Abstract: A printed circuit board (PCB) comprising a first circuit area, a second circuit area, a plurality of connecting elements, and a plurality of connecting terminals placed on the first circuit area, wherein the first circuit area are electrically connected to the second circuit area through the plurality of connecting elements, the plurality of connecting elements are arranged in sequence to extend toward the plurality of connecting terminals, to form shortest current paths from the second circuit area via corresponding one of the connecting elements to the connecting terminals, respectively, and each shortest current path between the corresponding one of the connecting elements and the corresponding one of the connecting terminals is uncoated with conductive material.

Abstract: A power supply device includes a power supply unit and a feedback control unit. The power supply unit is configured for generating an electric potential to be provided to a load. The feedback control unit detects the electric potential and adjusts relevant parameters of the electrical potential to achieve predetermined values. The feedback control unit includes a first feedback circuit and a second feedback circuit electrically connected in series.

Abstract: A printed circuit board (PCB) can prevent electrostatic discharge. A number of vias are embedded in the PCB. A circular insulated member is disposed between each via and the number of vias. Each via includes a layer of metal coated on an inner wall of a corresponding insulated member and a through hole bounded by the corresponding insulated member. An acute angle between two tangents which pass through a point of intersection of two overlapped insulated members is greater than twenty degrees.

Abstract: A printed circuit board includes a first circuit area, a second circuit area, a plurality of connectors, and a connecting terminal. The first circuit area is electrically connected to the second circuit area via the connectors. The connecting terminal is placed on one side of the first circuit area for electrically connecting with a load. An imaginary center line of the connecting terminal is perpendicular to the one side of the printed circuit board. The less a horizontal distance between the center line of connecting terminal and one of the connectors, the larger a vertical distance between the side of the printed circuit board and the one of the connector.

Abstract: A printed circuit board includes a signal layer, a dielectric layer, and a reference layer. The signal layer includes a pair of differential signal lines. The dielectric layer is sandwiched between the signal layer and the reference layer. A first void is defined in the reference layer between projections of the pair of differential signal lines. Two second voids are defined in the reference layer at opposite sides of the projections of the pair of differential signal lines.

Abstract: A printed circuit board includes a top layer and a bottom layer. A power supply and an electronic component are located on the top layer. The power supply is connected to the top layer and the bottom layer through a first via. A number of second vias extends through the top layer and the bottom layer, and is electrically connected to the top layer and the bottom layer. A right-angled triangular void area without vias defined therein is formed on the printed circuit board, between the second vias and the electronic component. The second vias are arranged on a hypotenuse of the void area.

Abstract: A printed circuit board (PCB) includes first to fourth layers. A power supply is arranged on the first layer. An electronic component is arranged on the fourth layer. A first via and a second via extend through the PCB and are electrically connected to the electronic component. The PCB further includes third to seventh vias. A length of a transmission path of the current flows from the power supply to electronic component through the third via and the seventh via is almost the same as a length of a transmission path of the current flows from the power supply to the electronic component through the fourth to sixth vias.

Abstract: An exemplary antistatic circuit board includes a first outer layer, a second outer layer, a first ground layer, and a second ground layer. The first ground layer and the second ground layer are positioned between the first outer layer and the second outer layer. The first ground layer is adjacent to the first outer layer and the second ground layer is adjacent to the second outer layer. The antistatic circuit board defines two position holes each penetrating through the first ground layer and the second ground layer. Two circuit grounds are wired on the first ground layer and the second ground layer, respectively. The second ground layer further includes a chassis ground. Each of the position holes also penetrates through the chassis ground.

Abstract: A system for optimizing a current overload protection circuit includes an input device, a data storage device, a central processing device, and a display. The central processing device includes a storage module, a control module, and a calculation module. The storage module stores a VI application therein. The control module receives instructions from the input device and selects virtual electronic components of the current overload protection circuit from the data storage device and connection of the selected electronic components. The current overload protection circuit is completed and run in the VI application; electronic components significantly affecting the maximum protection current are labeled. The calculation module calculates normal distribution samples of the current overload protection circuit based on the labeled electronic components. The display shows whether the current overload protection circuit meets a process capability standard.

Abstract: A system and method that can analyze a temperature rise of a printed circuit board (PCB). The system and method receives attribute parameters of the PCB from an input device, and generates a temperature rise formula according to the received attribute parameters. Additionally, the system and method calculates a temperature rise of a local area surrounding each component on the PCB according to the temperature rise formula.

Abstract: A voltage regulating circuit includes a pulse width modulation controller, a current sense circuit, a voltage feedback circuit, and a gain-and-bias circuit. The current sense circuit includes an inductor and a capacitor. The voltage feedback circuit includes first and second resistors. The gain-and-bias circuit includes an operational amplifier. A first terminal of the capacitor is connected to an inverting input terminal of the operational amplifier through a third resistor. A second terminal of the capacitor is connected to a non-inverting input terminal of the operational amplifier through a fourth resistor. The inverting input terminal of the amplifier is connected to an output terminal of the operational amplifier through a fifth resistor. The non-inverting input terminal of the operational amplifier is grounded through a sixth resistor. The output terminal of the operational amplifier is connected to the node between the first and second resistors through a seventh resistor.

Abstract: A printed circuit board includes a plurality of power layers. Each power layer defining a number of vias arranged in a number of rows. The number of the power layers is N (N>3). The power layers are defined as a 1st, 2nd, . . . , Nth power layer. The vias of the 1st power layer are connected to other power layers by a step-shaped connection means.

Abstract: A printed circuit board includes a signal layer, a dielectric layer, and a reference layer. The signal layer includes a pair of differential signal lines. The dielectric layer is sandwiched between the signal layer and the reference layer. A first void is defined in the reference layer between projections of the pair of differential signal lines. Two second voids are defined in the reference layer at opposite sides of the projections of the pair of differential signal lines.

Abstract: A system for optimizing a current overload protection circuit includes an input device, a data storage device, a central processing device, and a display. The central processing device includes a storage module, a control module, and a calculation module. The storage module stores a VI application therein. The control module receives instructions from the input device and selects virtual electronic components of the current overload protection circuit from the data storage device and connection of the selected electronic components. The current overload protection circuit is completed and run in the VI application; electronic components significantly affecting the maximum protection current are labeled. The calculation module calculates normal distribution samples of the current overload protection circuit based on the labeled electronic components. The display shows whether the current overload protection circuit meets a process capability standard.

Abstract: A printed circuit board (PCB) can prevent electrostatic discharge. A number of vias are embedded in the PCB. A circular insulated member is disposed between each via and the number of vias. Each via includes a layer of metal coated on an inner wall of a corresponding insulated member and a through hole bounded by the corresponding insulated member. An acute angle between two tangents which pass through a point of intersection of two overlapped insulated members is greater than twenty degrees.

Abstract: A system and method that can analyze a temperature rise of a printed circuit board (PCB). The system and method receives attribute parameters of the PCB from an input device, and generates a temperature rise formula according to the received attribute parameters. Additionally, the system and method calculates a temperature rise of a local area surrounding each component on the PCB according to the temperature rise formula.