Abstract: The invention introduces an apparatus for detecting errors during data encryption. The apparatus includes a search circuitry and a substitution check circuitry. The key generation circuitry is arranged operably to convert a first value of one byte corresponding to a plaintext, an intermediate encryption result, or a round key into a second value of a K-bit according to an 8-to-K lookup table, where K is an integer ranging from 10 to 15 and the second value comprises (K minus 8) bits of a Hamming parity. The substitution check circuitry is arranged operably to employ check formulae corresponding to the 8-to-K lookup table to determine whether an error is occurred during a conversion of the first value of the one byte into the second value of the K-bit, and output an error signal when finding the error, where a total amount of the formulae is K minus 8.

Abstract: An optical image stabilization method and system, and an electronic device are provided. The method is implemented by a camera module. The camera module includes a lens and a photosensitive element. Shake data of the camera module is obtained. In response to the shake data being less than or equal to a first threshold, based on the shake data and a first compensation strategy, at least one of the lens and the photosensitive element is driven to move. In response to the shake data being greater than the first threshold, based on the shake data and a second compensation strategy, the lens and the photosensitive element are driven to move.

Abstract: A package structure includes a first die and a second die embedded in a first molding material, a first redistribution structure over the first die and the second die, a second molding material over portions of the first die and the second die, wherein the second molding material is disposed between a first portion of the first redistribution structure and a second portion of the first redistribution structure, a first via extending through the second molding material, wherein the first via is electrically connected to the first die, a second via extending through the second molding material, wherein the second via is electrically connected to the second die and a silicon bridge electrically coupled to the first via and the second via.

Abstract: A precooling device integrated with a cooling distribution unit and a server liquid cooling system are provided. The precooling device includes a liquid cooling row, an adapter assembly, and a cooling distribution unit. The adapter assembly includes a flow joining row and a flow distribution row. The cooling distribution unit supplies a refrigerant from an interior thereof, and includes an outlet and an inlet communicating with the interior. The outlet communicates with the flow distribution row of the adapter assembly to deliver the refrigerant for heat exchange. The refrigerant being performed the heat exchange returns to the liquid cooling row through the flow joining row of the adapter assembly for precooling, and then returns from the liquid cooling row to the cooling distribution unit through the inlet. The refrigerant is precooled before returning to the cooling distribution unit.

Abstract: An electronic package is provided, in which electronic elements and at least one packaging module including a semiconductor chip and a shielding structure covering the semiconductor chip are disposed on a carrier structure, an encapsulation layer encapsulates the electronic elements and the packaging module, and a shielding layer is formed on the encapsulation layer and in contact with the shielding structure. Therefore, the packaging module includes the semiconductor chip and the shielding structure and has a chip function and a shielding wall function simultaneously.

Abstract: The present invention is related to a novel positive electrode active material for lithium-ion battery. The positive electrode active material is expressed by the following formula: Li1.2NixMn0.8-x-yZnyO2, wherein x and y satisfy 0<x?0.8 and 0<y?0.1. In addition, the present invention provides a method of manufacturing the positive electrode active material. The present invention further provides a lithium-ion battery which uses said positive electrode active material.

Abstract: A negative electrode structure applied to an aluminum battery includes a hole material layer and a metal plating layer. The metal plating layer is located on the hole material layer such that the capacity decay rate of the aluminum battery is less than 5% per cycle.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure, the method includes forming a buffer layer over a substrate. An active layer is formed on the buffer layer. A top electrode is formed on the active layer. An etch process is performed on the buffer layer and the substrate to define a plurality of pillar structures. The plurality of pillar structures include a first pillar structure laterally offset from a second pillar structure. At least portions of the first and second pillar structures are spaced laterally between sidewalls of the top electrode.

Abstract: In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from an isolation insulating layer disposed over a semiconductor substrate is formed, a cleaning operation is performed, and an epitaxial semiconductor layer is formed over the channel region. The cleaning operation and the forming the epitaxial semiconductor layer are performed in a same chamber without breaking vacuum.

Abstract: Systems, methods, and apparatuses disclosed herein can generate and report a cross link interference (CLI) report. These systems, methods, and apparatuses can receive a CLI report configuration that outlines requirements for the CLI report, where the CLI report configuration is received on Layer 1 signaling, for example, Downlink Control Information (DCI) on a Physical Downlink Control Channel (PDCCH) or Layer 2 signaling, for example, downlink (DL) Media Access Control-Control Element (MAC-CE) on Physical Downlink Shared Channel (PDSCH). The CLI report configuration can identify the one or more CLI measurement resources to be measured and reported; one or more CLI measurements to be performed on the one or more CLI measurement resources; one or more CLI measurement occasions to measure the one or more CLI measurement resources; and one or more resources, to be used to report the CLI report. These systems, methods, and apparatuses can generate the CLI report as outlined in the CLI report configuration.

