Abstract: Among other things, one or more techniques for enhancing device (e.g., transistor) performance are provided herein. In one embodiment, device performance is enhanced by forming an extended dummy region at an edge of a region of a device and forming an active region at a non-edge of the region. Limitations associated with semiconductor fabrication processing present in the extended dummy region more so than in non-edge regions. Accordingly, a device exhibiting enhanced performance is formed by connecting a gate to the active region, where the active region has a desired profile because it is comprised within a non-edge of the region. A dummy device (e.g., that may be less responsive) may be formed to include the extended dummy region, where the extended dummy region has a less than desired profile due to limitations associated with semiconductor fabrication processing, for example.

Abstract: Among other things, one or more techniques for enhancing device (e.g., transistor) performance are provided herein. In one embodiment, device performance is enhanced by forming an extended dummy region at an edge of a region of a device and forming an active region at a non-edge of the region. Limitations associated with semiconductor fabrication processing present in the extended dummy region more so than in non-edge regions. Accordingly, a device exhibiting enhanced performance is formed by connecting a gate to the active region, where the active region has a desired profile because it is comprised within a non-edge of the region. A dummy device (e.g., that may be less responsive) may be formed to include the extended dummy region, where the extended dummy region has a less than desired profile due to limitations associated with semiconductor fabrication processing, for example.

Abstract: Some embodiments relate to a flip-flop having a data input terminal, a data output terminal and a clock terminal. The flip-flop includes a master latch, a slave latch, and an isolation element coupled between the master latch output and slave latch. The isolation element is arranged to isolate capacitive loading seen by the output of the master latch that comes from the slave latch. In some embodiments, the master latch includes one or more drive enhancement elements on its feedforward and feedback paths. The slave latch can also include one or more drive enhancement elements on its feedforward and feedback paths. These drive enhancement elements, particularly in combination with the isolation element, may help to reduce the setup and hold times and enhance meta-stability resistance of the flip-flop relative to conventional implementations. Other embodiments are also disclosed.

Abstract: A fully on-chip temperature, process, and voltage sensor includes a voltage sensor, a process sensor and a temperature sensor. The temperature sensor includes a bias current generator, a ring oscillator, a fixed pulse generator, an AND gate, and a first counter. The bias current generator generates an output current related to temperature according to the operating voltage of chip. The ring oscillator generates an oscillation signal according to the output current. The fixed pulse generator generates a fixed pulse signal. The AND gate is connected to the ring oscillator and the fixed pulse generator for performing a logic AND operation on the oscillation signal and the fixed pulse signal, and generating a temperature sensor signal.

Abstract: A solar power management system is provided for managing electric energy conversion by a photovoltaic cell module, supplying the converted electric energy to an external load, and storing the converted electric energy in a battery. The solar power management system comprises a multiphase maximum power tracking (MPT) module, a charging circuit, and a voltage conversion module. The multiphase MPT module regulates output current of the photovoltaic cell module to output maximum power within the high limit thereof and obtain improved solar energy conversion efficiency. The voltage conversion module converts the electric energy generated by the photovoltaic cell module into different voltage formats, such as 5.6V DC, 1.0V DC, 0.6˜0.3V DC low voltage, or ?1.2V DC negative voltage, to meet different external load requirements. The solar power management system has simple circuitry and can be configured as a system on chip (SoC) at reduced cost while provides very wide applications.

Abstract: A fully on-chip temperature, process, and voltage sensor includes a voltage sensor, a process sensor and a temperature sensor. The temperature sensor includes a bias current generator, a ring oscillator, a fixed pulse generator, an AND gate, and a first counter. The bias current generator generates an output current related to temperature according to the operating voltage of chip. The ring oscillator generates an oscillation signal according to the output current. The fixed pulse generator generates a fixed pulse signal. The AND gate is connected to the ring oscillator and the fixed pulse generator for performing a logic AND operation on the oscillation signal and the fixed pulse signal, and generating a temperature sensor signal.

Abstract: A charge pump is disclosed for amplifying an input voltage received at an input end and outputting the amplified voltage at an output end as an output voltage. The charge pump includes a plurality of source/drain coupling transistors for serving as charging capacitors, and a plurality of cascode-connected transistors being symmetrically connected to between the input end and the output end. The charge pump further includes a plurality of diode-connected transistors to protect the source/drain coupling transistors against breakdown during the course of charge transfer and to speed up the charge transfer.

Abstract: A charge pump is disclosed for amplifying an input voltage received at an input end and outputting the amplified voltage at an output end as an output voltage. The charge pump includes a plurality of source/drain coupling transistors for serving as charging capacitors, and a plurality of cascode-connected transistors being symmetrically connected to between the input end and the output end. The charge pump further includes a plurality of diode-connected transistors to protect the source/drain coupling transistors against breakdown during the course of charge transfer and to speed up the charge transfer.

Abstract: A solar power management system is provided for managing electric energy conversion by a photovoltaic cell module, supplying the converted electric energy to an external load, and storing the converted electric energy in a battery. The solar power management system comprises a multiphase maximum power tracking (MPT) module, a charging circuit, and a voltage conversion module. The multiphase MPT module regulates output current of the photovoltaic cell module to output maximum power within the high limit thereof and obtain improved solar energy conversion efficiency. The voltage conversion module converts the electric energy generated by the photovoltaic cell module into different voltage formats, such as 5.6V DC, 1.0V DC, 0.6˜0.3V DC low voltage, or ?1.2V DC negative voltage, to meet different external load requirements. The solar power management system has simple circuitry and can be configured as a system on chip (SoC) at reduced cost while provides very wide applications.

Abstract: The present invention provides a self-aware power control system and a method for determining the circuit state. The self-aware adaptive power control architecture comprises of a multi-mode power gating network, a current monitoring translator, a variable threshold comparator, a slack detector, and a bi-directional shift register. The multi-mode power gating network controls the amount of supply current and hence the circuit speed. The power gating network can be composed of either N-type MOSFETs for virtual ground insertion or P-type MOSFETs for virtual supply insertion. The number of MOSFETs in the multi-mode power gating network can be configured according to the supply range and step difference of the supply current. Then, by monitoring the current characteristics drained by target circuit, the circuit state can be determined. No delay matching circuit is required. Together with other peripherals, the supply current can be down controlled to a minimum acceptable level.