Patents by Inventor Wei-Chieh Chou

Wei-Chieh Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9043171
    Abstract: A method for calculating efficiency of a power supply system includes: displaying a parameter selection interface on the display unit for selecting power supply parameters and transmission line parameters. Obtaining power supply parameters and transmission line parameters selected by the user via the parameter selection interface when determining the user has finished the selection. Determining a efficiency of a selected power supply of the power supply parameters according to the relationship table, and calculating a sum efficiency according to the obtained power supply parameters and the transmission line parameters and the efficiency of the selected power supply. And calculating a total efficiency of the power supply system according to each sum efficiency when determining that all of the power supplies of the power supply system have been selected.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: May 26, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Tsung-Sheng Huang, Chun-Jen Chen, Duen-Yi Ho, Wei-Chieh Chou
  • Publication number: 20140337704
    Abstract: A system and a method for converting between data formats converts air flow data from a thermal simulation tool into a format readable by a DC power analyzing tool. Air flow data associated with the locations of certain points on a printed circuit board are taken and an EXCEL document including Main, Data, and Final worksheets is created. The data to be converted is obtained, and the data imported into the Data worksheet. Parameters in the Main worksheet to set an analysis area of the printed circuit board are set, and air flow data associated with the analysis areas from the Data worksheet are obtained and divided into groups, according to the parameters set in the Main worksheet. An equivalence value for each group of data is calculated and the equivalence values are saved in the Final worksheet for reading by the DC power analyzing tool.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 13, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHAO-YOU TANG, PO-CHUAN HSIEH, WEI-CHIEH CHOU
  • Publication number: 20140303920
    Abstract: A system and a method for ESD testing are contained in an ESD testing system which is running on an electronic device. A storage unit of the electronic device pre-stores a layout file which includes a layout pattern having electrical traces, an ESD entry point, and mounted positions of multiple electronic elements. The ESD testing method obtains the layout file from the storage unit; displays the layout pattern on a display unit of the electronic device, simulates ESD in the ESD entry point of the displayed layout pattern, tests electrical characteristics of the electrical traces between the ESD entry point and the mounted positions of multiple electronic elements to determine whether the electrical characteristics of the electrical traces pass or fail the ESD test, and marks the electrical traces which fail the ESD test on the displayed layout pattern.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 9, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: WEI-CHIEH CHOU, YING-TSO LAI, EN-SHUO CHANG, CHUN-JEN CHEN
  • Patent number: 8581563
    Abstract: A power supply device includes a power supply unit and a feedback control unit. The power supply unit is configured for generating an electric potential to be provided to a load. The feedback control unit detects the electric potential and adjusts relevant parameters of the electrical potential to achieve predetermined values. The feedback control unit includes a first feedback circuit and a second feedback circuit electrically connected in series.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: November 12, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Wei-Chieh Chou, Duen-Yi Ho, Chun-Jen Chen, Tsung-Sheng Huang
  • Publication number: 20130284508
    Abstract: A printed circuit board (PCB) includes a power layer and a signal layer. A signal line is arranged on the signal layer. A power via extends through the power layer and the signal layer, and is electrically connected to the power layer and the signal layer. A number of through holes is defined in the PCB, through the power layer and the signal layer, and arranged between the signal line and the power via. The through holes are insulated from the power via. The inside wall of the power via is made of conductive material.
    Type: Application
    Filed: August 1, 2012
    Publication date: October 31, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: WEI-CHIEH CHOU, CHUN-JEN CHEN, DUEN-YI HO, TSUNG-SHENG HUANG, PO-CHUAN HSIEH, CHUN-NENG LIAO
  • Publication number: 20130204558
    Abstract: A method for calculating efficiency of a power supply system includes: displaying a parameter selection interface on the display unit for selecting power supply parameters and transmission line parameters. Obtaining power supply parameters and transmission line parameters selected by the user via the parameter selection interface when determining the user has finished the selection. Determining a efficiency of a selected power supply of the power supply parameters according to the relationship table, and calculating a sum efficiency according to the obtained power supply parameters and the transmission line parameters and the efficiency of the selected power supply. And calculating a total efficiency of the power supply system according to each sum efficiency when determining that all of the power supplies of the power supply system have been selected.
    Type: Application
    Filed: August 28, 2012
    Publication date: August 8, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: TSUNG-SHENG HUANG, CHUN-JEN CHEN, DUEN-YI HO, WEI-CHIEH CHOU
  • Patent number: 8464201
    Abstract: An electronic device reads a layout file of a printed circuit board (PCB) to be manufactured from a storage device, obtains length information and section area information of copper cladding distributed on power source areas and ground trace areas in each of one or more layers of the PCB to be manufactured by analyzing the layout file, and calculates power loss in each of the one or more layers according to the length information, the section area information, a resistance value of the copper cladding, and preset parameters of a power supply module and an integrated circuit (IC) load to be located on the PCB. In response to a determination that the power loss in the layer exceeds a preset range, the electronic device indicates the locations of the power source areas and the ground trace areas of a layer in the PCB layout file which need to be redesigned.