Abstract: A mechanism for building decentralized computer applications that execute on a distributed computing system. The present technology works within a web browser, client application, or other software and provides access to decentralized computer applications through the browser. The present technology is non-custodial, wherein a public-private key pair, which represents user identity, is created on a client machine and then directly encrypted by a third-party platform without relying on one centralized computing system.

Abstract: An apparatus for wireless communication includes a receiver configured to receive a request for data associated with an Internet-of-things (IoT) service session with an IoT cloud server. The apparatus further includes a transmitter configured to transmit, based on receiving the request and prior to transmitting a response to the request, a message indicating a timing parameter associated with availability of the data. The receiver is further configured to receive an uplink grant at a time that is based on the timing parameter, and the transmitter is further configured to transmit the response to the request based on the uplink grant. The response includes at least a subset of the data.

Abstract: Apparatus and methods are provided for UE-assisted tethering report. In one novel aspect, UE-assisted tethering report is generated with UE-assisted procedure based on latency measurement configuration. In one embodiment, the UE-assisted tethering report includes one or more elements comprising one bit to inform the activation of tethering mode, latency of packet transmission, and other side-information related to tethering path. In one embodiment, the UE-assisted procedure is inserting a measurement timestamp or recording timing of a predefined transport block (TB) of the packet. In another novel aspect, the UE performs a jitter measurement for an extended reality (XR) traffic, sends a UE-assisted information report for an end-to-end path of the XR traffic based on the jitter measurements, wherein the UE-assisted information includes one or more elements comprising jitter information and burst arrival time.

Abstract: Embodiments of this specification disclose graph data partition computer-implemented methods, non-transitory, computer-readable media, and computer-implemented systems. A computer-implemented method includes partitioning vertices in graph data into a plurality of dataset. Edges in the graph data are partitioned into datasets that include target vertices of the edges, where the datasets are used by nodes in a distributed cluster to perform graph computation, and where computational loads of the plurality of datasets are similar Implementations of this specification can achieve load balancing between nodes in the distributed cluster and can reduce communication overhead.

Abstract: Some implementations described herein include systems and techniques for fabricating a multi-dimension through silicon via structure in a three-dimensional integrated circuit device. The multi-dimension through silicon via structure includes a first columnar structure having a first width and a second columnar structure including a second width that is greater relative to the first width. The first columnar structure may include a low electrical capacitance and be configured for electrical signaling within the three-dimensional integrated circuit device. The second columnar structure may be configured to provide power to integrated circuitry of the three-dimensional integrated circuit device and also be configured to conduct heat through the three-dimensional integrated circuit device for thermal management of the three-dimensional integrated circuit device. Additionally, a pattern including the second columnar structure may be used for alignment purposes.

Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: Methods, systems, and devices for wireless communications are described. A first user equipment (UE) may receive, from a base station, control signaling indicating a set of resources of a sidelink channel available for sidelink communication with a second UE. The first UE may receive a sidelink preemption indication indicating that at least a first resource from the set of resources is preempted. The first UE may communicate a sidelink transmission over the sidelink channel with the second UE based on the sidelink preemption indication. In some cases, the first UE may determine whether the SPI satisfies one or more thresholds and the first UE may communicate the sidelink transmission, or refrain from communicating the sidelink transmission, based on determining whether the SPI satisfies the one or more thresholds.

Abstract: An electrical connector including an insulating body, a first metallic member, a second metallic member, a plurality of terminals, and a metallic shell is provided. The insulating body has a base portion, a thickened step portion, and a tongue portion. The thickened step portion is located at a root of the base portion. The first metallic member and the second metallic member are disposed on an upper surface and a lower surface of the insulating body. The metallic shell is disposed on an exterior of the insulating body to surround the first metallic member, the second metallic member, and the terminals, wherein the front flat contact portion of each of the terminals is exposed out of the tongue portion, and a portion of the first metallic member and a portion of the second metallic member are exposed out of the thickened step portion.

Abstract: A semiconductor package includes a photonic die, an encapsulated electronic die, a substrate, and a lens structure. The photonic die includes an optical coupler. The encapsulated electronic die is disposed over and bonded to the photonic die. The encapsulated electronic die includes an electronic die and an encapsulating material at least laterally encapsulating the electronic die. The substrate is disposed over and bonded to the encapsulated electronic die. The lens structure is disposed over the photonic die and is overlapped with the optical coupler from a top view. The optical coupler is configured to be optically coupled to an optical signal source through the lens structure.

Abstract: Embodiments are presented herein of apparatuses, systems, and methods for a user equipment device (UE) and/or cellular network to perform downlink control information (DCI) mode signaling and control resource set (CORESET) selection. A DCI mode may be signaled based on a predefined rule, media access control (MAC) control element (CE), and/or group based beam reporting. One or more CORESETs may be selected based on configuration of an active bandwidth part (BWP), CORESET identifier, higher layer index, periodicity, type of search space, and/or MAC CE.