Abstract: This invention is a rewritable near-field optical medium using a zinc oxide nano-structured thin film as the localized near-field interaction layer. This rewritable near-field optical medium is a multilayered body at least comprising: (a) a substrate of transparent material; (b) a first protective and spacer layer formed on one surface of the substrate, which is made of transparent dielectric material; (c) a zinc oxide nano-structured thin film which is capable of causing localized near-field optical interactions; (d) a second protective and spacer layer formed on the localized near-field optical interaction layer, which is also made of transparent dielectric material; (e) a rewritable recording layer; (f) a third protective and spacer layer formed on the rewritable recording layer, which is also made of transparent dielectric material.

Abstract: A food processor includes a base, a lower cap, a blade unit and a top cap. The top cap has a fixed tube extending from an underside thereof and a sleeve is movably mounted to the fixed tube. A board is sandwiched between the sleeve and the blade disk of the blade unit so as to move the sleeve upward which then fixed to the fixed tube by an adhesive layer such that a gap with a fixed width is defined after the board is pulled away. The food can be cut into tiny particles and juice can be squeezed via the gap.

Abstract: A food, vegetables and fruit processor comprises a base having therein an operating motor, a lower cover, a cutting seat and an upper cover. Wherein the upper cover is provided with an inclined feed-in pipe extending downwardly therefrom, one end of the feed-in pipe forms on the surface of the upper cover a material inlet, the other end of the feed-in pipe forms a material outlet. Food, vegetables and fruit can be cast into the feed-in pipe, and are pressed tight with a material pushing plunger to render the food, vegetables and fruit to be perfectly and smoothly cut or ground in an energy saving mode. The present invention is applicable to using as a food, vegetables and fruit processor having the functions of squeezing juice and grinding food.

Abstract: A food and vegetable processing device includes a body with a motor so as to drive a processing unit which is attached by a lower cap with an outlet. A top cap is mounted to the lower cap and includes a feeding passage for feeding food and vegetable to the processing unit. The processing unit includes a blade disk, which has a convex top surface thereon cutting teeth are located. The convex top surface drives the food and vegetable to be processed move outward so as to obtain a satisfied result.

Abstract: A food, vegetables and fruit processor comprises a base having therein an operating motor, a lower cover, a cutting seat and an upper cover. Wherein the upper cover is provided with an inclined feed-in pipe extending downwardly therefrom, one end of the feed-in pipe forms on the surface of the upper cover a material inlet, the other end of the feed-in pipe forms a material outlet. Food, vegetables and fruit can be cast into the feed-in pipe, and are pressed tight with a material pushing plunger to render the food, vegetables and fruit to be perfectly and smoothly cut or ground in an energy saving mode. The present invention is applicable to using as a food, vegetables and fruit processor having the functions of squeezing juice and grinding food.

Abstract: A telecommunication system intended for providing telecommunication services at a semiconductor manufacturing plant under the circumstances of shielded areas of clean rooms comprises a GSM base station installed at the plant and equipped with a plurality of low power antennas, a private branch exchange and at least two dedicated lines of E1 type connecting the base station and the PBX to a public switched telephone network. Software incorporated in the base station and PBX allows for telecommunication connections set up at the plant to use abbreviated four-digit numbers for both wireless mobile stations and wired stations, while keeping the possibility to reach a mobile station, even if it is outside the plant at the time of the connection, dialing the abbreviated four-digit number.

Abstract: A fluidic oscillator includes an oscillator body having two attachment walls defining an oscillating chamber therebetween, an inlet duct communicatively extended from the oscillating chamber for guiding a flow of fluid entering into the oscillating chamber, an outlet duct communicatively extended from the oscillating chamber for guiding the flow of fluid exiting from the oscillating chamber, a flow splitter provided at the outlet duct to communicate with the oscillating chamber, and two feedback channels communicating with the oscillating chamber. Each of the attachment walls has an upstream portion and a downstream portion integrally extended therefrom as a step shouldering manner to form a modulating shoulder for modulating an oscillation of the flow within the oscillation chamber so as to stabilize the flow of the fluid to pass through the oscillator body.

Abstract: This invention is a rewritable near-field optical medium using a zinc oxide nano-structured thin film as the localized near-field interaction layer. This rewritable near-field optical medium is a multilayered body at least comprising: (a) a substrate of transparent material; (b) a first protective and spacer layer formed on one surface of the substrate, which Is made of transparent dielectric material; (c) a zinc oxide nano-structured thin film which is capable of causing localized near-field optical interactions; (d) a second protective and spacer layer formed on the localized near-field optical interaction layer, which is also made of transparent dielectric material; (e) a rewritable recording layer; (f) a third protective and spacer layer formed on the rewritable recording layer, which is also made of transparent dielectric material.

Abstract: A method for improving etch uniformity during a wet etching process is disclosed. The method comprises the steps of first rinsing the wafer to form a water film over the wafer surface, followed by liquid phase etching. The water film helps the subsequent viscous etchant to be spread across the wafer surface more uniformly to thereby improve the etch uniformity.