Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, a proximal clamping plate, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The proximal clamping plate is detachably attached to a side of the connecting seat. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the proximal clamping plate, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the proximal clamping plate, and the connecting seat therebetween into a locked condition.

Abstract: A zoned heat dissipation control system for a water cooling radiator and a water cooling heat dissipation system having the zoned heat dissipation control system includes a plurality of fans, a plurality of heat dissipation zones defined on the water cooling radiator, a thermal detector, and a control unit. At least one of the fans is disposed within each of the heat dissipation zones. The thermal detector is disposed within at least one of the heat dissipation zones and configured to detect the temperature of the water cooling radiator. The control unit is electrically connected to the fans and the thermal detector and configured to modulate the rotational speed of the fan within each of the heat dissipation zones based on the detected data from the thermal detector.

Abstract: An information handling system executing an intelligent throughput performance analysis and issue detection system may comprise a network interface device to establish a wireless link with a wireless network and a processor to execute a neural network trained to predict wireless link throughput values based on controlled connectivity testing metrics gathered in a controlled laboratory from tested information handling systems. The processor may gather measured throughput of the wireless link and operational connectivity metrics for the information handling system that describe antenna positional information, antenna adaptation controller parameters, signal strength measurements, and wireless link performance metrics. The neural network may output, based on the gathered operational connectivity metrics a predicted throughput value that differs from the measured throughput by a maximum tolerance.

Abstract: An information handling system executing an intelligent throughput performance analysis and issue detection system may comprise a network interface device to establish a wireless link with a wireless network and a processor to execute a neural network trained to predict wireless link throughput values based on controlled connectivity testing metrics gathered in a controlled laboratory from tested information handling systems. The processor may gather measured throughput of the wireless link and operational connectivity metrics for the information handling system that describe antenna positional information, antenna adaptation controller parameters, signal strength measurements, and wireless link performance metrics. The neural network may output, based on the gathered operational connectivity metrics a predicted throughput value that differs from the measured throughput by a maximum tolerance.

Abstract: A light emitting diode package structure and a manufacturing method thereof and a display device are provided. The light emitting diode package structure includes a blue light emitting diode and a phosphor layer. The phosphor layer is disposed on the blue light emitting diode package structure, and the phosphor layer includes an encapsulation layer and a plurality of phosphor powders. The phosphor powders are disposed in the encapsulation layer and consist of green phosphor powders, red phosphor powders, and yellow phosphor powders, in which a weight percentage of the yellow phosphor powders ranges from 1% to 10%.

Abstract: A light emitting diode package structure and a manufacturing method thereof and a display device are provided. The light emitting diode package structure includes a blue light emitting diode and a phosphor layer. The phosphor layer is disposed on the blue light emitting diode package structure, and the phosphor layer includes an encapsulation layer and a plurality of phosphor powders. The phosphor powders are disposed in the encapsulation layer and consist of green phosphor powders, red phosphor powders, and yellow phosphor powders, in which a weight percentage of the yellow phosphor powders ranges from 1% to 10%.

Abstract: A backlight module includes a light guide panel and a backlight source, which emits light entering the light guide panel via a light receiving surface on a side of the light guide panel. The backlight source includes a base plate and a plurality of light source holders disposed on the base plate. The light source holder includes a circuit substrate having an opening and a base surface. The base surface and the opening are transitionally connected by a curved surface.

Abstract: A wireless adapter front end system and method for an information handling system including a wireless adapter for communicating on a plurality antenna systems for connection to a plurality of wireless links and an antenna configurable to have a plurality of antenna radiation patterns via an antenna pattern steering control interface, wherein the antenna is operating in a first antenna radiation pattern.

Abstract: A method of image sensor apparatus includes: providing pixel array having pixel units arranged in M rows and N columns; providing N parallel column readout circuits each being arranged for reading out pixel data of one corresponding column; disposing a horizontal shift register in row direction coupled to the N parallel column readout circuits, to receive a pulse signal and a clock signal, sequentially shift a phase of the pulse signal according to the clock signal, and scan a corresponding column according to the shifted phase of the pulse signal; and using a column select circuit having N latches to receive a power down digital control signal transmitted from a microcontroller wherein the power down digital control signal is used to disable at least one column readout circuit to enable and select a portion of the set of N parallel column readout circuits.

Abstract: A method of image sensor apparatus includes: providing pixel array having pixel units arranged in M rows and N columns; providing N parallel column readout circuits each being arranged for reading out pixel data of one corresponding column; disposing a horizontal shift register in row direction coupled to the N parallel column readout circuits, to receive a pulse signal and a clock signal, sequentially shift a phase of the pulse signal according to the clock signal, and scan a corresponding column according to the shifted phase of the pulse signal; and using a column select circuit having N latches to receive a power down digital control signal transmitted from a microcontroller wherein the power down digital control signal is used to disable at least one column readout circuit to enable and select a portion of the set of N parallel column readout circuits.

