Patents by Inventor Wataru KASAI

Wataru KASAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978557
    Abstract: A system (10) that provides diagnosis support information (110) relating to a disease of a target subject (5) includes: an acquisition unit (11) that acquires subject information (105) including actual image data (15) of an MR image including at least a reference region including part of an evaluation target region of the subject; and an information providing unit (12) that provides diagnosis support information (110) based on pseudo PET image data (115) of the evaluation target region generated by an image processing model (60) machine learned with training data (70) including actual image data (71) of a MR image of a reference region and actual image data (72) of a PET image including the evaluation target region of a plurality of test subjects so as to generate pseudo PET image data (75) of the evaluation target region from actual image data (71) of an MR image of the reference region, from the actual image data (15) of an individual MR image of the target subject.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: May 7, 2024
    Assignee: Splink, Inc.
    Inventors: Kempei Takemoto, Wataru Kasai, Yuki Aoyama
  • Publication number: 20230227684
    Abstract: To provide a powder dispersion comprising a tetrafluoroethylene polymer, a particular polyoxyalkylene-modified polydimethylsiloxane and a liquid dispersion medium, and a composite having a baked product having physical properties intrinsic to the tetrafluoroethylene polymer. [Solution] The powder dispersion of the present invention comprises a powder of a tetrafluorethylene polymer, a liquid dispersion medium and a polyoxyalkylene-modified polydimethylsiloxane having a weight average molecular weight of at most 3,000 and an HLB value of from 1 to 18 calculated by Griffin's equation The composite of the present invention is produced by applying the powder dispersion of the present invention to the surface of a substrate and heating the powder dispersion.
    Type: Application
    Filed: February 28, 2023
    Publication date: July 20, 2023
    Applicant: AGC INC.
    Inventors: Mai Nishi, Tatsuya Terada, Tomoya Hosoda, Wataru Kasai
  • Publication number: 20230169648
    Abstract: There is provided a system for determining the state of dementia by using an image differentiation technique and a cognitive test score together with each other. A system includes: a first input module configured to acquire a first evaluation index based on data regarding the physical state of a brain of a subject; a second input module configured to acquire a second evaluation index based on data regarding the function of the brain of the subject; and an estimation module configured to estimate the state of dementia of the subject based on an evaluation value obtained by a first evaluation function having the first evaluation index and the second evaluation index as its variables.
    Type: Application
    Filed: February 24, 2021
    Publication date: June 1, 2023
    Inventors: Wataru Kasai, Akihiro Okuno, Hirofumi Shido
  • Patent number: 11632859
    Abstract: Provided is a long laminate for a printed wiring board, which has reduced thickness of a resin layer and increased signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer. The long laminate contains a metal layer of a long metal foil, a fluororesin layer containing a fluororesin and contacting the metal layer, and a heat-resistant resin layer containing a heat-resistant resin and contacting the fluororesin layer. Each fluororesin layer is 1 to 10 ?m thick. The ratio of the total thickness of the fluororesin layer to the total thickness of the heat-resistant resin layer is 0.3 to 3.0. The sum of the total thickness of the fluororesin layer and the total thickness of the heat-resistant resin layer is at most 50 ?m. Also provided are a method for producing the long laminate, and the printed wiring board.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: April 18, 2023
    Assignee: AGC Inc.
    Inventors: Wataru Kasai, Tomoya Hosoda, Atsumi Yamabe
  • Patent number: 11535015
    Abstract: To provide a molded product, a metal-clad laminate and a printed wiring board, each of which contains a tetrafluoroethylene type polymer, whereby an decrease in electrical characteristics is inhibited and a hole can be easily bored with UV-YAG laser; and methods for their production. A molded product containing a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength range where the extinction coefficient becomes to be from 1.2 to 4.5 at from 200 to 380 nm; and a method for its production. A metal-clad laminate having a conductive metal layer and a layer of the molded product; and a method for its production. A printed wiring board provided with the metal-clad laminate and having through-holes in the thickness direction of the polymer layer.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: December 27, 2022
    Assignee: AGC Inc.
    Inventors: Wataru Kasai, Tomoya Hosoda
  • Patent number: 11370200
    Abstract: The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of a second surface 10b thereof is measured by an atomic force microscope.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: June 28, 2022
    Assignee: AGC Inc.
    Inventors: Tomoya Hosoda, Tatsuya Terada, Atsumi Yamabe, Nobutaka Kidera, Wataru Kasai
  • Publication number: 20220157487
    Abstract: To provide a film which is excellent in heat resistance, which is less likely to be warped and which has high adhesion, a method for producing it, and a metal-clad laminate and a coated metal conductor, using the film. The film of the present invention comprises an aromatic polyimide base film, and a layer containing a polymer having units based on tetrafluoroethylene and units based on a perfluoro(alkyl vinyl ether) and an aromatic polymer, formed on each side of the base film.
