Abstract: An electronic device includes a support member and a mount member mounting on the support member. The support member and the mount member are sealed by a resin member. The support member includes a surface having a laser irradiation mark. The mount member includes a surface having a rough portion with an accumulation of material of the support member.

Abstract: In a semiconductor device, a semiconductor element has a front electrode and a back electrode. The back electrode is connected to a wiring member through a bonding member. Wire pieces are disposed in the bonding member, and bonded to a bonding surface of the wiring member to protrude toward the semiconductor element. The bonding member has, in a plan view, a central region that overlaps with a central portion of the semiconductor element including an element center, and an outer peripheral region that includes a portion overlapping with an outer peripheral portion of the semiconductor element surrounding the central portion and surrounds the central region. At least four wire pieces are disposed in the outer peripheral region at positions corresponding to at least four respective corners of the semiconductor element. At least one wire piece is disposed to extend toward the element center in the plan view.

Abstract: To provide an aqueous sodium ion secondary battery which can achieve a high electrochemical capacity as compared with a known sodium ion secondary battery having an aqueous electrolytic solution. An aqueous sodium ion secondary battery includes a cathode, an anode, an electrolytic solution and a separator, wherein the cathode has at least a cathode active material containing at least a sodium transition metal polyanion represented by the formula Na3-xMPO4CO3 (M is at least one member selected from the group consisting of Fe, Mn, Ni and Co, and x is 0 or more and 2 or less), and the electrolytic solution is an aqueous electrolytic solution.

Abstract: An electronic device includes: a support member that has a metallic placement surface joined to the conductive bonding layer, and a metallic sealing surface provided on an outer side of the placement surface in an in-plane direction of the placement surface to adjoin the placement surface and to surround the placement surface; and a resin member, which is a synthetic resin molded article, joined to the sealing surface and covering the electronic component. The sealing surface includes a rough surface having a plurality of laser irradiation marks having a substantially circular shape. The rough surface includes a first region and a second region. The second region has a higher density of the laser irradiation marks in the in-plane direction than the first region.

Abstract: A rotor blade for an aircraft includes first and second blade tips, a blade body, and a vortex-generating blade. The blade body has an end forming the first blade tip of the rotor blade and an airfoil section configured such that during rotation, pressure acting on a lower surface of the blade body is greater than pressure acting on an upper surface of the blade body. The vortex-generating blade is disposed at an end of the rotor blade and forms the second blade tip. The vortex-generating blade also has an airfoil section configured such that during rotation, pressure acting on a lower surface of the vortex-generating blade is smaller than pressure acting on an upper surface of the vortex-generating blade.

Abstract: Provided is a flight efficiency improving system for a compound helicopter with a rotor and fixed wings. In forward flight of the compound helicopter, the flight efficiency improving system does not perform a cyclic pitch control of the rotor so as to allow a difference in lift generated by the rotor between an advancing side and a retreating side of the rotor, or the flight efficiency improving system performs the cyclic pitch control to an extent that does not completely eliminate the difference. The fixed wings are provided respectively on left and right sides of a body and are asymmetric to each other so that influence of an aerodynamic interference between the rotor and the fixed wings is reduced.

Abstract: Provided is a vibration control system for a compound helicopter with a rotor and a fixed wing. The fixed wing includes a movable flap that is mounted on a rear edge of the fixed wing. The vibration control system periodically moves the movable flap so as to periodically change lift of the fixed wing such that vibration aerodynamically generated by the fixed wing is in anti-phase with vibration caused by rotation of the rotor.

Abstract: A compound helicopter includes a fuselage, a fixed wing, a rotary wing, and a barrier member. The fixed wing is fixed to the fuselage. The rotary wing is rotatably coupled to the fuselage. The barrier member is attached to a part, of the fuselage, that is above the fixed wing and is between the rotary wing and the fixed wing. The barrier member is configured to generate no lift upon forward flight.

Abstract: A lift-changing mechanism is configured to change generated by a wing of an aircraft and includes a slit and an opening and closing member. The slit extends in a wingspan direction inside the wing and forms openings on the lower surface of the wing and on the upper surface of the wing respectively. A part of airflow below the lower surface is allowed to flow toward the upper surface through the slit. The opening and closing member is configured to open and close the slit. When the opening and closing member opens the slit, lift generated on the wing is decreased compared with when the slit is closed.

Abstract: The present invention provides a fire extinguisher capable of easily installing a thinly molded fire extinguishing agent. A fire extinguisher of the present invention comprises a fire extinguishing agent layer that generates aerosol by combustion, a first plate covering a first surface of the fire extinguishing agent layer and having a blowout aperture for the aerosol, and a second plate covering a second surface of the fire extinguishing agent layer, which is opposite to the first surface. An edge of the first plate and an edge of the second plate may be connected to each other. And, a peripheral wall extending toward the second plate may be provided at the edge of the first plate.

