Patents by Inventor Wei-Chia Huang

Wei-Chia Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160234957
    Abstract: A retaining mechanism for holding a circuit board and a related electronic device include a supporter, a first fixing component, a second fixing component and a third fixing component. The first fixing component is disposed on a supporting wall of the supporter, to buckle an edge of the circuit board and to constrain a movement of the circuit board in a first direction. The second fixing component is disposed on another supporting wall of the supporter, to contact against another edge of the circuit board and to constrain a movement of the circuit board in a second direction. The third fixing component is disposed on a base of the supporter. A holding portion and a hooking unit of the third fixing component respectively holds a bottom of the circuit board and inserts into an opening on the circuit board, to prevent the circuit board and the holding portion from separation.
    Type: Application
    Filed: June 2, 2015
    Publication date: August 11, 2016
    Inventors: Wei-Chia Huang, Sliphen Yang
  • Publication number: 20160091190
    Abstract: A structure of a LED heat dissipating substrate and a method of manufacturing such substrate are provided. Material removing process are mainly performed to make a first conducting board, a second conducting board and each of third conducting boards be disconnected from each other. In addition, positive and negative wires are connected to the first and second conducting boards to power and excite a LED die. Thus, the structure can be curved, have the unlimited length, can be continously produced without the conventional electroplating, etching and water cleaning processes, so that no wastewater is produced and the environment protection object is achieved.
    Type: Application
    Filed: September 30, 2014
    Publication date: March 31, 2016
    Inventor: Wei-Chia Huang
  • Patent number: 9035207
    Abstract: A button device has a circuit board, a tact switch having a pressed surface, a light source, and a resilient button capable of sliding relative to the circuit board. The resilient button includes a pressed portion having a projection surface and a light guide column connected to the pressed portion and directing light toward the projection surface. The light guide column includes a light receiving surface facing the light source with a certain distance apart and a touchable portion apart from the pressed surface with a certain distance used for touching the tact switch.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: May 19, 2015
    Assignee: GEMTEK TECHNOLOGY CO., LTD.
    Inventors: Wei Chia Huang, Chih Jung Kao, Hu Chi Chang
  • Publication number: 20140138222
    Abstract: A button device comprises: a circuit board; a tact switch disposed on the circuit board, wherein the tact switch has a pressed surface; a light source disposed on the circuit board; and a resilient button capable of sliding relative to the circuit board. The resilient button includes a pressed portion having a projection surface and a light guide column connected to the pressed portion and directing light toward the projection surface. The light guide column includes a light receiving surface facing the light source with a certain distance apart and a touchable portion apart from the pressed surface with a certain distance used for touching the tact switch.
    Type: Application
    Filed: May 14, 2013
    Publication date: May 22, 2014
    Applicant: GEMTEK TECHNOLOGY CO., LTD.
    Inventors: Wei Chia Huang, Chih Jung Kao, Hu Chi Chang
  • Publication number: 20130323530
    Abstract: An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and magnesium. The metal substrate is composed of a main component and an additive. The main component is tin-zinc alloy and the additive is selected from bismuth, indium, silver, copper or their combinations. The active solder enables targets and backing plates to be joined with each other directly in the atmosphere. The target is ceramic or aluminum with low wetting properties. The bonding temperature of the active solder ranges from 150° C. to 200° C. so that the problem of thermal stress can be avoided.
    Type: Application
    Filed: August 7, 2013
    Publication date: December 5, 2013
    Applicant: NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Shih-Ying CHANG, Lung-Chuan TSAO, Tung-Han CHUANG, Yen-Huan LEI, Cheng-Kai LI, Wei-Chia HUANG
  • Publication number: 20130214102
    Abstract: A power rail assembly includes a base, a bracket, a guiding member, a sliding seat, a screw member, a screw rod, and a driving motor. The base includes a top surface and a bottom surface. The bracket is disposed on the top surface vertically. The guiding member is disposed on the bracket and provides two guiding slots. The sliding seat includes a connection portion and two sliding portions. The two sliding portions protrude outwardly on the connection portion and embed into the two guiding slots respectively, so that the sliding set is movably disposed on the guiding member. The screw member is fixed on the connection portion and provides a screwing trough. The screw rod is disposed in an accommodating portion of the bracket and passes through the screwing trough, so that the screw member is engaged with the screw rod. The driving motor is fixed on the bracket.
    Type: Application
    Filed: August 1, 2012
    Publication date: August 22, 2013
    Applicant: Wistron Corporation
    Inventors: Wei-Chia HUANG, You-Gang WONG
  • Publication number: 20130029178
    Abstract: An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and magnesium. The metal substrate is composed of a main component and an additive. The main component is tin-zinc alloy and the additive is selected from bismuth, indium, silver, copper or their combinations. The active solder enables targets and backing plates to be joined with each other directly in the atmosphere. The target is ceramic or aluminum with low wetting properties. The bonding temperature of the active solder ranges from 150° C. to 200° C. so that the problem of thermal stress can be avoided.