Abstract: A backlight module includes a light guide panel and a backlight source, which emits light entering the light guide panel via a light receiving surface on a side of the light guide panel. The backlight source includes a base plate and a plurality of light source holders disposed on the base plate. The light source holder includes a circuit substrate having an opening and a base surface. The base surface and the opening are transitionally connected by a curved surface.

Abstract: A display assembling mechanism is applied to a display apparatus. The display assembling mechanism includes a bracket, a front frame and a rear frame. The bracket is configured to accommodate an optical film assembly. The front frame has a main body and a pressing portion connected with each other. A touch module is disposed inside the main body, and the pressing portion is configured to fix an optical component assembly above the bracket. The rear frame is disposed on a side of the bracket opposite to the optical component assembly, and is locked on the front frame to cover the bracket.

Abstract: A display device includes a backlight module, a rear casing, an outer bezel frame, and a panel module. The backlight module includes a back plate and a light emitting assembly disposed on the back plate for emitting light. The rear casing covers the backlight module. The outer bezel frame includes a bezel body, a first fixing portion and a second fixing portion. The first fixing portion and the second fixing portion are disposed on a rear side of the bezel body and spaced apart from each other in a lateral direction. The second fixing portion is located at a side of the first fixing portion away from the backlight module. The first fixing portion and the second fixing portion are respectively fixed to the back plate and the rear casing in the lateral direction. The panel module is fixed on a front side of the bezel body for displaying images.

Abstract: A display device includes a backlight module, a rear casing, an outer bezel frame, and a panel module. The backlight module includes a back plate and a light emitting assembly disposed on the back plate for emitting light. The rear casing covers the backlight module. The outer bezel frame includes a bezel body, a first fixing portion and a second fixing portion. The first fixing portion and the second fixing portion are disposed on a rear side of the bezel body and spaced apart from each other in a lateral direction. The second fixing portion is located at a side of the first fixing portion away from the backlight module. The first fixing portion and the second fixing portion are respectively fixed to the back plate and the rear casing in the lateral direction. The panel module is fixed on a front side of the bezel body for displaying images.

Abstract: A display assembling mechanism is applied to a display apparatus. The display assembling mechanism includes a bracket, a front frame and a rear frame. The bracket is configured to accommodate an optical film assembly. The front frame has a main body and a pressing portion connected with each other. A touch module is disposed inside the main body, and the pressing portion is configured to fix an optical component assembly above the bracket. The rear frame is disposed on a side of the bracket opposite to the optical component assembly, and is locked on the front frame to cover the bracket.

Abstract: A display is provided. The display includes a metal back plate, a plastic frame, a backlight optical module and a liquid-crystal module. The metal back plate includes a plurality of metal wedging portions and a first side. The plastic frame is combined with the metal back plate by injection molding. The plastic frame includes a plurality of plastic wedging portions. The plastic wedging portions wedge the metal wedging portions. The plastic frame defines a recess on the first side of the metal back plate. The backlight optical module is disposed in the recess. The liquid-crystal module covers the backlight optical module and is connected to the plastic frame.

Abstract: A wireless adapter front end system and method for an information handling system including a wireless adapter for communicating on a plurality antenna systems for connection to a plurality of wireless links and an antenna configurable to have a plurality of antenna radiation patterns via an antenna pattern steering control interface, wherein the antenna is operating in a first antenna radiation pattern.

Abstract: A display is provided. The display includes a metal back plate, a plastic frame, a backlight optical module and a liquid-crystal module. The metal back plate includes a plurality of metal wedging portions and a first side. The plastic frame is combined with the metal back plate by injection molding. The plastic frame includes a plurality of plastic wedging portions. The plastic wedging portions wedge the metal wedging portions. The plastic frame defines a recess on the first side of the metal back plate. The backlight optical module is disposed in the recess. The liquid-crystal module covers the backlight optical module and is connected to the plastic frame.

Abstract: A retaining mechanism for holding a circuit board and a related electronic device include a supporter, a first fixing component, a second fixing component and a third fixing component. The first fixing component is disposed on a supporting wall of the supporter, to buckle an edge of the circuit board and to constrain a movement of the circuit board in a first direction. The second fixing component is disposed on another supporting wall of the supporter, to contact against another edge of the circuit board and to constrain a movement of the circuit board in a second direction. The third fixing component is disposed on a base of the supporter. A holding portion and a hooking unit of the third fixing component respectively holds a bottom of the circuit board and inserts into an opening on the circuit board, to prevent the circuit board and the holding portion from separation.