Abstract: To provide an adhesive film comprising a polyimide film and a fluorinated resin layer directly laminated, in which blisters (foaming) in an atmosphere corresponding to reflow soldering at high temperature are suppressed, and a flexible metal laminate. An adhesive film having a fluorinated resin layer containing a fluorinated copolymer (A) directly laminated on one side or both sides of a polyimide film, wherein the fluorinated copolymer (A) has a melting point of at least 280° C. and at most 320° C., is melt-moldable, and has at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and the fluorinated resin layer has a thickness of from 1 to 20 ?m.

Abstract: To provide a mold release film which is excellent in releasability and capable of suppressing contamination of a mold or a resin-encapsulation portion by the mold release film and which is capable of forming a resin-encapsulation portion excellent in adhesion to an ink layer, and a process for producing a semiconductor package using the mold release film. A mold release film to be disposed on a cavity surface of a mold in a method for producing a semiconductor package wherein a semiconductor element is disposed in the mold and encapsulated with a curable resin to form a resin-encapsulation portion, characterized in that it has a first surface to be in contact with the curable resin at the time of forming the resin-encapsulation portion, and a second surface to be in contact with the cavity surface, at least the first surface is made of a fluororesin, and in a specific test method, F/Al is from 0.2 to 4, or F/(C+F+O) is from 0.1 to 0.3.

Abstract: A mold release film to be disposed on a cavity surface of a mold in a method for producing a semiconductor package wherein a semiconductor element is disposed in the mold and encapsulated with a curable resin to form a resin-encapsulation portion, characterized in that it has a first surface to be in contact with the curable resin at the time of forming the resin-encapsulation portion, and a second surface to be in contact with the cavity surface, at least one of the first surface and the second surface has irregularities formed thereon, and the surface having irregularities formed thereon, has an arithmetic mean roughness (Ra) of from 1.3 to 2.5 ?m and a peak count (RPc) of from 80 to 200; and a process for producing a semiconductor package by using the mold release film.

Abstract: A mold release film, which is adapted to be disposed on the cavity surface of a mold to form a resin-encapsulated portion by encapsulating a semiconductor element of a semiconductor device with a curable encapsulation resin, has a tensile modulus of elasticity of from 10 to 24 MPa at 132° C. as measured in accordance with JIS K 7127, and a peak peel resistance of at most 0.8 N/25 mm.

Abstract: To provide an insulating tape for covering, in which a polyimide film and a fluorinated resin film are laminated with excellent adhesion, and a method for producing a structure, which comprises covering a conductor with such an insulating tape for covering, followed by thermal treatment. The insulating tape for covering, comprises a polyimide film and a fluorinated resin film directly laminated on one or both surfaces of the polyimide film, wherein the fluorinated resin film contains a fluorinated copolymer (A) which has a melting point of from 220 to 320° C. and can be melt-molded and which has at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups.

Abstract: A mold release film, which is adapted to be disposed on the cavity surface of a mold to form a resin-encapsulated portion by encapsulating a semiconductor element of a semiconductor device with a curable encapsulation resin, has a tensile modulus of elasticity of from 10 to 24 MPa at 132° C. as measured in accordance with JIS K 7127, and a peak peel resistance of at most 0.8 N/25 mm.