    Type: Application
    Filed: July 27, 2011
    Publication date: January 31, 2013
    Inventors: Shih-Ying CHANG, Lung-Chuan Tsao, Tung-Han Chuang, Yen-Huan Lei, Cheng-Kai Li, Wei-Chia Huang
  • Publication number: 20100102958
    Abstract: An object tracking and locating device includes two or more identical units each having a receiving/transmitting module coupled to an antenna member for receiving and transmitting signals, a ZigBee wireless transmission module coupled to the receiving/transmitting module for processing the signals, and an alarm device coupled to the ZigBee wireless transmission module for generating a signal to indicate the spacing distance and the direction between the units, and the two or more identical units may be easily and quickly manufactured with a simplified manufacturing procedure and a reduced or decreased manufacturing cost.
    Type: Application
    Filed: October 29, 2008
    Publication date: April 29, 2010
    Inventors: Ie Sen Chen, Chih Nung Chen, Wei Chia Huang
  • Publication number: 20100015026
    Abstract: A method of preparing channel-type mesoporous material with an elliptical pore section is described. An alkaline solution containing two surfactants different in the electronic properties of their hydrophilic groups is prepared. A silica precursor is added to form a stack of rod-like micelles each having an elliptical section with the silica precursor between the rod-like micelles. The silica precursor is reacted into a silica framework. The rod-like micelles are removed from the silica framework.
    Type: Application
    Filed: July 17, 2008
    Publication date: January 21, 2010
    Applicant: National Tsing Hua University
    Inventors: Chia-Min Yang, Ching-Yi Lin, Wei-Chia Huang, Li-Lin Chang
  • Publication number: 20100015027
    Abstract: A channel-type mesoporous material with an elliptical pore section has a 2D-rectangular pore arrangement. Besides, the channel-type mesoporous material includes silica and has a unit cell ratio a/b satisfying the inequality of ?{square root over (3)}<a/b?2.85. The synthesis procedure can be easily applied to prepare functional mesoporous silica materials, and examples given in this application are the syntheses of cyanoethyl-functionalized and mercaptopropyl-functionalized mesoporous materials with a c2mm symmetry. The mesoporous materials discussed herein have great potential for various advanced applications in the fields of catalysis, selective adsorption, controlled drug delivery and release, and many of other applications.
    Type: Application
    Filed: June 19, 2009
    Publication date: January 21, 2010
    Applicant: National Tsing Hua University
    Inventors: Chia-Min Yang, Ching-Yi Lin, Wei-Chia Huang, Li-Lin Chang
  • Patent number: 7630203
    Abstract: An IC card includes an opening formed in a bottom portion of a casing, a circuit board engaged into the casing, one or more batteries attached to the circuit board and received in the opening of the casing for reducing the thickness of the IC card, a processor and an antenna member are attached to the circuit board and electrically coupled together, and a cover member is attached to the casing and engaged onto the circuit board for shielding the circuit board and for retaining the circuit board in the casing, and the cover member includes a lid aligned with the batteries and openable to expose the batteries and to allow the batteries to be changed with a new one when the batteries have been consumed.
    Type: Grant
    Filed: September 17, 2008
    Date of Patent: December 8, 2009
    Assignee: Ardi Technology Corporation
    Inventors: Ie Sen Chen, Chih Nung Chen, Wei Chia Huang
  • Patent number: 7066678
    Abstract: A locking method and device applicable to lock a linearly retractable device includes a locking plate in a first direction and a second direction perpendicular to each other. In the first direction, the locking plate is movable in a release position and a safety position. In the second element, the locking plate is movable in a latched and an unlatched position. When the locking plate is in the safety position, it is unmovable from the latched position to the unlatched position so as to prevent any unintentional force to release the lock.
    Type: Grant
    Filed: November 18, 2003
    Date of Patent: June 27, 2006
    Assignee: Lite-On Technology Corporation
    Inventor: Wei-Chia Huang
  • Publication number: 20050117965
    Abstract: A locking method and device applicable to lock a linearly retractable device includes a locking plate in a first direction and a second direction perpendicular to each other. In the first direction, the locking plate is movable in a release position and a safety position. In the second element, the locking plate is movable in a latched and an unlatched position. When the locking plate is in the safety position, it is unmovable from the latched position to the unlatched position so as to prevent any unintentional force to release the lock.
    Type: Application
    Filed: November 18, 2003
    Publication date: June 2, 2005
    Inventor: Wei-Chia Huang