Abstract: Methods for video decoding and encoding, apparatuses and non-transitory storage media are provided. In one decoding method, the decoder obtains a first restricted neighbor area of a current block as a first scanning area and a second restricted neighbor area of the current block as a second scanning area, where the first restricted neighbor area and the second restricted neighbor area are separate. Furthermore, the decoder obtains one or more motion vector (MV) candidates from a plurality of non-adjacent neighbor blocks to the current block based on the first and second scanning areas. Moreover, the decoder obtains one or more control point motion vectors (CPMVs) for the current block based on the one or more MV candidates.

Abstract: The present invention relates to an electronic flexible and rigid endoscope system and method applicable to general practice. The system comprises: a data acquisition system, configured to acquire image data of a lesion site, and a data processing system, configured to process the image data from the data acquisition system. The data acquisition system comprises a handle end and an endoscope end, the endoscope end comprises an imaging insertion end and an operating end, the imaging insertion end enters the lesion site to acquire images of the lesion site, the operating end controls the action of the imaging insertion end, the handle end sends the image data acquired by the endoscope end to the data processing system, the data processing system comprises a data receiving module and an image processing module, and the data receiving module receives the image data acquired by the data acquisition system.

Abstract: An antenna structure and an electronic device are provided. The antenna structure is disposed on a carrier of the electronic device and includes a first dipole radiating element perpendicular to a plane, a second dipole radiating element connected to the first dipole radiating element, and a third dipole radiating element connected to the first dipole radiating element and the second dipole radiating element. The first dipole radiating element is configured to generate a first radiation pattern, the second dipole radiating element is configured to generate a second radiation pattern, and the third radiating element is configured to generate a third radiation pattern. The first radiation pattern is omnidirectional radiation on the plane. A polarization direction of the second radiation pattern and a polarization direction of the third radiation pattern are respectively orthogonal to a polarization direction of the first radiation pattern.

Abstract: A mounting structure for mounting a data storage device includes a cage, a sliding piece, a door, and a lock. The cage has an opening and a cavity. The sliding piece is slidable between a first position and a second position. The sliding piece has a pushing part. The door is rotatably located on the sliding piece and configured for covering or uncovering the opening. The lock is located on the cage and configured for locking the door to cover the opening. When the data storage device is accommodated in the cavity, the door is locked by the lock and the sliding piece is located on the first position, when the lock unlocks the door and the sliding piece slides to the second position, the pushing part pushes the data storage device outwards from the cavity through the opening. A cabinet and a computing device are also disclosed.

Abstract: A semiconductor package, which may correspond to a high-performance computing package, includes an integrated circuit die electrically and/or mechanically connected to a top surface of an interposer and a plurality of connection structures electrically and/or mechanically connected to a bottom surface of the interposer. The top surface of the interposer includes a set of test contact structures (e.g., one or more test bumps) that are electrically connected to the integrated circuit die through traces of the interposer. The set of test structures may be contacted by a probe needle to test a quality and/or a reliability of the integrated circuit die, as well as verify that traces of the interposer are functional. The set of test contact structures allows the integrated circuit die and traces of the interposer to be tested without probing the connection structures.

Abstract: A method for predicting floating times of inclusions during refinements of molten steel includes: predicting a macroscopic multiphase flow field of the molten steel refining, injecting the inclusions into the multiphase flow field uniformly and randomly, determining a capture condition of the inclusions, calculating motion trajectories of the inclusions injected into the multiphase flow field, outputting captured inclusions' information through comparing the motion trajectory of the inclusion and the capture condition, and obtaining an average floating time, a relationship between a removal rate and the floating time, and the complete floating time through analyzing the captured inclusions' information.

Abstract: A charging circuit, a control method and apparatus for a charging circuit, and a mobile terminal. The charging circuit includes: a wireless charging coil, a rectifier bridge, a voltage regulator, a power management module, a voltage comparator, and a first control module. The wireless charging coil, the rectifier bridge, the voltage regulator, and the power management module are sequentially connected in series to form a charging path. The voltage regulator includes an input end and an output end. The input end of the voltage regulator is connected to the rectifier bridge, and the output end of the voltage regulator is connected to the power management module. A first input end of the voltage comparator is connected to the input end of the voltage regulator, and a second input end of the voltage comparator is connected to the output end of the voltage regulator.

Abstract: A package includes a first die, a second die, and an encapsulant. The first die includes a first capacitor. The second die includes a second capacitor. The second die is stacked on the first die. The first capacitor is spatially separated from the second capacitor. The first capacitor is electrically connected to the second capacitor. The encapsulant laterally encapsulates the second die.

Abstract: A method for rendering data of a three-dimensional image adapted to an eye position and a display system are provided. The method is used to render the three-dimensional image to be displayed in a three-dimensional space. In the method, a three-dimensional image data used to describe the three-dimensional image is obtained. The eye position of a user is detected. The ray-tracing information between the eye position and each lens unit of a multi-optical element module forms a region of visibility (RoV) that may cover a portion of the three-dimensional image in the three-dimensional space. When coordinating the physical characteristics of a display panel and the multi-optical element module, a plurality of elemental images can be obtained. The elemental images form an integral image that records the three-dimensional image data adapted to the eye position, and the integral image is used to reconstruct the three-dimensional image.