    Type: Application
    Filed: February 3, 2022
    Publication date: May 19, 2022
    Applicant: AGC INC.
    Inventors: Wataru KASAI, Tomoya HOSODA, Atsumi MITSUNAGA, Tatsuya TERADA, Sota YUKI
  • Publication number: 20220118742
    Abstract: As an exemplary configuration, a long film is configured by thermomeltable polymers including a first unit based on tetrafluoroethylene and a second unit based on perfluoro (alkyl vinyl ether), including spherulites of the thermomeltable polymers, wherein radius of each spherulite is 10 ?m or less. As another exemplary configuration, a long film is configured by tetrafluoroethylene polymers having a melt flow rate within a range of 5 to 40 g/10 min. The long film is heated at 180° C. for 30 minutes so as to measure the thermal expansion rate, and when letting thermal expansion rate in a first direction, which extends at a 45-degree angle to a melt flow direction be A, and thermal expansion rate in a second direction orthogonal to the first direction be B, A and B are respectively within the range of ?2 to +1%, and |A?B| is 1% or less.
    Type: Application
    Filed: December 27, 2021
    Publication date: April 21, 2022
    Applicant: AGC Inc.
    Inventors: Wataru KASAI, Yuya HORIGUCHI, Seigo KOTERA, Tomoya HOSODA
  • Publication number: 20210296001
    Abstract: There is provided a dementia risk presentation system (10) that presents a dementia risk of a user.
    Type: Application
    Filed: July 31, 2019
    Publication date: September 23, 2021
    Inventors: Yuki AOYAMA, Wataru KASAI
  • Patent number: 11098170
    Abstract: To provide a film excellent in breakage resistance and uniform stretchability, and a method for its production. The film is a single-layer film characterized in that it is made of a blend resin of two kinds of resins both belonging to any one of ETFE, PFA, FEP, ECTFE and PMP, wherein the melt flow rate of the film is at least 6 g/10 min. and less than 20 g/10 min., and ? of the film as measured by a prescribed measurement method is at least 0.99.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: August 24, 2021
    Assignee: AGC Inc.
    Inventors: Wataru Kasai, Masami Suzuki
  • Publication number: 20210257094
    Abstract: A system (10) that provides diagnosis support information (110) relating to a disease of a target subject (5) includes: an acquisition unit (11) that acquires subject information (105) including actual image data (15) of an MR image including at least a reference region including part of an evaluation target region of the subject; and an information providing unit (12) that provides diagnosis support information (110) based on pseudo PET image data (115) of the evaluation target region generated by an image processing model (60) machine learned with training data (70) including actual image data (71) of a MR image of a reference region and actual image data (72) of a PET image including the evaluation target region of a plurality of test subjects so as to generate pseudo PET image data (75) of the evaluation target region from actual image data (71) of an MR image of the reference region, from the actual image data (15) of an individual MR image of the target subject.
    Type: Application
    Filed: September 12, 2019
    Publication date: August 19, 2021
    Inventors: Kempei TAKEMOTO, Wataru KASAI, Yuki AOYAMA
  • Patent number: 10940629
    Abstract: To provide an ETFE film which is unlikely to wrinkle when stretched and retracted, and a method for producing the same. It is an ethylene-tetrafluoroethylene copolymer film characterized in that the crystallinity obtained by the formula (1) from the peak area S20 in the vicinity of 2?=20°, the peak area S19 in the vicinity of 2?=19° and the peak area S17 in the vicinity of 2?=17° in the diffraction intensity curve obtained by the X-ray diffraction method, is from 55 to 70%, and the proportion of the quasi-crystal layer obtained by the formula (2) is from 10 to 20%: crystallinity (%)=(S19+S2)/(S17+S19+S20)×100??(1) proportion of quasi-crystal layer (%)=S20/(S17+S19++S20)×100??(2).
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: March 9, 2021
    Assignee: AGC Inc.
    Inventors: Wataru Kasai, Kengo Kawahara
  • Publication number: 20210040252
    Abstract: A material for a printed circuit board, which is a film composed of a fluorinated resin layer, where the fluorinated resin layer contains a composition containing a fluorinated copolymer having at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, has a melt flow rate of at most 15 g/10 min measured at 372° C. under a load of 49N, and has a storage elastic modulus of at least 650 MPa.
    Type: Application
    Filed: October 14, 2020
    Publication date: February 11, 2021
    Applicant: AGC Inc.
