Patents by Inventor Wataru KASAI
Wataru KASAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978557Abstract: A system (10) that provides diagnosis support information (110) relating to a disease of a target subject (5) includes: an acquisition unit (11) that acquires subject information (105) including actual image data (15) of an MR image including at least a reference region including part of an evaluation target region of the subject; and an information providing unit (12) that provides diagnosis support information (110) based on pseudo PET image data (115) of the evaluation target region generated by an image processing model (60) machine learned with training data (70) including actual image data (71) of a MR image of a reference region and actual image data (72) of a PET image including the evaluation target region of a plurality of test subjects so as to generate pseudo PET image data (75) of the evaluation target region from actual image data (71) of an MR image of the reference region, from the actual image data (15) of an individual MR image of the target subject.Type: GrantFiled: September 12, 2019Date of Patent: May 7, 2024Assignee: Splink, Inc.Inventors: Kempei Takemoto, Wataru Kasai, Yuki Aoyama
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Publication number: 20230227684Abstract: To provide a powder dispersion comprising a tetrafluoroethylene polymer, a particular polyoxyalkylene-modified polydimethylsiloxane and a liquid dispersion medium, and a composite having a baked product having physical properties intrinsic to the tetrafluoroethylene polymer. [Solution] The powder dispersion of the present invention comprises a powder of a tetrafluorethylene polymer, a liquid dispersion medium and a polyoxyalkylene-modified polydimethylsiloxane having a weight average molecular weight of at most 3,000 and an HLB value of from 1 to 18 calculated by Griffin's equation The composite of the present invention is produced by applying the powder dispersion of the present invention to the surface of a substrate and heating the powder dispersion.Type: ApplicationFiled: February 28, 2023Publication date: July 20, 2023Applicant: AGC INC.Inventors: Mai Nishi, Tatsuya Terada, Tomoya Hosoda, Wataru Kasai
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Publication number: 20230169648Abstract: There is provided a system for determining the state of dementia by using an image differentiation technique and a cognitive test score together with each other. A system includes: a first input module configured to acquire a first evaluation index based on data regarding the physical state of a brain of a subject; a second input module configured to acquire a second evaluation index based on data regarding the function of the brain of the subject; and an estimation module configured to estimate the state of dementia of the subject based on an evaluation value obtained by a first evaluation function having the first evaluation index and the second evaluation index as its variables.Type: ApplicationFiled: February 24, 2021Publication date: June 1, 2023Inventors: Wataru Kasai, Akihiro Okuno, Hirofumi Shido
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Patent number: 11632859Abstract: Provided is a long laminate for a printed wiring board, which has reduced thickness of a resin layer and increased signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer. The long laminate contains a metal layer of a long metal foil, a fluororesin layer containing a fluororesin and contacting the metal layer, and a heat-resistant resin layer containing a heat-resistant resin and contacting the fluororesin layer. Each fluororesin layer is 1 to 10 ?m thick. The ratio of the total thickness of the fluororesin layer to the total thickness of the heat-resistant resin layer is 0.3 to 3.0. The sum of the total thickness of the fluororesin layer and the total thickness of the heat-resistant resin layer is at most 50 ?m. Also provided are a method for producing the long laminate, and the printed wiring board.Type: GrantFiled: June 25, 2020Date of Patent: April 18, 2023Assignee: AGC Inc.Inventors: Wataru Kasai, Tomoya Hosoda, Atsumi Yamabe
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Patent number: 11535015Abstract: To provide a molded product, a metal-clad laminate and a printed wiring board, each of which contains a tetrafluoroethylene type polymer, whereby an decrease in electrical characteristics is inhibited and a hole can be easily bored with UV-YAG laser; and methods for their production. A molded product containing a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength range where the extinction coefficient becomes to be from 1.2 to 4.5 at from 200 to 380 nm; and a method for its production. A metal-clad laminate having a conductive metal layer and a layer of the molded product; and a method for its production. A printed wiring board provided with the metal-clad laminate and having through-holes in the thickness direction of the polymer layer.Type: GrantFiled: March 4, 2020Date of Patent: December 27, 2022Assignee: AGC Inc.Inventors: Wataru Kasai, Tomoya Hosoda
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Patent number: 11370200Abstract: The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of a second surface 10b thereof is measured by an atomic force microscope.Type: GrantFiled: October 23, 2019Date of Patent: June 28, 2022Assignee: AGC Inc.Inventors: Tomoya Hosoda, Tatsuya Terada, Atsumi Yamabe, Nobutaka Kidera, Wataru Kasai
