Abstract: Ball grid array devices are mounted in a burn-in and test socket which has a top surface with windows for the ball terminals depending from the ball grid array device. Contact fingers mounted on the base of the socket extend through a cam plate and into the windows from the opposite side of the top surface. When the cam plate is moved laterally with respect to the top surface, the ends of the contact members are moved into contact with the ball terminals. The ends of the contact members are curved to contact the ball terminals between the center of the ball terminal and the surface of the ball grid array device, thus retaining the device in the socket.

Abstract: A zero insertion force burn-in and test socket is disclosed which employs a vertically moving top to open and close contact pins which maintain electrical contact with the leads of a surface-mount electronic device package. The socket has a replaceable tray to adapt the socket to various sizes of packages. Horizontal movement of the contact pins is caused and controlled by vertical movement of the top of the socket device.

Abstract: A socket having an array of terminals adapted for insertion into a burn-in board is adapted to interconnect respective pins of a high pin density integrated circuit package to the terminals. The socket includes a lid with an array of holes for receiving the pins and registering the pins with underlying terminal openings and a cam mechanism actuable to move the lid relative to the terminals to cause the pins to make contact with the terminals within the openings. Mounting of the package on the socket and insertion of the pins into underlying terminal openings is accomplished with zero insertion force applied to the pins. Actuation of the cam mechanism causes the pins to contact respective terminals without deforming the pins.

Abstract: The leads of surface-mountable electronic device packages are protected against damage from inadvertent bending by storage in a two-piece cradle. A plurality of peripheral ribs interdigitate with the leads to maintain preferred lead orientation leaving the free end of each lead exposed for electrical contact from outside the cradle.

Abstract: Disclosed are mounting housings for use on burn-in boards, circuit boards and the like. The housings include an insulating base support containing a plurality of electrically conductive axially elongated pins extending therethrough. A spreader mounted for reciprocal movement with respect to the pins and normal to the first major face of the base support has a plurality of spreader members adjacent the pins so that movement of the spreader deflects the pins longitudinally to permit insertion of the leads projecting from the device package between the pins and permitting the pins to contact only the edges of the leads.

Abstract: Disclosed is a test fixture for connecting a plurality of electronic device packages to test apparatus. The fixture includes a plurality of test sockets and means to selectively interconnect the socket leads with external test apparatus. The test fixture may be used as a burn-in board as well as a test, transport and storage medium to reduce individual handling of electronic device packages.

Abstract: Disclosed are sockets for flat pack electronic device packages on a carrier. The socket includes a lid for receiving the carrier and the flat pack package in a loading position. The lid is rotated to a latched position so as to align each of the ribbon leads of the electronic device package with one of a plurality of contacts embedded in the base of the socket. Means are provided to automatically align the carrier and flat pack package with the socket when the carrier is loaded into the lid.

Abstract: Disclosed are methods and apparatus for rapidly and automatically unloading electronic circuit packages from zero insertion force sockets on a burn-in board or the like by inverting the burn-in board and placing sequential rows of the sockets in compressive rolling contact with a roller supported beneath the burn-in board. Means are provided to capture the electronic circuit packages as they fall from the sockets and to store the packages in carrier tubes.

Abstract: Disclosed is a socket comprising a base member and a top plate member. Substantially U-shaped pin connectors are mounted in the top face of the base member and include a contact pin extending through the base member. The top plate member is aligned substantially parallel with and spaced from the base member and adapted to move toward and away from the base member. The top plate member includes an aperture aligned with each U-shaped pin connector and includes a wedge-shaped body positioned to spread the legs of each U-shaped pin connector when the top plate portion is moved toward the base member.

Abstract: Disclosed is a mounting housing for leadless chip carriers for use on burn-in boards, circuit boards and the like. The housing includes an insulating base support containing a plurality of electrically conductive axially elongated bodies extending therethrough arranged to define a rectangular cavity in a plane parallel with the first major face of the base support. The ends of the axially elongated bodies defining the cavity have edges inclined inwardly toward the cavity and edges inclined outwardly from the cavity. A spreader mounted for reciprocal movement axially with respect the elongated bodies has an inclined surface mating with the outwardly inclined edges of the elongated bodies so that movement of the spreader moves the inwardly inclined edges outwardly to permit insertion of a leadless chip carrier within the cavity.

Abstract: Disclosed is apparatus for aligning a plurality of circuit packages in a row and transferring the row of circuit packages to a corresponding row of receiving sockets in a burn-in board. The apparatus includes a transfer arm carrying a transfer rack pivotal about a non-rotatable shaft which moves axially to raise and lower the transfer arm. The transfer rack includes a plurality of reciprocal blades adapted to receive the circuit packages therebetween and transfer them to the receiving sockets. The reciprocal blades are retracted to release the circuit packages and the pins on the circuit packages are inserted into the sockets by spring loaded plungers positioned intermediate the blades.

Abstract: An apparatus for loading circuit packages having a first support surface (36) for supporting a circuit package and a pressure pad (38) spaced apart from the support surface (36) for applying pressure to a circuit package is disclosed. A second support surface (48) which is substantially in line with the first support surface supports a circuit package for unloading. The support surfaces move in a direction substantially perpendicular to the plane of the surfaces so that circuit packages are inserted straight into their sockets and removed straight from their sockets. A gravity circuit package feeder (20) feeds circuit packages onto the first support surface. A circuit package stop (54) is located at the end of first support surface opposite the gravity feeder (20). The support surfaces are inclined to the horizontal so that a circuit package comes to rest against the circuit package stop.

Abstract: Disclosed is a semiconductor mounting pad employing slots into which the leads projecting from a header may be inserted without passing the entire lead through the pad. Apparatus for assembling the mounting pads on standard enclosure devices is also disclosed.