical motion unit. The horizontal motion unit and the vertical motion unit each have a spring plunger for self-lock. A docking mechanism is disclosed to enable the vehicle to be easily positioned in a docking flange. The docking mechanism includes a locating plate and a coupling plate, the locating plate having a locating notch for quick alignment, the coupling plate having hooks for hooking on the docking flange to hold the vehicle in position.

Abstract: A fan assembly according to which a block member is connected to a rotor end casing and an arm member having a blade connected thereto is mounted to the block member. One of the members has a radially extending slot formed therein and the other member has a mounting flange adapted to extend into the slot when the arm is moved radially outwardly relative to the block member to mount the arm to the block member without the need for additional components.

Abstract: The present invention provides a fabricating process for forming multi-layered metal bumps by electroless plating, comprising the steps of: providing an IC chip or a semiconductor substrate on which there are provided a plurality of pads; dispensing a first dielectric layer, exposing the pads, roughing the surface to be redistributed by chemical or physical approaches, activating the surface in order to follow-up electroless plating deposition advantageously, and dispensing a second dielectric layer so as to define a redistribution path; depositing a conductive film on the redistribution path by electroless plating, in which the conductive film allows the positions of the pads to be changed so as to be connected to the external circuit; forming a photoresist pattern, exposing a plurality of pre-determined positions on the conductive film so as to redistribute the positions for the metal bumps formed later; performing activation on the pre-determined positions so as to generate an activator; forming initial me

Abstract: The present invention provides an apparatus for liquid phase deposition, comprising: a saturation reaction system, including a mixture trough, at least two supply devices for raw materials, a stirrer device, a filter device, and valve control devices; a steady-flow over-saturation loop reaction system, including an over-saturation reaction trough, at least one liquid level control trough, at least two supply devices for raw materials, a stirrer device, a filter device, and valve control devices; an automatic solution concentration monitoring system, for controlling the reactant concentrations; and a waste liquid recycling system, comprising at least two storage troughs, a recycled waste liquid level sensor, a recycled waste liquid sensor, and valve control devices.