Abstract: A base material includes one surface, and a side surface continuous with the one surface. Each of the one surface and the side surface has a sealed region to be sealed with mold resin. The one surface has a one surface rough region in the sealed region thereof. The side surface has a side surface rough region in the sealed region thereof.

Abstract: An electronic device includes: a support member that has a metallic placement surface joined to the conductive bonding layer, and a metallic sealing surface provided on an outer side of the placement surface in an in-plane direction of the placement surface to adjoin the placement surface and to surround the placement surface; and a resin member, which is a synthetic resin molded article, joined to the sealing surface and covering the electronic component. The sealing surface includes a rough surface having a plurality of laser irradiation marks having a substantially circular shape. The rough surface includes a first region and a second region. The second region has a higher density of the laser irradiation marks in the in-plane direction than the first region.

Abstract: An electronic device includes: a support member that has a metallic placement surface joined to the conductive bonding layer, and a metallic sealing surface provided on an outer side of the placement surface in an in-plane direction of the placement surface to adjoin the placement surface and to surround the placement surface; and a resin member, which is a synthetic resin molded article, joined to the sealing surface and covering the electronic component. The sealing surface includes a rough surface having a plurality of laser irradiation marks having a substantially circular shape. The rough surface includes a first region and a second region. The second region has a higher density of the laser irradiation marks in the in-plane direction than the first region.

Abstract: An electronic device includes: a support member that has a metallic placement surface joined to the conductive bonding layer, and a metallic sealing surface provided on an outer side of the placement surface in an in-plane direction of the placement surface to adjoin the placement surface and to surround the placement surface; and a resin member, which is a synthetic resin molded article, joined to the sealing surface and covering the electronic component. The sealing surface includes a rough surface having a plurality of laser irradiation marks having a substantially circular shape. The rough surface includes a first region and a second region. The second region has a higher density of the laser irradiation marks in the in-plane direction than the first region.

Abstract: An electronic device includes a support member and a mount member mounting on the support member. The support member and the mount member are sealed by a resin member. The support member includes a surface having a laser irradiation mark. The mount member includes a surface having a rough portion with an accumulation of material of the support member.

Abstract: A metal member includes a metal substrate and a porous metal layer. A composite includes the metal member and a resin member. The metal substrate has one surface, is made of a metal material, and has a region formed as an uneven layer having an uneven shape with respect to the one surface. The porous metal layer has a mesh-like shape and is formed on the uneven layer. The uneven layer includes a plurality of protrusions protruding in a direction normal to the one surface.

Abstract: There is provided a semiconductor optical integrated device having a DFB laser, an EA modulator, and an SOA monolithically integrated, and an output light intensity of the semiconductor optical integrated device is maintained constant. The semiconductor optical integrated device includes: a DFB laser; an EA modulator connected to the DFB laser; an SOA monolithically integrated with the DFB laser and the EA modulator on a same substrate and connected to an output end of the EA modulator; and an optical receiver disposed on an output end side of the SOA and having a same composition as the SOA. The optical receiver is configured to monitor change in a detection value according to an intensity of input light to the optical receiver such that drive currents flowing in the DFB laser and the SOA are feedback controlled.

Abstract: A rotor blade for an aircraft includes first and second blade tips, a blade body, and a vortex-generating blade. The blade body has an end forming the first blade tip of the rotor blade and an airfoil section configured such that during rotation, pressure acting on a lower surface of the blade body is greater than pressure acting on an upper surface of the blade body. The vortex-generating blade is disposed at an end of the rotor blade and forms the second blade tip. The vortex-generating blade also has an airfoil section configured such that during rotation, pressure acting on a lower surface of the vortex-generating blade is smaller than pressure acting on an upper surface of the vortex-generating blade.

Abstract: A base material includes one surface, and a side surface continuous with the one surface. Each of the one surface and the side surface has a sealed region to be sealed with mold resin. The one surface has a one surface rough region in the sealed region thereof. The side surface has a side surface rough region in the sealed region thereof.

Abstract: The present invention provides an optical transmitter and a light intensity monitoring method that provide reliable APC feedback for a semiconductor laser equipped with an SOA. The optical transmitter includes an SOA integrated EA-DFB having a DFB laser, an EA modulator connected to the DFB laser, and an SOA connected to the EA modulator. In the structure of the optical transmitter, a light detector part is disposed forward of the output end side of an SOA part. The light detector part changes part of an output light beam from the SOA part into an electric current and detects light, while guiding the remaining part of the output light beam to a waveguide. With the light detector part disposed forward for the SOA part, it is possible to feed back the output result from the SOA part. Hence, good APC is possible.