    Inventors: Tomoya HOSODA, Wataru KASAI, Toru SASAKI, Masatoshi ABE
  • Patent number: 10913183
    Abstract: To provide a process for producing a package for mounting a semiconductor element by using a mold, said a package for mounting a semiconductor element comprising a substrate having a mounting surface for mounting a semiconductor element and a packaging body formed from a cured product of a curable resin and having a frame-shaped portion surrounding the mounting surface, and the package has a concave portion formed by the mounting surface and the packaging body, which allows it to prevent resin burrs without occurrence of dents or damage of a substrate and failure in releasing from a mold, and to provide a mold release film to be suitably used for the production process.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: February 9, 2021
    Assignee: AGC Inc.
    Inventor: Wataru Kasai
  • Publication number: 20210024702
    Abstract: To provide a dispersion, a laminate, a film and an impregnated woven fabric. A powder dispersion comprising powder I of polymer I having units based on tetrafluoroethylene and an oxygen-containing polar group, powder II of polymer II containing units based on a fluoroolefin, a dispersing agent, and a liquid dispersion medium, wherein the ratio of the mass content of the polymer I to the mass content of the polymer II is at most 0.7, or such a power dispersion wherein the dispersing agent is a fluorinated surfactant having a hydroxy group. A laminate, a film, and an impregnated woven fabric produced by using such a powder dispersion.
    Type: Application
    Filed: October 9, 2020
    Publication date: January 28, 2021
    Applicant: AGC Inc.
    Inventors: Atsumi YAMABE, Tomoya HOSODA, Wataru KASAI
  • Publication number: 20200407524
    Abstract: To provide a dielectric film which is excellent in dielectric properties and stability in the electric corrosion test and which is suitable for producing a high-precision printed board. A roll film comprising a melt-processable fluororesin as the main component and having a thickness of from 1 to 100 ?m, the dimensional change rate of which is less than 1.0%, in terms of an absolute value, in each of MD and TD, when heated at 150° C. for 30 minutes and then cooled to 25° C., based on the dimension at 25° C.
    Type: Application
    Filed: September 15, 2020
    Publication date: December 31, 2020
    Applicant: AGC Inc.
    Inventors: Seigo KOTERA, Wataru KASAI, Junetsu NAKAMURA, Takatoshi YAOITA
  • Patent number: 10844153
    Abstract: A material having a fluorinated resin layer is subjected to heat treatment. The fluorinated resin layer is composed of a composition containing a fluorinated copolymer (a) having at least one type of functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, having a melting point of from 280 to 320° C. and a melt flow rate of at least 2 g/10 min measured at 372° C. under a load of 49 N. The heat treatment is carried out at a temperature of at least 250° C. and lower by at least 5° C. than the melting point of the fluorinated copolymer (a) so that the ratio of the melt flow rate of the fluorinated resin layer after the heat treatment to that before the heat treatment, and the melt flow rate of the fluorinated resin layer after the heat treatment, are respectively within specific ranges.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: November 24, 2020
    Assignee: AGC Inc.
    Inventors: Tomoya Hosoda, Wataru Kasai, Toru Sasaki, Masatoshi Abe
  • Patent number: 10807776
    Abstract: To provide a resin film which comprises an ethylene/tetrafluoroethylene copolymer and which is to be used as, for example, a rubber plug lamination film to prevent breakage at the time of producing a laminated rubber plug. The resin film comprises an ethylene/tetrafluoroethylene copolymer and is characterized in that the product of the value of the endothermic peak height ?H (mW/mg) obtained by its DSC-analysis and the haze (%) measured at a thickness of 100 ?m, is from 0.1 to 0.2 (mW/mg·%).
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: October 20, 2020
    Assignee: AGC Inc.
    Inventors: Daisuke Taguchi, Wataru Kasai, Yoshiaki Higuchi
  • Publication number: 20200329558
    Abstract: To provide a long laminate capable of obtaining a printed wiring board which is capable of satisfying both reduction in the thickness of a resin layer and increase in the signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer; a method for producing a long laminate which has a thin fluororesin layer which has no wrinkles; and a printed wiring board. A long laminate 10 comprising a metal layer 12 made of a long metal foil, a fluororesin layer 14 containing a fluororesin, in contact with the metal layer 12, and a heat-resistant resin layer 16 containing a heat-resistant resin, in contact with the fluororesin layer 14, wherein the thickness per one fluororesin layer 14 is from 1 to 10 ?m, the ratio (T1/T2) of the total thickness T1 of the fluororesin layer 14 to the total thickness T2 of the heat-resistant resin layer 16, is from 0.3 to 3.
    Type: Application
    Filed: June 25, 2020
    Publication date: October 15, 2020
    Applicant: AGO Inc.
    Inventors: Wataru Kasai, Tomoya Hosoda, Atsumi Yamabe
  • Patent number: 10729018
    Abstract: To stably produce a laminate wherein heat resistant resin layers are laminated on both surfaces of a fluorinated resin layer, by thermal lamination.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: July 28, 2020
    Assignee: AGC Inc.
    Inventors: Toru Sasaki, Wataru Kasai