    Type: Grant
    Filed: April 7, 2012
    Date of Patent: June 11, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Tsung-Sheng Huang, Chun-Jen Chen, Duen-Yi Ho, Wei-Chieh Chou, Shin-Ting Yen
  • Patent number: 8451615
    Abstract: A printed circuit board includes a top layer and a bottom layer. A power supply and an electronic component are located on the top layer. The power supply is connected to the top layer and the bottom layer through a first via. A number of second vias extends through the top layer and the bottom layer, and is electrically connected to the top layer and the bottom layer. A right-angled triangular void area without vias defined therein is formed on the printed circuit board, between the second vias and the electronic component. The second vias are arranged on a hypotenuse of the void area.
    Type: Grant
    Filed: April 15, 2011
    Date of Patent: May 28, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Tsung-Sheng Huang, Chun-Jen Chen, Duen-Yi Ho, Wei-Chieh Chou
  • Patent number: 8436681
    Abstract: A voltage regulating circuit includes a pulse width modulation controller, a current sense circuit, a voltage feedback circuit, and a gain-and-bias circuit. The current sense circuit includes an inductor and a capacitor. The voltage feedback circuit includes first and second resistors. The gain-and-bias circuit includes an operational amplifier. A first terminal of the capacitor is connected to an inverting input terminal of the operational amplifier through a third resistor. A second terminal of the capacitor is connected to a non-inverting input terminal of the operational amplifier through a fourth resistor. The inverting input terminal of the amplifier is connected to an output terminal of the operational amplifier through a fifth resistor. The non-inverting input terminal of the operational amplifier is grounded through a sixth resistor. The output terminal of the operational amplifier is connected to the node between the first and second resistors through a seventh resistor.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: May 7, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Duen-Yi Ho, Chun-Jen Chen, Wei-Chieh Chou, Tsung-Sheng Huang
  • Publication number: 20130070410
    Abstract: A computer system includes a motherboard with first and second storage device interfaces and first to third memory slots, and first to third serial advanced technology attachment dual-in-line memory modules (SATA DIMMs). First and second extending boards are extended from two opposite ends of each SATA DIMM, arranged with first and second edge connectors, respectively. The first edge connector of the first SATA DIMM is connected to the first storage device interface. The second edge connector of the first SATA DIMM is connected to the first edge connector of the second SATA DIMM. The second edge connector of the second SATA DIMM is connected to the first edge connector of the third SATA DIMM. The second edge connector of the third SATA DIMM is connected to the second storage device interface.
    Type: Application
    Filed: October 12, 2011
    Publication date: March 21, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YUNG-CHIEH CHEN, SHOU-KUO HSU, CHIH-CHUNG SHIH, HSIEN-CHUAN LIANG, WEI-CHIEH CHOU, CHUN-HSIEN TSAI
  • Patent number: 8383955
    Abstract: A printed circuit board (PCB) includes first to fourth layers. A power supply is arranged on the first layer. An electronic component is arranged on the fourth layer. A first via and a second via extend through the PCB and are electrically connected to the electronic component. The PCB further includes third to seventh vias. A length of a transmission path of the current flows from the power supply to electronic component through the third via and the seventh via is almost the same as a length of a transmission path of the current flows from the power supply to the electronic component through the fourth to sixth vias.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: February 26, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Tsung-Sheng Huang, Chun-Jen Chen, Duen-Yi Ho, Wei-Chieh Chou
  • Publication number: 20130007690
    Abstract: An electronic device reads a layout file of a printed circuit board (PCB) to be manufactured from a storage device, obtains length information and section area information of copper cladding distributed on power source areas and ground trace areas in each of one or more layers of the PCB to be manufactured by analyzing the layout file, and calculates power loss in each of the one or more layers according to the length information, the section area information, a resistance value of the copper cladding, and preset parameters of a power supply module and an integrated circuit (IC) load to be located on the PCB. In response to a determination that the power loss in the layer exceeds a preset range, the electronic device indicates the locations of the power source areas and the ground trace areas of a layer in the PCB layout file which need to be redesigned.
    Type: Application
    Filed: April 7, 2012
    Publication date: January 3, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: TSUNG-SHENG HUANG, CHUN-JEN CHEN, DUEN-YI HO, WEI-CHIEH CHOU, SHIN-TING YEN
  • Publication number: 20120314391
    Abstract: A circuit board includes a base board defining a number of via holes, a power supply connection unit, a load connection unit, and at least one capacitor connection unit(s). Each of the at least one capacitor connection unit(s) includes two capacitor connectors, and one of the two capacitor connectors is positioned nearer to the power supply connection unit and farther away from the load connection unit than the other. The via holes are divided into at least one group(s) corresponding to each of the capacitor connection unit(s), and all of the via holes in each of the group(s) are equidistantly positioned along a semicircle arc surrounding the capacitor connector of the capacitor connection unit corresponding to the group that is positioned nearer to the power supply connection unit.
