Abstract: A simple, inexpensive burn-in and test mounting for high terminal density grid array packages is formed by a support base which carries a plurality of C-shaped spring finger contacts. One end of each spring finger contact is attached to the first face of the support base at the edge of a hole corresponding to the outline of the LGA package and extends through the hole. The contacts are curved so that the second end of each contact is supported above and spaced from the opposite side of the support base. Each spring finger is curved to define a knee which lies in a plane parallel with the faces of the support base. The spring fingers are arranged so that the knees are in register with lands on an LGA package. When the LGA package is moved toward the support base, the knees contact the lands on the LGA package. Electrical communication may be established with either end of the finger, thus permitting spreading of input/output terminal connections.

Abstract: A test mounting for LGA packages uses curved contact fingers to make electrical contact between lands on the LGA package and surface mount circuitry on a circuit board or the like. The mounting includes a guide member with guide apertures therein spaced from a support base with corresponding guide apertures. A bending plate positioned between the guide plate and the support base is moved laterally with respect thereto to increase or decrease the distance between the ends of each contact finger and thereby connect or disconnect the ends of the contact fingers with an LGA package mounted adjacent the guide plate and circuit pads on a circuit board on which the test mounting is mounted.

Abstract: Test and/or burn-in sockets for high frequency electronic device packages are formed using contact pins having parallel ends joined by a support beam supported so that one end of the pin extends through a guide into a cavity in the socket and the other end extends through a second guide displaced from the first guide. The outer ends of the contact pins are arranged to contact input/output lands of a external circuitry such as a burn-in board or the like and the inner ends arranged to contact input/output leads or lands on an electronic LGA package. The end portions of the contact pins are constrained in parallel guides which are arranged to precisely align the ends of the pins with the terminal lands and the length and size of the contact pins are minimized to minimize signal distortion.

Abstract: Surface mount test and/or burn-in sockets for electronic device packages are formed using contact pins supported between the top of a circuit board and the lower surface of the terminal lead. The central portion of each contact pin is secured in the socket base so that one end of the pin extends into a cavity in the socket and the other end extends from the lower surface of the socket. The ends of the contact pins are supported on curved beams which are designed to control the pressure exerted on the terminal leads and on the contact pads independently.

Abstract: Grid array device packages are mounted on a circuit board or other substrate with a socket having a base member, a retaining member and an array of bent contact pins. The ends of the contact pins are displaced by insertion of a device package and then respond with a small spring force to hold the device package in place against ledges on the retaining member. The contact ends of the pins make electrical connection with terminals on the device package. A sufficient portion of each pin is implanted within the base member to prevent stress from passing through the base member. The retaining member leaves a significant portion of the upper surface of the device package exposed so that packages with attached heat sinks may be mounted therein.

Abstract: Ball grid array devices are mounted in a burn-in and test socket which has a top surface with windows for the ball terminals depending from the ball grad array device. Contact fingers mounted on the base of the socket extend through a bending plate and into the windows from the opposite side of the top surface. When the bending plate is moved laterally with respect to the top surface, the ends of the contact members are moved into contact with the ball terminals. The ends of the contact members are urged into contact with the ball terminals between the center of the ball terminal and the surface of the ball grid array device, thus retaining the device in the socket.

Abstract: Ball grid array devices are mounted in a burn-in and test socket which has a top surface with windows for the ball terminals depending from the ball grad array device. Contact fingers mounted on the base of the socket extend through a cam plate and into the windows from the opposite side of the top surface. When the cam plate is moved laterally with respect to the top surface, the ends of the contact members are moved into contact with the ball terminals. The ends of the contact members are curved to contact the ball terminals between the center of the ball terminal and the surface of the ball grid array device, thus retaining the device in the socket.

Abstract: A pivoting beam or lever is used to open and close burn-in and test sockets which employ laterally moving cammed plates to form electrical contact between electrical contact fingers within the socket and terminals depending from an electronic device package. The pivoting beam is oriented and adapted for operation by vertically applied forces so that opening and closing the socket is easily automatible using the pick and place equipment conventionally used to insert and remove electronic device packages from open top sockets.

Abstract: Ball grid array devices are mounted in a burn-in and test socket which has a top surface with windows for the ball terminals depending from the ball grid array device. Contact fingers mounted on the base of the socket extend through a cam plate and into the windows from the opposite side of the top surface. When the cam plate is moved laterally with respect to the top surface, the ends of the contact members are moved into contact with the ball terminals. The ends of the contact members are curved to contact the ball terminals between the center of the ball terminal and the surface of the ball grid array device, thus retaining the device in the socket.

Abstract: A zero insertion force burn-in and test socket is disclosed which employs a vertically moving top to open and close contact pins which maintain electrical contact with the leads of a surface-mount electronic device package. The socket has a replaceable tray to adapt the socket to various sizes of packages. Horizontal movement of the contact pins is caused and controlled by vertical movement of the top of the socket device.

Abstract: A socket having an array of terminals adapted for insertion into a burn-in board is adapted to interconnect respective pins of a high pin density integrated circuit package to the terminals. The socket includes a lid with an array of holes for receiving the pins and registering the pins with underlying terminal openings and a cam mechanism actuable to move the lid relative to the terminals to cause the pins to make contact with the terminals within the openings. Mounting of the package on the socket and insertion of the pins into underlying terminal openings is accomplished with zero insertion force applied to the pins. Actuation of the cam mechanism causes the pins to contact respective terminals without deforming the pins.

Abstract: The leads of surface-mountable electronic device packages are protected against damage from inadvertent bending by storage in a two-piece cradle. A plurality of peripheral ribs interdigitate with the leads to maintain preferred lead orientation leaving the free end of each lead exposed for electrical contact from outside the cradle.

Abstract: Disclosed are mounting housings for use on burn-in boards, circuit boards and the like. The housings include an insulating base support containing a plurality of electrically conductive axially elongated pins extending therethrough. A spreader mounted for reciprocal movement with respect to the pins and normal to the first major face of the base support has a plurality of spreader members adjacent the pins so that movement of the spreader deflects the pins longitudinally to permit insertion of the leads projecting from the device package between the pins and permitting the pins to contact only the edges of the leads.

Abstract: Disclosed is a test fixture for connecting a plurality of electronic device packages to test apparatus. The fixture includes a plurality of test sockets and means to selectively interconnect the socket leads with external test apparatus. The test fixture may be used as a burn-in board as well as a test, transport and storage medium to reduce individual handling of electronic device packages.

Abstract: Ball grid array devices are mounted in a burn-in and test socket which has a top surface sockets which have top surfaces with windows for the ball terminals terminal balls depending from the ball grad grid array device. Contact fingers mounted on the base of the socket extend through a bending plate and into the windows from the opposite side of the top surface. When the bending plate is moved laterally with respect to the top surface, the ends of the contact members are moved into contact with the ball terminals terminal balls. The ends of the contact members are urged into contact with the ball terminals terminal balls between the center of the ball terminal ball and the surface of the ball grid array device, thus retaining the device in the socket.