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Publication number: 20220157487Abstract: To provide a film which is excellent in heat resistance, which is less likely to be warped and which has high adhesion, a method for producing it, and a metal-clad laminate and a coated metal conductor, using the film. The film of the present invention comprises an aromatic polyimide base film, and a layer containing a polymer having units based on tetrafluoroethylene and units based on a perfluoro(alkyl vinyl ether) and an aromatic polymer, formed on each side of the base film.Type: ApplicationFiled: February 3, 2022Publication date: May 19, 2022Applicant: AGC INC.Inventors: Wataru KASAI, Tomoya HOSODA, Atsumi MITSUNAGA, Tatsuya TERADA, Sota YUKI
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Publication number: 20220118742Abstract: As an exemplary configuration, a long film is configured by thermomeltable polymers including a first unit based on tetrafluoroethylene and a second unit based on perfluoro (alkyl vinyl ether), including spherulites of the thermomeltable polymers, wherein radius of each spherulite is 10 ?m or less. As another exemplary configuration, a long film is configured by tetrafluoroethylene polymers having a melt flow rate within a range of 5 to 40 g/10 min. The long film is heated at 180° C. for 30 minutes so as to measure the thermal expansion rate, and when letting thermal expansion rate in a first direction, which extends at a 45-degree angle to a melt flow direction be A, and thermal expansion rate in a second direction orthogonal to the first direction be B, A and B are respectively within the range of ?2 to +1%, and |A?B| is 1% or less.Type: ApplicationFiled: December 27, 2021Publication date: April 21, 2022Applicant: AGC Inc.Inventors: Wataru KASAI, Yuya HORIGUCHI, Seigo KOTERA, Tomoya HOSODA
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Publication number: 20210296001Abstract: There is provided a dementia risk presentation system (10) that presents a dementia risk of a user.Type: ApplicationFiled: July 31, 2019Publication date: September 23, 2021Inventors: Yuki AOYAMA, Wataru KASAI
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Patent number: 11098170Abstract: To provide a film excellent in breakage resistance and uniform stretchability, and a method for its production. The film is a single-layer film characterized in that it is made of a blend resin of two kinds of resins both belonging to any one of ETFE, PFA, FEP, ECTFE and PMP, wherein the melt flow rate of the film is at least 6 g/10 min. and less than 20 g/10 min., and ? of the film as measured by a prescribed measurement method is at least 0.99.Type: GrantFiled: November 15, 2018Date of Patent: August 24, 2021Assignee: AGC Inc.Inventors: Wataru Kasai, Masami Suzuki
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Publication number: 20210257094Abstract: A system (10) that provides diagnosis support information (110) relating to a disease of a target subject (5) includes: an acquisition unit (11) that acquires subject information (105) including actual image data (15) of an MR image including at least a reference region including part of an evaluation target region of the subject; and an information providing unit (12) that provides diagnosis support information (110) based on pseudo PET image data (115) of the evaluation target region generated by an image processing model (60) machine learned with training data (70) including actual image data (71) of a MR image of a reference region and actual image data (72) of a PET image including the evaluation target region of a plurality of test subjects so as to generate pseudo PET image data (75) of the evaluation target region from actual image data (71) of an MR image of the reference region, from the actual image data (15) of an individual MR image of the target subject.Type: ApplicationFiled: September 12, 2019Publication date: August 19, 2021Inventors: Kempei TAKEMOTO, Wataru KASAI, Yuki AOYAMA
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Patent number: 10940629Abstract: To provide an ETFE film which is unlikely to wrinkle when stretched and retracted, and a method for producing the same. It is an ethylene-tetrafluoroethylene copolymer film characterized in that the crystallinity obtained by the formula (1) from the peak area S20 in the vicinity of 2?=20°, the peak area S19 in the vicinity of 2?=19° and the peak area S17 in the vicinity of 2?=17° in the diffraction intensity curve obtained by the X-ray diffraction method, is from 55 to 70%, and the proportion of the quasi-crystal layer obtained by the formula (2) is from 10 to 20%: crystallinity (%)=(S19+S2)/(S17+S19+S20)×100??(1) proportion of quasi-crystal layer (%)=S20/(S17+S19++S20)×100??(2).Type: GrantFiled: November 15, 2018Date of Patent: March 9, 2021Assignee: AGC Inc.Inventors: Wataru Kasai, Kengo Kawahara
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Publication number: 20210040252Abstract: A material for a printed circuit board, which is a film composed of a fluorinated resin layer, where the fluorinated resin layer contains a composition containing a fluorinated copolymer having at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, has a melt flow rate of at most 15 g/10 min measured at 372° C. under a load of 49N, and has a storage elastic modulus of at least 650 MPa.Type: ApplicationFiled: October 14, 2020Publication date: February 11, 2021Applicant: AGC Inc.Inventors: Tomoya HOSODA, Wataru KASAI, Toru SASAKI, Masatoshi ABE