Abstract: Disclosed in some examples are display systems, methods, devices, and machine-readable mediums which provide for a gesture-based method for specifying a region of a display in which to show shared content. Also disclosed are pairing methods for associating the region of the display with a content source device, methods for sharing content within the region, and methods for providing input from the region back to the content source device. Also disclosed in some examples are display systems, methods, devices, and machine-readable mediums which provide for notification handling for user interfaces.

Abstract: Semiconductor devices and methods of manufacture are provided whereby fences are formed over a substrate and III-V materials are grown over the substrate, wherein the fences block growth of the III-V materials. As such, smaller areas of the III-V materials are grown, thereby preventing stresses that occur with the growth of larger sheets.

Abstract: A method includes placing a first package component. The first package component includes a first alignment mark and a first dummy alignment mark. A second package component is aligned to the first package component. The second package component includes a second alignment mark and a second dummy alignment mark. The aligning is performed using the first alignment mark for positioning the first package component, and using the second alignment mark for position the second package component. The second package component is bonded to the first package component to form a package, with the first alignment mark being bonded to the second dummy alignment mark.

Abstract: Provided is a die stack structure including a first die and a second die. The first die and the second die are bonded together through a hybrid bonding structure. A bonding insulating layer of the hybrid bonding structure extends to contact with one interconnect structure of the first die or the second die.

Abstract: A system provides permission controls for group messages. A system can support user accessibility by the use of a permissions that indicates that a user has accessibility needs with respect to a voice input. When a user is known to have accessibility issue with providing a voice input, a system data structure, such as a Teams directory, can indicate when specific users have special needs. The system can grant them with rights to prevent others from providing messages to a message thread. This allows that person to become a presenter of a meeting while using a message thread to give their presentation without interruption from others. The system can unlock the thread and allow others to provide messages when the user is done with their presentation. By controlling a message thread in this manner, a system can allow users having special needs to participate as a meeting presenter.

Abstract: A portable robotic semiconductor pod loader may detect, with at least one sensor, receipt of a semiconductor pod on a load port of the portable robotic semiconductor pod loader. The at least one sensor is supported by the load port. The portable robotic semiconductor pod loader may cause a robot, of the portable robotic semiconductor pod loader, to align with the semiconductor pod provided on the load port. The portable robotic semiconductor pod loader may cause the robot to attach to the semiconductor pod, and may cause the robot to provide the semiconductor pod from the load port to a staging area of a semiconductor processing tool.

Abstract: An electronic apparatus performs a method of video encoding. The method comprises: obtaining a video picture that includes a first component and a second component; determining a plurality of offsets associated with the second component; utilizing a sample value of the first component to obtain a class index associated with the second component; selecting an offset from the plurality of offsets for the second component according to the class index; and obtaining a sample value of the second component based on the selected offset, wherein utilizing the sample value of the first component to obtain the class index associated with the second component comprises: utilizing a first sample value of the first component to obtain a first parameter; utilizing a second sample value of the first component to obtain a second parameter; and obtaining the class index according to the first parameter and the second parameter.

Abstract: An integrated circuit device includes an interconnect layer, a memory structure, a third conductive feature, and a fourth conductive feature. The interconnect layer includes a first conductive feature and a second conductive feature. The memory structure is over and in contact with the first conductive feature. The memory structure includes at least a resistance switching element over the first conductive feature. The third conductive feature, including a first conductive line, is over and in contact with the second conductive feature. The fourth conductive feature is over and in contact with the memory structure. The fourth conductive feature includes a second conductive line, a top surface of the first conductive line is substantially level with a top surface of the second conductive line, and a bottom surface of the first conductive line is lower than a bottommost portion of a bottom surface of the second conductive line.

Abstract: A p-GaN high-electron-mobility transistor, includes a substrate, a channel layer stacked on the substrate, a supply layer stacked on the channel layer, a first doped layer stacked on the supply layer, a second doped layer stacked on the first doped layer, and a third doped layer stacked on the second doped layer. A doping concentration of the first doped layer and the doping concentration of the third doped layer are lower than a doping concentration of the second doped layer. A gate is located on the third doped layer, and a source and a drain are electrically connected to the channel layer and the supply layer, respectively.

Abstract: An image sensor includes a substrate including a first surface and a second surface opposite to the first surface; a plurality of pixel sensors disposed in the substrate, a sensor isolation feature disposed in the substrate defining an active region, and a dielectric layer between the sensor isolation feature and the substrate, wherein the sensor isolation feature comprises a conductive material.

Abstract: In some embodiments, the present disclosure relates to a 3D integrated circuit (IC) stack that includes a first IC die bonded to a second IC die. The first IC die includes a first semiconductor substrate, a first interconnect structure arranged on a frontside of the first semiconductor substrate, and a first bonding structure arranged over the first interconnect structure. The second IC die includes a second semiconductor substrate, a second interconnect structure arranged on a frontside of the second semiconductor substrate, and a second bonding structure arranged on a backside of the second semiconductor substrate. The first bonding structure faces the second bonding structure. Further, the 3D IC stack includes a first backside contact that extends from the second bonding structure to the backside of the second semiconductor substrate and is thermally coupled to at least one of the first or second interconnect structures.