    Type: Application
    Filed: July 15, 2011
    Publication date: December 13, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: TSUNG-SHENG HUANG, CHUN-JEN CHEN, DUEN-YI HO, WEI-CHIEH CHOU
  • Publication number: 20120292090
    Abstract: A printed circuit board (PCB) comprising a first circuit area, a second circuit area, a plurality of connecting elements, and a plurality of connecting terminals placed on the first circuit area, wherein the first circuit area are electrically connected to the second circuit area through the plurality of connecting elements, the plurality of connecting elements are arranged in sequence to extend toward the plurality of connecting terminals, to form shortest current paths from the second circuit area via corresponding one of the connecting elements to the connecting terminals, respectively, and each shortest current path between the corresponding one of the connecting elements and the corresponding one of the connecting terminals is uncoated with conductive material.
    Type: Application
    Filed: June 22, 2011
    Publication date: November 22, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: TSUNG-SHENG HUANG, CHUN-JEN CHEN, DUEN-YI HO, WEI-CHIEH CHOU
  • Publication number: 20120268086
    Abstract: A power supply device includes a power supply unit and a feedback control unit. The power supply unit is configured for generating an electric potential to be provided to a load. The feedback control unit detects the electric potential and adjusts relevant parameters of the electrical potential to achieve predetermined values. The feedback control unit includes a first feedback circuit and a second feedback circuit electrically connected in series.
    Type: Application
    Filed: December 30, 2011
    Publication date: October 25, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: WEI-CHIEH CHOU, DUEN-YI HO, CHUN-JEN CHEN, TSUNG-SHENG HUANG
  • Patent number: 8294035
    Abstract: A printed circuit board (PCB) can prevent electrostatic discharge. A number of vias are embedded in the PCB. A circular insulated member is disposed between each via and the number of vias. Each via includes a layer of metal coated on an inner wall of a corresponding insulated member and a through hole bounded by the corresponding insulated member. An acute angle between two tangents which pass through a point of intersection of two overlapped insulated members is greater than twenty degrees.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: October 23, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Wei-Chieh Chou, Chun-Jen Chen, Duen-Yi Ho, Tsung-Sheng Huang
  • Publication number: 20120261175
    Abstract: A printed circuit board includes a first circuit area, a second circuit area, a plurality of connectors, and a connecting terminal. The first circuit area is electrically connected to the second circuit area via the connectors. The connecting terminal is placed on one side of the first circuit area for electrically connecting with a load. An imaginary center line of the connecting terminal is perpendicular to the one side of the printed circuit board. The less a horizontal distance between the center line of connecting terminal and one of the connectors, the larger a vertical distance between the side of the printed circuit board and the one of the connector.
    Type: Application
    Filed: June 9, 2011
    Publication date: October 18, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: TSUNG-SHENG HUANG, CHUN-JEN CHEN, DUEN-YI HO, WEI-CHIEH CHOU
  • Patent number: 8283571
    Abstract: A printed circuit board includes a signal layer, a dielectric layer, and a reference layer. The signal layer includes a pair of differential signal lines. The dielectric layer is sandwiched between the signal layer and the reference layer. A first void is defined in the reference layer between projections of the pair of differential signal lines. Two second voids are defined in the reference layer at opposite sides of the projections of the pair of differential signal lines.
    Type: Grant
    Filed: May 31, 2010
    Date of Patent: October 9, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ying-Tso Lai, Yung-Chieh Chen, Chun-Jen Chen, Wei-Chieh Chou
  • Publication number: 20120241207
    Abstract: A printed circuit board (PCB) includes first to fourth layers. A power supply is arranged on the first layer. An electronic component is arranged on the fourth layer. A first via and a second via extend through the PCB and are electrically connected to the electronic component. The PCB further includes third to seventh vias. A length of a transmission path of the current flows from the power supply to electronic component through the third via and the seventh via is almost the same as a length of a transmission path of the current flows from the power supply to the electronic component through the fourth to sixth vias.
    Type: Application
    Filed: April 29, 2011
    Publication date: September 27, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: TSUNG-SHENG HUANG, CHUN-JEN CHEN, DUEN-YI HO, WEI-CHIEH CHOU
  • Publication number: 20120243194
    Abstract: A printed circuit board includes a top layer and a bottom layer. A power supply and an electronic component are located on the top layer. The power supply is connected to the top layer and the bottom layer through a first via. A number of second vias extends through the top layer and the bottom layer, and is electrically connected to the top layer and the bottom layer. A right-angled triangular void area without vias defined therein is formed on the printed circuit board, between the second vias and the electronic component. The second vias are arranged on a hypotenuse of the void area.
    Type: Application
    Filed: April 15, 2011
    Publication date: September 27, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: TSUNG-SHENG HUANG, CHUN-JEN CHEN, DUEN-YI HO, WEI-CHIEH CHOU