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Patent number: 10913183Abstract: To provide a process for producing a package for mounting a semiconductor element by using a mold, said a package for mounting a semiconductor element comprising a substrate having a mounting surface for mounting a semiconductor element and a packaging body formed from a cured product of a curable resin and having a frame-shaped portion surrounding the mounting surface, and the package has a concave portion formed by the mounting surface and the packaging body, which allows it to prevent resin burrs without occurrence of dents or damage of a substrate and failure in releasing from a mold, and to provide a mold release film to be suitably used for the production process.Type: GrantFiled: September 6, 2016Date of Patent: February 9, 2021Assignee: AGC Inc.Inventor: Wataru Kasai
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Publication number: 20210024702Abstract: To provide a dispersion, a laminate, a film and an impregnated woven fabric. A powder dispersion comprising powder I of polymer I having units based on tetrafluoroethylene and an oxygen-containing polar group, powder II of polymer II containing units based on a fluoroolefin, a dispersing agent, and a liquid dispersion medium, wherein the ratio of the mass content of the polymer I to the mass content of the polymer II is at most 0.7, or such a power dispersion wherein the dispersing agent is a fluorinated surfactant having a hydroxy group. A laminate, a film, and an impregnated woven fabric produced by using such a powder dispersion.Type: ApplicationFiled: October 9, 2020Publication date: January 28, 2021Applicant: AGC Inc.Inventors: Atsumi YAMABE, Tomoya HOSODA, Wataru KASAI
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Publication number: 20200407524Abstract: To provide a dielectric film which is excellent in dielectric properties and stability in the electric corrosion test and which is suitable for producing a high-precision printed board. A roll film comprising a melt-processable fluororesin as the main component and having a thickness of from 1 to 100 ?m, the dimensional change rate of which is less than 1.0%, in terms of an absolute value, in each of MD and TD, when heated at 150° C. for 30 minutes and then cooled to 25° C., based on the dimension at 25° C.Type: ApplicationFiled: September 15, 2020Publication date: December 31, 2020Applicant: AGC Inc.Inventors: Seigo KOTERA, Wataru KASAI, Junetsu NAKAMURA, Takatoshi YAOITA
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Patent number: 10844153Abstract: A material having a fluorinated resin layer is subjected to heat treatment. The fluorinated resin layer is composed of a composition containing a fluorinated copolymer (a) having at least one type of functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, having a melting point of from 280 to 320° C. and a melt flow rate of at least 2 g/10 min measured at 372° C. under a load of 49 N. The heat treatment is carried out at a temperature of at least 250° C. and lower by at least 5° C. than the melting point of the fluorinated copolymer (a) so that the ratio of the melt flow rate of the fluorinated resin layer after the heat treatment to that before the heat treatment, and the melt flow rate of the fluorinated resin layer after the heat treatment, are respectively within specific ranges.Type: GrantFiled: October 18, 2017Date of Patent: November 24, 2020Assignee: AGC Inc.Inventors: Tomoya Hosoda, Wataru Kasai, Toru Sasaki, Masatoshi Abe
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Patent number: 10807776Abstract: To provide a resin film which comprises an ethylene/tetrafluoroethylene copolymer and which is to be used as, for example, a rubber plug lamination film to prevent breakage at the time of producing a laminated rubber plug. The resin film comprises an ethylene/tetrafluoroethylene copolymer and is characterized in that the product of the value of the endothermic peak height ?H (mW/mg) obtained by its DSC-analysis and the haze (%) measured at a thickness of 100 ?m, is from 0.1 to 0.2 (mW/mg·%).Type: GrantFiled: March 1, 2018Date of Patent: October 20, 2020Assignee: AGC Inc.Inventors: Daisuke Taguchi, Wataru Kasai, Yoshiaki Higuchi
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Publication number: 20200329558Abstract: To provide a long laminate capable of obtaining a printed wiring board which is capable of satisfying both reduction in the thickness of a resin layer and increase in the signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer; a method for producing a long laminate which has a thin fluororesin layer which has no wrinkles; and a printed wiring board. A long laminate 10 comprising a metal layer 12 made of a long metal foil, a fluororesin layer 14 containing a fluororesin, in contact with the metal layer 12, and a heat-resistant resin layer 16 containing a heat-resistant resin, in contact with the fluororesin layer 14, wherein the thickness per one fluororesin layer 14 is from 1 to 10 ?m, the ratio (T1/T2) of the total thickness T1 of the fluororesin layer 14 to the total thickness T2 of the heat-resistant resin layer 16, is from 0.3 to 3.Type: ApplicationFiled: June 25, 2020Publication date: October 15, 2020Applicant: AGO Inc.Inventors: Wataru Kasai, Tomoya Hosoda, Atsumi Yamabe
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Patent number: 10729018Abstract: To stably produce a laminate wherein heat resistant resin layers are laminated on both surfaces of a fluorinated resin layer, by thermal lamination.Type: GrantFiled: September 7, 2018Date of Patent: July 28, 2020Assignee: AGC Inc.Inventors: Toru Sasaki, Wataru Kasai